JPH05152735A - Correcting equipment for solder bridge - Google Patents

Abstract

PURPOSE:To surely correct a bridge, regardless of shape difference of the bridge, by a method wherein a spatula-shaped member is slightly moved in the direction almost intersecting the linkage direction of the bridge whose one end is melted, thereby dividing the bridge. CONSTITUTION:A substrate 10 in which a bridge is generated by soldering is retained at a specified position by a retaining part 1, in the manner in which a solder surface is made to face upward. Above the retaining part 1, an arm 3 which is stretched in the vertical direction and formed so as to able to freely move in the XYZ directions is suspended. A spatula-shaped member 5 is formed at the lower end of the arm 3 so as to protrude. These are operated by a control means, on the basis of the position information concerning the bridge, and the tip end portion of the spatula-shaped member 5 is positioned on side part of the bridge. Since a hot air nozzle 6 is installed to be adjacent to the spatula-shaped member 5, the hot air is blown out against the vicinity of tip part of the spatula-shaped member 5. The bridge is heated and melted, so that the bridge is divided and dissolved by slightly moving the spatule-shaped member 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder bridge repair device for melting and repairing a solder bridge generated in a solder portion of a substrate.

[0002]

2. Description of the Related Art Generally, in a printed circuit board used for an electronic device or the like, leads of various components to be mounted are inserted into through holes which are opened in advance, and the parts where the leads are inserted are opposite to the component mounting surface. Surface (hereinafter referred to as the solder surface)
Soldered from. When a lead of a component is inserted into the through hole for soldering, a connection state including a short circuit between one solder portion and another solder portion different from the one solder portion (hereinafter, referred to as a bridge) .) May occur.

Conventionally, when the above-mentioned bridge is detected by an inspection at the time of board assembly, an operator manually melts the bridge portion with a soldering iron and uses a bamboo pin member to correct the bridge. It was fixed by scooping and removing this.

[0004]

By the way, in order to detect the solder bridge, an inspection system using image recognition has been used these days, so that a soldered board can be extremely quickly and accurately manufactured. Although it can be inspected, the above-mentioned correction work still depends on the skill of the operator, and labor saving has not been achieved. this is,
Since the shape of the generated bridge is individually indefinite and the amount of adhesion is not quantitative, it is necessary to cut and divide this while watching the molten state of the bridge, and if this is automated as it is, the device becomes extremely complicated, This is because there is a problem that it is difficult to make a highly reliable device from the contents of the work. Further, in the case where such a correction work is manually performed, a separate work place is required in the board assembly line.

The present invention has been made in view of the above circumstances, and an object of the present invention is to correct a solder bridge with a simple structure and to correct the solder bridge, which can save labor. To provide a device.

[0006]

A solder bridge repairing apparatus of the present invention is a repairing apparatus for melting a bridge generated by soldering on a solder surface of a substrate and dividing and repairing the bridge. A support part for holding the substrate at a predetermined position, an arm hung above the support part, extended in the vertical direction, and formed so as to be movable in the XYZ directions, and project at the lower end of the arm. A spatula-shaped member provided, a hot-air nozzle that is provided at the lower end of the arm adjacent to the spatula-shaped member, and blows hot air toward the vicinity of the tip of the spatula-shaped member, and position information regarding the bridge. The arm is operated to position the tip end portion of the spatula-shaped member laterally of the bridge, and finely move the spatula-shaped member in a direction substantially intersecting the connecting direction of the bridge. Characterized in that the control means are provided.

[0007]

[Function] The board with the bridge generated by soldering is
When the solder surface is held upward at a predetermined position by the supporting portion, an arm extending vertically and movable in the XYZ directions is hung above the supporting portion. Since the spatula-shaped members are projected from the lower end of the arm, the control means actuates the spatula-shaped members based on the position information regarding the bridge to position the tip end of the spatula-shaped member on the side of the bridge. Then, since the hot air nozzle is provided adjacent to the spatula-shaped member, when the hot air nozzle blows hot air toward the vicinity of the tip of the spatula-shaped member, the bridge is heated and melted. Therefore, when the spatula-shaped member is finely moved in a direction substantially intersecting with the connecting direction of the bridges, the melted bridges are resolved.

