JPH0536304Y2 - - Google Patents

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Publication number
JPH0536304Y2
JPH0536304Y2 JP1986195039U JP19503986U JPH0536304Y2 JP H0536304 Y2 JPH0536304 Y2 JP H0536304Y2 JP 1986195039 U JP1986195039 U JP 1986195039U JP 19503986 U JP19503986 U JP 19503986U JP H0536304 Y2 JPH0536304 Y2 JP H0536304Y2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
chassis base
tongue
chassis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986195039U
Other languages
Japanese (ja)
Other versions
JPS6398691U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986195039U priority Critical patent/JPH0536304Y2/ja
Publication of JPS6398691U publication Critical patent/JPS6398691U/ja
Application granted granted Critical
Publication of JPH0536304Y2 publication Critical patent/JPH0536304Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【考案の詳細な説明】 産業上の利用分野 本考案はシヤーシベース取付構体に関し、詳し
くは電子チユーナ等に使用されるシヤーシベース
へのプリント基板の組付け構造に関するものであ
る。
[Detailed Description of the Invention] Industrial Application Field The present invention relates to a chassis base mounting structure, and more particularly to a structure for assembling a printed circuit board to a chassis base used in an electronic tuner or the like.

従来の技術 電子チユーナ等に使用されるシヤーシベース取
付構体Aは、第3図及び第4図に示すように金属
製の略矩形枠状のシヤーシベース1と、複数の電
子部品2,2…が実装されたプリント基板3とか
らなり、そのプリント基板3をシヤーシベース1
内に位置決めして収納配置する。このプリント基
板3の位置決めは、シヤーシベース1の一方の開
口端からプリント基板3を挿入し、上記シヤーシ
ベース1の内壁面の要所に設けられた突起4,4
…にプリント基板3の外周部を係止させることに
より行われる。このシヤーシベース1内に位置決
めされたプリント基板3の一方の面〔図では下
面〕の外周縁部には、第5図及び第6図に示すよ
うに接地用の導電パターン5が形成され、該導電
パターン5上に半田6を手作業或いは半田デイツ
プ処理等で供給することにより導電パターン5と
シヤーシベース1とを電気的且つ機械的に接続し
て上記導電パターン5を接地すると共に、プリン
ト基板3をシヤーシベース1に固定する。
BACKGROUND ART A chassis base mounting structure A used for an electronic tuner, etc., has a chassis base 1 made of metal in the shape of a substantially rectangular frame, and a plurality of electronic components 2, 2, . . . mounted thereon, as shown in FIGS. 3 and 4. The printed circuit board 3 is attached to the chassis base 1.
Position and store it inside. The printed circuit board 3 is positioned by inserting the printed circuit board 3 from one open end of the chassis base 1, and inserting the printed circuit board 3 into the chassis base 1 through projections 4, 4 provided at important points on the inner wall surface of the chassis base 1.
This is done by locking the outer periphery of the printed circuit board 3 with... As shown in FIGS. 5 and 6, a conductive pattern 5 for grounding is formed on the outer peripheral edge of one surface (lower surface in the figure) of the printed circuit board 3 positioned within the chassis base 1. By supplying solder 6 onto the pattern 5 manually or by a solder dip treatment, the conductive pattern 5 and the chassis base 1 are electrically and mechanically connected to ground the conductive pattern 5, and the printed circuit board 3 is connected to the chassis base 1. Fixed to 1.

考案が解決しようとする問題点 ところで、上記シヤーシベース取付構体Aで
は、プリント基板3をシヤーシベース1に固定す
ると共に、上記プリント基板3の導電パターン5
を接地するために上記導電パターン5上に供給さ
れた半田6の供給量が均一とはならず、多少のば
らつきが発生し易かつた。このように上記半田6
の供給量にばらつきがあると、プリント基板3の
シヤーシベース1に対する固定が不安定になつて
信頼性が大幅に低下する。また、電子チユーナ製
造における温度サイクル試験時、シヤーシベース
1とプリント基板3との熱膨張係数の違いにより
前記半田6にストレスが加わつて最終的にクラツ
クが発生するという虞があつた。
Problems to be Solved by the Invention Incidentally, in the chassis base mounting structure A, the printed circuit board 3 is fixed to the chassis base 1, and the conductive pattern 5 of the printed circuit board 3 is fixed to the chassis base 1.
The amount of solder 6 supplied onto the conductive pattern 5 for grounding was not uniform, and some variation was likely to occur. In this way, the above solder 6
If there is variation in the supply amount, the fixation of the printed circuit board 3 to the chassis base 1 becomes unstable, and reliability is significantly reduced. Furthermore, during a temperature cycle test in the manufacture of an electronic tuner, there was a fear that stress would be applied to the solder 6 due to the difference in thermal expansion coefficients between the chassis base 1 and the printed circuit board 3, eventually causing a crack.

