JPS6020948Y2 - electronic components - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an improvement in a structure for removing glue from resin-molded electronic components such as ICs.

For example, as shown in Fig. 1, electronic components such as ICs that are removably mounted on a printed circuit board are molded with resin, and a plurality of electrode pins 2 are made to protrude from the resin 1 in the same direction. structure is commonly used.

Further, a socket 5 is attached to the printed circuit board 4 for such an electronic component 3, and the electrode pins 2 of the electronic component 3 are inserted into the socket 5, thereby attaching the electrode pins 2 to the printed circuit board 4.

However, such electronic component 3 had the following drawbacks.

That is, the electrode pins 2 are bent from the side of the resin 1 and aligned in the same direction, but when external force is applied, they easily bend and become misoriented, making it difficult to insert them into the socket 5 or requiring a large force. It may take some time.

Furthermore, when the electrode pins 2 are bent, two electrode pins 2 are inserted into the pin holes 5' of the socket 5, resulting in severe damage to the electrode pins 2.

Moreover, such defects occur more significantly as the number of electrode pins 2 increases.

Further, a plurality of electronic components 3 are manufactured at once using, for example, a lead frame 6 as shown in FIG. 2 in the following manner.

First, the element 8 is soldered onto the element mounting plate 7 of the lead frame 6.

Next, the end of each lead 9 used as the electrode pin 2 and the electrode of the element 8 are connected with a thin wire.

Then, part of the element mounting plate 7 and the leads 9 are molded with the resin 1.

Next, the tie bar portions 10 and frame portions 11 of the lead frame 6 that integrate the leads 9 are cut to obtain individual electronic components 3 as shown in FIG. 3.

After that, the lead 9 protruding from the resin 1 was bent and used as the electrode pin 2.

By the way, assuming that the distance between adjacent resins 1 and 1 on the lead frame 6 is 1, this distance 1 was required to be at least twice the length of the electrode pin 2.

Therefore, the longer the electrode pins 2 are, the smaller the density of electronic components 3 formed by one lead frame 6 becomes, and the mass productivity is poor.

In view of the above-mentioned conventional drawbacks, the present invention has been improved and eliminated. A terminal piece is provided at the end of the lead from which the electrode of the element is taken out from the resin, and the end face of this terminal piece is attached to the key point on the outer peripheral surface of the resin. Provide exposed electronic components.

Hereinafter, the present invention will be explained with reference to examples.

First, in FIGS. 4 and 5, 12 is an electronic component according to the present invention, 13 is, for example, a printed circuit board, and 14 is a socket attached to the printed circuit board 13.

The electronic component 12 is covered with a resin 15, and inside the electronic component 12, an element 17 is soldered to an element mounting plate 16 as in the conventional case.
It has a structure in which each lead 18 is connected by a thin wire 19,
In the case of the present invention, the lead 18 is not taken out from the resin 15,
For example, along both sides of the resin 15 or at the end of a part 18, N is applied.
A conductive terminal piece 20 such as the like is fixed, and the end surfaces 21 of this terminal piece 20 are exposed on both sides of the resin 15.

That is, the electronic component 12 is of a pinless type, and in response to this, the socket 14 has a spring contact piece 22 protruding from the inner surface of the electronic component 12 into which the resin 15 is fitted, which comes into elastic contact with the end surface 21 of the terminal piece 20. let

In this way, the electronic component 12 can be mounted by simply pushing it into the socket 14, without the hassle of inserting a pin.

Next, to explain the manufacturing procedure of the electronic component 12, in the case of the present invention, for example, a lead frame 23 as shown in FIG.
Manufacture multiple pieces at once using

This lead frame 23 consists of an element mounting plate 16 and leads 18.
is integrated with the tie bar part 24 and the frame part 25, and each lead 18.18' of the adjacent electronic component 12.12' is 1
The tie bar portion 24 extends on both sides of the tie bar portion 24.
Connect each lead 1 to a terminal piece 20 as shown in FIG.
8 and 18' by welding or caulking.

After molding the chain line portion in FIG. 7 with resin 15, terminal pieces 20 and leads 18 are molded along the sides of resin 15.
Cut the 18' tip.

In this way, the interval between adjacent resins 15, 15 on the lead frame 23 corresponds to the width of the tie bar part 24, and can be made extremely shorter than in the past.

Next, various application examples of the present invention will be sequentially explained.

First, in FIG. 8, the end surface 21 of the terminal piece 20 is exposed on the bottom surface of the resin 15. In this case, the terminal piece 20 is inserted into the resin from the lead 18 to the resin bottom surface, as shown in FIG. penetrate.

Further, the end surface 21 of the terminal piece 20 can be exposed at the same time as resin molding by bringing the end surface 21 into contact with the bottom surface of the mold used for resin molding.

In FIG. 10, both side surfaces of the resin 15 are formed in a concave and convex shape so that the terminal pieces 20 are exposed on the convex portions 26. In FIG.

In this case, in accordance with the unevenness of the resin 15, the socket side is also provided with unevenness.

Then, the toothing of the concave and convex portions of the two can regulate the position when mounting the electronic component and prevent the position from shifting.

Note that the end surface 21 of the terminal piece 20 is located on the convex portion 26 as well as on the concave portion 27.
It may be exposed above or only above the recess 27.

Alternatively, both sides of the resin 15 may be made uneven and the terminal pieces 2 may be placed on the bottom.
The end face 21 of 0 may be exposed.

In addition, since the end face 21 of the terminal piece 20 is exposed from the resin 15, there is a risk that the terminal piece 20 may be pulled out from the resin 15.
If a groove 28 is provided in a part of the terminal piece 20 as shown in FIG. 1, removal can be easily prevented.

As explained above, according to the present invention, since the end face of the terminal piece is only exposed along the outer peripheral surface of the resin, there is no problem of the end face of the terminal piece being deformed by external force, and it is easy to attach and detach it to the socket. becomes easier.

Furthermore, since the pins do not protrude from the resin, the parts can be made smaller, and the parts formed on the lead frame can be more densely packed, allowing for mass production.

[Brief explanation of the drawing]

Figure 1 is a perspective view of conventional electronic components and their mounting parts;
The figure is a plan view of a conventional lead frame, FIG. 3 is a plan view of an electronic component obtained from the lead frame of FIG. 2, and FIG. 4 is a perspective view showing a first embodiment of an electronic component and its attachment parts according to the present invention. Figure 5 is a sectional view taken along the line A-A in Figure 4, Figure 6 is a plan view of a lead frame used in the manufacture of electronic components in Figure 4, Figure 7 is an enlarged side view of a portion of Figure 6, and Figure 8 is an enlarged side view of a portion of Figure 6. The figure is a perspective view showing a second embodiment of the present invention, FIG. 9 is a partial sectional view of FIG. 8, and FIG.
The figure is a perspective view showing a third embodiment of the present invention, and FIG. 11 is a sectional view showing an application example of the terminal piece portion according to the present invention. 12...Electronic parts, 15...Resin, 18...
...Lead, 20...Terminal piece, 21...
···End face.

Claims (1)

[Scope of utility model registration request] An electronic device characterized in that, in a resin-molded electronic component, a terminal piece is provided at the end of the lead leading out the electrode of the element from the resin to the outside, and the end face of the terminal piece is exposed along the outer peripheral surface of the resin. parts.