[0008]

EXAMPLE A solder bridge repair device according to the present invention (hereinafter,
This device is called. 1) will be described with reference to FIGS.

This apparatus is shown in a conceptual diagram in its entirety in FIG. 1, and includes a supporting portion 1 for holding a substrate 10 to be corrected in a predetermined position, and an arm 3 suspended above the supporting portion 1. ,
It is roughly configured by a correction mechanism 4 provided at the lower end of the arm 3. More specifically, the support 1 is composed of a conveyor 1a for loading and unloading the substrate 10 into and from the apparatus, and stoppers 1c, 1c mounted on the conveyor 1a. And the substrate 1
0 is carried in with the solder surface, which is the back surface, facing upward,
These stoppers 1 when the substrate 10 reaches a predetermined position
c and 1c are projected to lock the front end and the rear end of the substrate 10.

Also, the arm 3 provided above the support portion 1 is XYZ in a state where it is always extended in the vertical direction.
It is formed to be movable in the direction and rotatable about the axis. That is, the arm 3 is suspended by the positioning mechanism 2 that performs horizontal positioning, is formed so as to be movable in the front-rear direction, left-right direction, and is moved up and down by the attached cylinder device 3s. , Constitutes a robot arm. The arm 3 is also rotatably formed by an actuator such as a built-in stepping motor (not shown).

The correction mechanism 4 provided at the lower end of the arm 3 is provided with a spatula-shaped member 5 which is finely moved in the horizontal direction, and a hot air nozzle 6 is provided adjacent to the spatula-shaped member 5. The spatula-shaped member 5 is made of a heat-resistant material, and a tip portion thereof has a substantially V-shaped cross-sectional shape when viewed from one side surface, and a square-shaped cross-sectional shape when viewed from another adjacent side surface. It is formed as a flat shielding material. The spatula-shaped member 5 is attached to the chuck cylinder 5 s provided on the spatula-shaped member 5 by the correction mechanism 4, and in the upright state, the spatula-shaped member 5 reciprocates slightly in the width direction of the flat side surface of the tip portion.

The spatula-shaped member 5 may be made of various metals as the above-mentioned heat-resistant material, but it is preferable that the solder adheres less when the molten solder is divided, for example, polyimide resin or silicon resin. Engineering plastics such as resin are suitable.

Further, the hot air nozzle 6 provided in the correction mechanism 4 is attached to the arm 3 and has a heater inside to heat air supplied from a compressor or the like (not shown). Is connected via a conduit 6e. Then, when the bridge shown by reference character B in FIG. 2 which is generated on the substrate 10 is corrected, hot air of a predetermined temperature is blown toward the vicinity of the tip of the spatula-shaped member 5 for a certain period of time. Is to be melted. The temperature of this hot air and the blowing time are preset so as to give a sufficient amount of heat to the expected bridge to melt it.

By the way, the arm 3 is moved to a predetermined position on the substrate 10 by the positioning mechanism 2, and the tip of the spatula-shaped member 5 of the correction mechanism 4 is moved to the side of the bridge B by moving the arm 3 up and down. The device is provided with a control means (not shown) for controlling the operation of the positioning mechanism 2 and the arm 3, which is brought into contact with the board surface. Further, position information regarding the bridge B when the bridge B is detected in advance by an inspection device (not shown) that performs a bridge inspection on the soldered substrate 10 is input to the control means. It has become.

The inspection device is, for example, a device using image recognition, and irradiates light from a predetermined direction with an image pickup means such as a CCD camera facing a solder surface of a substrate held in the device. And a light source to operate. In this apparatus, a solder part or a part to be soldered and a flat plate part not to be soldered are specified by an image in advance on a board to be inspected or a board having the same pattern as the board to be inspected.

In the inspection, if light is emitted from the light source to the substrate in a predetermined direction, most of the emitted light that hits a portion of the light that is projected to the flat substrate surface is removed. Since the light is reflected to the side in the irradiation direction, it is possible to recognize the protruding solder portion or the bridge as a shadow portion by capturing this with the image pickup means. Thereby, when the captured image is compared with the initially recognized image, and when a shadow part connecting these is detected in the gap between the one solder part and another solder part different from the one solder part, This is determined as a bridge.