そこで上記不具合を解消するための具体的手段
として、第7図乃至第9図に示すような構造を有
するシヤーシベース取付構体Bが提案されてい
る。これは、第7図に示すようにプリント基板3
の接地用導電パターン5と対応したシヤーシベー
ス1の要部に、上記プリント基板3の終端面を横
切る切欠き7を形成して舌片8を設ける。この舌
片8は、シヤーシベース1の切欠き7の周縁を延
設した幅狭の基端部8aと、該基端部8aから延
びる幅広の遊端部8bとからなる。前述したよう
にシヤーシベース1内にプリント基板3を位置決
め配置した状態で、第8図及び第9図に示すよう
に上記舌片8の遊端部8bをシヤーシベース1内
方へ折曲げてプリント基板3を仮固定する。この
時、プリント基板3に対してその下方で傾斜した
舌片8の遊端部8bは、プリント基板3の接地用
の導電パターン5と対向配置される。この状態で
半田デイツプ処理により半田を供給すれば、プリ
ント基板3の導電パターン5と舌片8の遊端部8
b間に定量の半田9が残存して上記導電パターン
5と舌片8の遊端部8bとが電気的且つ機械的に
接続される。これによりプリント基板3の導電パ
ターン5を接地すると共に、プリント基板3をシ
ヤーシベース1に本固定する。また、上記シヤー
シベース取付構体Bでは舌片8の遊端部8bをシ
ヤーシベース1内方へ折曲げる必要性があり、こ
の舌片8の折曲げ形成を容易にするため、第10
図及び第11図に示すシヤーシベース取付構体C
も提案されている。これは、第10図に示すよう
に、前記舌片8のプリント基板3の周縁エツジ部
mと対応する位置に、プリント基板3と略平行な
切込み10を設ける。これによりシヤーシベース
1内にプリント基板3を位置決め配置した状態
で、第11図に示すように舌片8の遊端部8bを
切込み10に沿つてシヤーシベース1内方へ容易
に折曲げるのが実現可能となる。
Therefore, as a specific means for solving the above problems, a chassis base mounting structure B having a structure as shown in FIGS. 7 to 9 has been proposed. This is the printed circuit board 3 as shown in FIG.
A tongue piece 8 is provided by forming a notch 7 that crosses the end surface of the printed circuit board 3 in a main part of the chassis base 1 corresponding to the grounding conductive pattern 5. The tongue piece 8 consists of a narrow base end 8a extending from the periphery of the notch 7 of the chassis base 1, and a wide free end 8b extending from the base end 8a. With the printed circuit board 3 positioned and arranged in the chassis base 1 as described above, the free end 8b of the tongue piece 8 is bent inward to the chassis base 1 as shown in FIGS. 8 and 9, and the printed circuit board 3 is removed. Temporarily fix. At this time, the free end portion 8b of the tongue piece 8 inclined below the printed circuit board 3 is arranged to face the grounding conductive pattern 5 of the printed circuit board 3. If solder is supplied by solder dip treatment in this state, the conductive pattern 5 of the printed circuit board 3 and the free end portion 8 of the tongue piece 8
A certain amount of solder 9 remains between the conductive patterns 5 and the free ends 8b of the tongues 8, thereby electrically and mechanically connecting them. As a result, the conductive pattern 5 of the printed circuit board 3 is grounded, and the printed circuit board 3 is permanently fixed to the chassis base 1. In addition, in the chassis base mounting structure B, it is necessary to bend the free end 8b of the tongue piece 8 inward to the chassis base 1, and in order to facilitate the bending of the tongue piece 8,
Chassis base mounting structure C shown in Figures and Figure 11
has also been proposed. As shown in FIG. 10, a notch 10 substantially parallel to the printed circuit board 3 is provided in the tongue piece 8 at a position corresponding to the peripheral edge portion m of the printed circuit board 3. This makes it possible to easily bend the free end 8b of the tongue piece 8 inward of the chassis base 1 along the notch 10, as shown in FIG. 11, with the printed circuit board 3 positioned within the chassis base 1. becomes.

