JPH03269961A - Low height type connector - Google Patents
Low height type connectorInfo
- Publication number
- JPH03269961A JPH03269961A JP2070172A JP7017290A JPH03269961A JP H03269961 A JPH03269961 A JP H03269961A JP 2070172 A JP2070172 A JP 2070172A JP 7017290 A JP7017290 A JP 7017290A JP H03269961 A JPH03269961 A JP H03269961A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- mold
- leads
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は低背型コネクタ、特にプリント基板に対しコネ
クタ高さを低く抑える低背型コネクタに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a low-profile connector, and particularly to a low-profile connector that keeps the height of the connector low relative to a printed circuit board.
従来この種のコネクタはコネクタリードがコネクタモー
ルドの下部から出ていた。Conventionally, in this type of connector, the connector leads came out from the bottom of the connector mold.
従来構造のコネクタの斜視図及び断面図を第３図（ａ）
、（ｂ）に、また、プリント基板５への実装の一例を第
４図（ａ）〜（ｈ）に示す。Figure 3(a) shows a perspective view and a cross-sectional view of a connector with a conventional structure.
, (b), and an example of mounting on the printed circuit board 5 is shown in FIGS. 4(a) to (h).
上述した従来のコネクタはコネクタリードがコネクタの
下部より出ている為、プリント基板に実装した場合、プ
リント基板に対するコネクタの実装高さはコネクタのモ
ールドとコネクタリードを合わせたもので高くなり、高
密度実装にはむかないという欠点がある。In the conventional connectors mentioned above, the connector leads protrude from the bottom of the connector, so when mounted on a printed circuit board, the mounting height of the connector on the printed circuit board is the combination of the connector mold and the connector leads, which increases the density. The drawback is that it is not easy to implement.
本発明の低背型コネクタは、プリント基板に実装した場
合の実装高さを低く抑える為に、コネクタのリードをコ
ネクタモールドの任意の位置より出す構造を有している
。また本コネクタを実装するプリント基板は、任意の位
置に本コネクタに適合する切欠き部を有している。The low-profile connector of the present invention has a structure in which the leads of the connector extend from arbitrary positions of the connector mold in order to keep the mounting height low when mounted on a printed circuit board. Further, the printed circuit board on which the present connector is mounted has a cutout portion that fits the present connector at an arbitrary position.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）は、本発明の一実施例を示す斜視
図およびＡ−Ａ断面図である。第２図（ａ）〜（ｈ）は
本コネクタをプリント基板に実装し、雄型コネクタとか
ん合させる過程を示す。FIGS. 1(a) and 1(b) are a perspective view and a sectional view taken along the line AA, showing an embodiment of the present invention. FIGS. 2(a) to 2(h) show the process of mounting this connector on a printed circuit board and mating it with a male connector.
雄型コネクタ１はコネクタリード２．コネクタモールド
３．接触端子部４から構成されており、コネクタリード
２はコネクタモールド３の任意の位置より出ている構造
となっている。Male connector 1 has connector leads 2. Connector mold 3. It is composed of a contact terminal portion 4, and the connector lead 2 is structured to protrude from an arbitrary position of the connector mold 3.
雄型コネクタ１をプリント基板５の任意の位置に実装す
る。このプリント基板５は雄型コネクタ１を実装する位
置にコネクタモールド３に適合する切欠き部７と雄型コ
ネクタ１のコネクタリード２を接続はんだ付する搭載パ
ッド６を有している。A male connector 1 is mounted at an arbitrary position on a printed circuit board 5. This printed circuit board 5 has a notch 7 that fits the connector mold 3 at a position where the male connector 1 is mounted, and a mounting pad 6 to which the connector lead 2 of the male connector 1 is connected and soldered.
雄型コネクタ１をプリント基板５の実装しようとする位
置の切欠き部７にコネクタモールド３を埋め込むように
実装する。切欠き部７はコネクタモールド３が適合する
大きさになっている。これにより、雄型コネクタ１のコ
ネクタリード２はプリント基板５の有する搭載バッド６
上に接続されることになり、本コネクタリード２より下
部のコネクタモールド３の部分はプリント基板５１に埋
め込まれることになる。これを第２図（ａ）（ｂ）に示
す。The male connector 1 is mounted so that a connector mold 3 is embedded in a notch 7 at a position where the connector 1 is to be mounted on a printed circuit board 5. The cutout portion 7 is sized to fit the connector mold 3. As a result, the connector lead 2 of the male connector 1 is connected to the mounting pad 6 of the printed circuit board 5.
The portion of the connector mold 3 below the main connector lead 2 will be embedded in the printed circuit board 51. This is shown in FIGS. 2(a) and (b).
第２図（Ｃ）は第２図（ｂ）のＢ−Ｂ断面図である。プ
リント基板５の搭載バッド６上に実装された雄型コネク
タ１のコネクタリード２をはんだごて９等により、はん
だづけによって接続する。FIG. 2(C) is a sectional view taken along line BB in FIG. 2(b). The connector leads 2 of the male connector 1 mounted on the mounting pad 6 of the printed circuit board 5 are connected by soldering using a soldering iron 9 or the like.
この状態を第２図（ｄ）に示す。This state is shown in FIG. 2(d).
第２図（ｅ）は第２図（ｄ）のＣ−ＣＢ面図である。第
２図（ｆ）、（ｇ）は雄型コネクタ１に適合する雌型コ
ネクタ１０をかん合させる過程を示す、また第２図（ｈ
）は第２図（ｇ ）のＤ−Ｄ断面図である。FIG. 2(e) is a C-CB plane view of FIG. 2(d). FIGS. 2(f) and 2(g) show the process of mating the female connector 10 to the male connector 1, and FIG.