ところが、上述したように舌片8でプリント基
板3をシヤーシベース1に仮固定すると共に、プ
リント基板3の外周部と舌片8とを半田付け一体
化したシヤーシベース取付構体B及びCでは、前
記舌片8をシヤーシベース1内方へ折曲げ形成す
るに際して、舌片8の遊端部8bを基端部8aの
根元部分を軸にしてシヤーシベース1内方へ押圧
する曲げ力により、舌片8の一部が当接するプリ
ント基板3の周縁エツジ部mに応力が作用する。
この場合、そのプリント基板3の周縁エツジ部m
と対応する上方位置には、切欠き7による舌片8
が形成されているためにプリント基板位置決め用
の突起4〔第3図及び第4図参照〕が存在しな
い。これにより上記応力がシヤーシベース1内側
の斜め上方へ作用するため、プリント基板3の外
周部が上方へ曲がつて上記プリント基板3に反り
が発生するという問題点があつた。
However, in the chassis base mounting structures B and C in which the printed circuit board 3 is temporarily fixed to the chassis base 1 by the tongue piece 8 as described above, and the tongue piece 8 is integrated with the outer peripheral part of the printed circuit board 3 by soldering, the tongue piece 8 is 8 inwardly into the chassis base 1, a portion of the tongue 8 is bent by a bending force that presses the free end 8b of the tongue 8 inward around the base end 8a around the root portion of the base end 8a. Stress is applied to the peripheral edge portion m of the printed circuit board 3, which is in contact with the printed circuit board 3.
In this case, the peripheral edge portion m of the printed circuit board 3
At the upper position corresponding to the tongue piece 8 formed by the notch 7
3, there is no protrusion 4 for positioning the printed circuit board (see FIGS. 3 and 4). As a result, the stress acts obliquely upward inside the chassis base 1, causing the problem that the outer peripheral portion of the printed circuit board 3 bends upward, causing the printed circuit board 3 to warp.

問題点を解決するための手段 本考案は、枠状金属シヤーシの一端よりシヤー
シ内方に延び、かつ、中間部が屈曲された先端部
分がシヤーシ内壁と平行に延び先端部にエンボス
を有する舌片を設けたシヤーシベースと、該舌片
の先端部と対応する位置に舌片挿入穴を設けたプ
リント基板とを具備し、舌片を上記挿入穴に挿入
して半田付け固定したことを特徴とする。
Means for Solving the Problems The present invention provides a tongue piece that extends inward from one end of a frame-shaped metal chassis, has a bent middle portion, extends parallel to the inner wall of the chassis, and has an embossed tip. and a printed circuit board having a tongue insertion hole at a position corresponding to the tip of the tongue, the tongue being inserted into the insertion hole and fixed by soldering. .

作 用 枠状シヤーシベースの舌片とプリント基板の挿
入方向が一致し、シヤーシベースはプリント基板
に載置されて支持されエンボスによつて仮保持さ
れる。
Function: The tongues of the frame-shaped chassis base and the printed circuit board are inserted in the same direction, and the chassis base is placed on and supported by the printed circuit board and temporarily held by the embossing.

実施例 本考案に係るシヤーシベース取付構体の一実施
例を第1図及び第2図を参照して以下説明する。
第4図及び第5図と同一参照符号は同一物を示
す。図において、1は金属製の略矩形状のシヤー
シベース、3は複数の電子部品が実装されたプリ
ント基板、11はシヤーシベース1の一端よりシ
ヤーシ内方に延びた舌片で、シヤーシベース1の
一端をプリント基板3の収納高さに応じて一定幅
だけ切欠いてその切欠き12の周部よりシヤーシ
内方に延設した幅狭の基端部11aと、該基端部
11aからシヤーシ軸内方に屈曲し先端部分が幅
広でその中央にエンボス11cを設けた屈曲部1
1bとからなる。13はプリント基板3上で上記
舌片11の屈曲部11bと対応する位置に設けら
れた舌片挿入穴である。
Embodiment An embodiment of the chassis base mounting structure according to the present invention will be described below with reference to FIGS. 1 and 2.
The same reference numerals as in FIGS. 4 and 5 indicate the same parts. In the figure, 1 is a nearly rectangular chassis base made of metal, 3 is a printed circuit board on which a plurality of electronic components are mounted, and 11 is a tongue piece extending inward from one end of the chassis base 1, and one end of the chassis base 1 is printed. A narrow base end 11a is cut out by a certain width according to the storage height of the board 3 and extends inward from the periphery of the notch 12 into the chassis, and a narrow base end 11a is bent inward from the base end 11a toward the chassis axis. The bent part 1 has a wide tip and has an embossment 11c in the center.
1b. 13 is a tongue insertion hole provided on the printed circuit board 3 at a position corresponding to the bent portion 11b of the tongue 11.

上記構成によれば、本考案のシヤーシベース取
付構体Dは、シヤーシベース1にプリント基板3
を収納・配置するに際し、まず舌片11の屈曲部
11bをプリント基板3の電子部品2〔第3図及
び第4図参照〕の取り付け側より舌片挿入穴13
に挿入する。そうすると、プリント基板3は基端
部11aにより係止して高さ位置が設定されると
共に屈曲部11bのエンボス11cとが舌片挿入
穴13に圧入されて係合し後述する下面からの半
田デイツプの際、シヤーシベース1が浮き上がら
ないようにする。この状態で上記電子部品2と共
に屈曲部11bを例えば噴流半田による半田デイ
ツプにて半田付けしてシヤーシベース1をプリン
ト基板3に本固定する。この時、半田供給量の制
御は不要で、しかも第2図に示すように、半田1
4は屈曲部11bの周辺に付着するため接合面積
が大きくなる。又、従来と同じく、電子チユーナ
製造における温度サイクル試験時等にもシヤーシ
ベース1とプリント基板3との熱膨張係数の違い
によるストレスが舌片11の幅狭な基端部11a
に吸収されて半田14にクラツクが生じない。
According to the above configuration, the chassis base mounting structure D of the present invention has a printed circuit board 3 mounted on the chassis base 1.
When storing and arranging the tongue piece 11, first insert the bent part 11b of the tongue piece 11 into the tongue piece insertion hole 13 from the mounting side of the electronic component 2 (see FIGS. 3 and 4) of the printed circuit board 3.
Insert into. Then, the printed circuit board 3 is locked by the base end 11a and the height position is set, and the embossing 11c of the bent part 11b is press-fitted and engaged with the tongue insertion hole 13, and a solder dip is formed from the bottom surface, which will be described later. When doing so, make sure that the chassis base 1 does not lift up. In this state, the chassis base 1 is permanently fixed to the printed circuit board 3 by soldering the bent portion 11b together with the electronic component 2 using a solder dip using jet soldering, for example. At this time, there is no need to control the solder supply amount, and as shown in Figure 2, the solder
4 is attached to the periphery of the bent portion 11b, so the bonding area becomes large. Also, as in the past, stress due to the difference in thermal expansion coefficient between the chassis base 1 and the printed circuit board 3 is applied to the narrow base end 11a of the tongue piece 11 during temperature cycle tests in electronic tuner manufacturing.
This prevents cracks from occurring in the solder 14.