) is a sectional view taken along line DD in FIG. 2(g).
このように雄型コネクタ１のコネクタモールド３がコネ
クタリード２の位置より下部部分についてプリント基板
５に埋め込まれることになり、プリント基板５に対する
雄型コネクタの実装高さを低く抑えることができる。In this way, the connector mold 3 of the male connector 1 is embedded in the printed circuit board 5 below the position of the connector leads 2, and the mounting height of the male connector with respect to the printed circuit board 5 can be kept low.
以上説明したように本発明の低背型コネクタは、コネク
タのリードをコネクタモールドの任意の位置より出る構
造にすることにより、本コネクタを実装しようとするプ
リント基板上の任意の位置にコネクタモールドに適合す
る切欠き部を設け、本コネクタを実装するとプリント基
板に対して実装高さを低く抑えることが可能となり高密
度実装に対応することができる効果がある。As explained above, the low-profile connector of the present invention has a structure in which the connector leads come out from any position on the connector mold, so that the connector mold can be placed at any position on the printed circuit board on which the connector is to be mounted. By providing a matching notch and mounting this connector, it is possible to keep the mounting height low relative to the printed circuit board, which has the effect of being able to support high-density mounting.
第１図（ａ＞、（ｂ）は本発明の一実施例を示す斜視図
およびＡ−Ａ断面図、第２図（ａ）。
（ｂ）、（ｄ）、（ｆ）、（ｇ）はプリント基板に本コ
ネクタを実装する方法を示す斜視図、第２図（ｃ）は第
２図（ｂ）のＢ−Ｂ断面図、第２図（ｅ）は第２図（ｄ
）のＣ−Ｃ断面図、第２図（ｈ）は第２図（ｇ）のＤ−
Ｄ断面図、第３図（ａ）、（ｂ）は従来の一例を示す斜
視図およびＥ−Ｅ断面図、第４図（ａ＞、（ｂ）、（ｄ
）。
（ｆ）、（ｇ）はプリント基板にコネクタを実装する方
法を示す斜視図、第４図（ｃ）は第４図（ｂ）のＦ−Ｆ
断面図、第４図（ｅ）は第４図（ｄ）のＧ−Ｃ断面図、
第４図（ｈ）は第４図（ｇ）のＨ−Ｈ断面図である。
ｌ・・・低背型雄型コネクタ、２・・・コネクタリード
、３・・・コネクタモールド、４・・・接触端子部、５
・・・プリント基板、６・・・搭載パッド、７・・・プ
リント基板切欠き部、８・・・はんだ、９・・・はんだ
ごて、ｌＯ・・・雌型コネクタ、１１・・・従来の雄型
コネクタ、１２・・・従来の雌型コネクタ。Figure 1 (a>, (b) is a perspective view and AA sectional view showing one embodiment of the present invention, Figure 2 (a). (b), (d), (f), (g) is a perspective view showing a method of mounting this connector on a printed circuit board, FIG. 2(c) is a sectional view taken along line B-B in FIG. 2(b), and FIG.
), and Figure 2 (h) is a cross-sectional view of Figure 2 (g).
D sectional view, FIGS. 3(a) and (b) are perspective views showing an example of the conventional technology, E-E sectional view, and FIGS. 4(a>, (b), (d)
). (f) and (g) are perspective views showing the method of mounting the connector on the printed circuit board, and Figure 4 (c) is F-F of Figure 4 (b).
A sectional view, FIG. 4(e) is a GC sectional view of FIG. 4(d),
FIG. 4(h) is a sectional view taken along the line HH in FIG. 4(g). l...Low profile male connector, 2...Connector lead, 3...Connector mold, 4...Contact terminal portion, 5
...Printed board, 6...Mounting pad, 7...Printed board notch, 8...Solder, 9...Soldering iron, IO...Female connector, 11...Conventional male connector, 12... conventional female connector.
Claims (1)
クタモールドの下面から上面までの任意の位置に出され
たコネクタリードを備えることを特徴とする低背型コネ
クタ。A low-profile connector to be mounted on a printed circuit board, characterized by having a connector lead extended at any position from the bottom surface to the top surface of a connector mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2070172A JPH03269961A (en) | 1990-03-19 | 1990-03-19 | Low height type connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2070172A JPH03269961A (en) | 1990-03-19 | 1990-03-19 | Low height type connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03269961A true JPH03269961A (en) | 1991-12-02 |
Family
ID=13423847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2070172A Pending JPH03269961A (en) | 1990-03-19 | 1990-03-19 | Low height type connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03269961A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130051A (en) * | 1994-10-31 | 1996-05-21 | Nec Niigata Ltd | Connector |
| JP2002259051A (en) * | 2000-12-29 | 2002-09-13 | Lg Phillips Lcd Co Ltd | Structure for coupling touch controller with lcd module controller in touch panel integrated with lcd |
| JP2007123214A (en) * | 2005-10-31 | 2007-05-17 | Mitsumi Electric Co Ltd | Mounting structure of camera module |
-
1990
- 1990-03-19 JP JP2070172A patent/JPH03269961A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130051A (en) * | 1994-10-31 | 1996-05-21 | Nec Niigata Ltd | Connector |
| JP2002259051A (en) * | 2000-12-29 | 2002-09-13 | Lg Phillips Lcd Co Ltd | Structure for coupling touch controller with lcd module controller in touch panel integrated with lcd |
| JP4583681B2 (en) * | 2000-12-29 | 2010-11-17 | エルジー ディスプレイ カンパニー リミテッド | Connection structure of touch controller and LCD module controller in touch panel integrated LCD |
| JP2007123214A (en) * | 2005-10-31 | 2007-05-17 | Mitsumi Electric Co Ltd | Mounting structure of camera module |
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