考案の効果 本考案に係るシヤーシベース取付構体によれ
ば、シヤーシベースの一端より内方に延びると共
に先端部分がシヤーシ軸方向に屈曲した舌片を、
プリント基板の舌片挿入穴に挿入して半田付け固
定したから、半田付けまでの仮固定に舌片がプリ
ント基板の外周部を押圧せずプリント基板の変形
を排除できる。又、プリント基板の仮固定に要す
る工数も減り作業が簡略化され、更に舌片の半田
接合領域が大きくなつてプリント基板に安定に固
定され信頼性も向上する。
Effects of the Invention According to the chassis base mounting structure according to the present invention, the tongue piece extends inward from one end of the chassis base and has a tip portion bent in the chassis axis direction.
Since the tongue piece is inserted into the insertion hole of the printed circuit board and fixed by soldering, the tongue piece does not press the outer periphery of the printed circuit board during temporary fixing until soldering, thereby eliminating deformation of the printed circuit board. In addition, the number of man-hours required for temporarily fixing the printed circuit board is reduced, simplifying the work, and the solder joint area of the tongue piece is enlarged to stably fix the tongue to the printed circuit board, thereby improving reliability.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図と第2図は本考案の一実施例を説明する
ためのもので、第1図はプリント基板のシヤーシ
ベース組付前の状態を示す要部拡大斜視図、第2
図はプリント基板のシヤーシベース組付後の状態
を示す要部拡大平面図、第3図はシヤーシベース
取付構体の具体例を示す組立分解斜視図、第4図
は第3図のシヤーシベース取付構体の断面図、第
5図は第3図のシヤーシベース取付構体の半田付
け部分を示す要部拡大底面図、第6図は第5図の
側断面図、第7図は他のシヤーシベース取付構体
でのプリント基板のシヤーシベース取付前の状態
を示す要部拡大斜視図、第8図は第7図の組付後
の状態を示す要部拡大斜視図、第9図は第8図の
断面図、第10図は第7図の舌片に切込みを設け
たシヤーシベース取付構体を示す組付前の状態を
示す要部拡大斜視図、第11図は第10図の組付
後の状態を示す側断面図である。 1……シヤーシベース、3……プリント基板、
11……舌片、13……舌片挿入穴。
Figures 1 and 2 are for explaining one embodiment of the present invention; Figure 1 is an enlarged perspective view of the main parts showing the state before the printed circuit board is assembled to the chassis base;
The figure is an enlarged plan view of main parts showing the state after the printed circuit board is assembled to the chassis base, Figure 3 is an exploded perspective view showing a specific example of the chassis base mounting structure, and Figure 4 is a sectional view of the chassis base mounting structure of Figure 3. , FIG. 5 is an enlarged bottom view of the main parts showing the soldering part of the chassis base mounting structure shown in FIG. 3, FIG. 6 is a side sectional view of FIG. 5, and FIG. Figure 8 is an enlarged perspective view of the main parts showing the state before the chassis base is installed, Figure 8 is an enlarged perspective view of the main parts showing the state after assembly of Figure 7, Figure 9 is a sectional view of Figure 8, and Figure 10 is FIG. 7 is an enlarged perspective view of a main part showing the chassis base mounting structure with a notch provided in the tongue before assembly, and FIG. 11 is a side sectional view showing the state after assembly of FIG. 10. 1... Chassis base, 3... Printed circuit board,
11... tongue piece, 13... tongue piece insertion hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 枠状金属シヤーシの一端よりシヤーシ内方に延
び、中間部が屈曲され先端部分がシヤーシ内壁と
平行に延び、かつ、先端部分にエンボスを有する
舌片を設けたシヤーシベースと、該舌片の先端部
と対応する位置に舌片挿入穴を設けたプリント基
板とを具備し、舌片を上記挿入穴に挿入して半田
付け固定したことを特徴とするシヤーシベース取
付構体。
A chassis base having a tongue extending inward from one end of the frame-shaped metal chassis, having a bent intermediate portion, a tip extending parallel to the inner wall of the chassis, and having an embossed tip; and a tip of the tongue. 1. A chassis base mounting structure comprising: a printed circuit board having a tongue insertion hole at a corresponding position; the tongue is inserted into the insertion hole and fixed by soldering.
JP1986195039U 1986-12-17 1986-12-17 Expired - Lifetime JPH0536304Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986195039U JPH0536304Y2 (en) 1986-12-17 1986-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986195039U JPH0536304Y2 (en) 1986-12-17 1986-12-17

Publications (2)

Publication Number Publication Date
JPS6398691U JPS6398691U (en) 1988-06-25
JPH0536304Y2 true JPH0536304Y2 (en) 1993-09-14

Family

ID=31152559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986195039U Expired - Lifetime JPH0536304Y2 (en) 1986-12-17 1986-12-17

Country Status (1)

Country Link
JP (1) JPH0536304Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013786B2 (en) * 1981-02-06 1985-04-09 住友特殊金属株式会社 Precision polishing method for polycrystalline ferrite

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54175211U (en) * 1978-05-31 1979-12-11
JPS6013786U (en) * 1983-07-05 1985-01-30 アルプス電気株式会社 Printed circuit board attachment mechanism

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013786B2 (en) * 1981-02-06 1985-04-09 住友特殊金属株式会社 Precision polishing method for polycrystalline ferrite

Also Published As

Publication number Publication date
JPS6398691U (en) 1988-06-25

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