That is, the control means of the apparatus outputs a control signal for operating the arm 3 and the correction mechanism 4 based on the position information regarding the bridge input from the inspection apparatus. .. Less than,
An operation of correcting the bridge B generated on the substrate 10 of the present apparatus configured as described above will be described with reference to FIG.

First, the substrate 10 mounted on the conveyor 1a of the supporting portion 1 with the solder surface facing upward is mounted on the stopper 1c,
It is held at a predetermined position of the supporting portion 1 by 1c. An arm 3 extending in the vertical direction is suspended above the support portion 1 by a positioning mechanism 2 so as to be movable in the horizontal direction (XY direction), and is vertically movable (movable in the Z direction). Therefore, the arm 3 is moved almost directly above the bridge B.

Further, at this time, since the arm 3 itself is formed to be rotatable and the correction mechanism 4 having the spatula-shaped member 5 attached to the lower end is provided, the arm 3 is provided.
Is rotated so that the flat side surface of the tip end of the spatula-shaped member 5 is in a direction orthogonal to the bridge connecting direction and to a position slightly lateral to the bridge 3 and slightly separated from the board surface of the substrate 10. Move 4

Then, since the correction mechanism 4 is provided with the hot-air nozzle 6 adjacent to the spatula-shaped member 5, the hot-air nozzle 6 presets the hot-air nozzle 6 toward the vicinity of the tip of the spatula-shaped member 5. The bridge B can be melted by blowing hot air for the specified time. Then,
The tip end of the spatula-shaped member 5 is brought into contact with the side plate surface of the bridge B and the hot air is stopped, and at the same time, the chuck cylinder 5s to which the spatula-shaped member 5 is attached is operated to flatten the spatula-shaped member 5 at its tip end. When the reciprocating fine movement is performed in the width direction of the side surface, that is, in the direction substantially intersecting the connecting direction of the bridge B, the melted bridge B is divided.

At this time, the tip portion of the spatula-shaped member 5 is formed flat, and when the reciprocating fine movement is performed, the bridge B is once divided over the entire width of the bridge B, and the melted solder is brought into contact with the spatula-shaped member 5. Since the temperature is lowered and hardened, the bridge B is not re-formed during the reciprocating movement of the spatula member 5. Furthermore, when the spatula-shaped member 5 is formed of a material such as a heat-resistant polyimide resin with little solder adhesion, solder does not adhere to the spatula-shaped member 5 when the bridge B is divided. The formation of the bridge B can be further prevented, and the division can be reliably eliminated.

As described above, in the present apparatus, the bridge B is not broken by a pin member or the like while observing the molten state of the bridge B, but is divided by the side of the bridge B once melted. Since the spatula-shaped member 5 is divided by finely reciprocating the spatula-shaped member 5 in contact with the board surface, the spatula-shaped member 5 can be reliably corrected regardless of the difference in the form of the bridge B. Moreover, since the arm 3 is moved to the bridge B of the substrate 10 by using the position information obtained by the bridge inspection, it is possible to quickly and completely cope with a high-speed bridge inspection system and save labor. In addition, the line area required for the correction process can be reduced.

[0023]

As described above, according to the present invention,
Since the spatula-shaped member is finely moved in a direction substantially crossing the connecting direction of the bridge with respect to the once-melted bridge and divided, this can be surely corrected regardless of the difference in the form of the bridge. Since the arm is moved to the correction position based on the position information obtained by the bridge inspection, it is possible to quickly and completely cope with a high-speed bridge inspection system, and it is possible to save labor. ..

[Brief description of drawings]

FIG. 1 is an overall perspective view showing an embodiment of a solder bridge correction device.

FIG. 2 is an explanatory diagram showing a correcting operation of a bridge.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Support part 2 Positioning mechanism 3 Arm 5 Spatula member 6 Hot air nozzle 10 Substrate

Claims (1)

[Claims] 1. A repairing device for melting and repairing a bridge generated by soldering on a solder surface of a board, the support section holding the board at a predetermined position with the solder surface facing upward. An arm that is suspended above the support portion, extends vertically, and is movable in the XYZ directions; a spatula-shaped member that projects from the lower end of the arm; A hot air nozzle that is provided adjacent to the lower end of the arm and blows hot air toward the vicinity of the tip of the spatula-shaped member, and operates the arm based on position information regarding the bridge, and the tip of the spatula-shaped member. And a control means for locating the part laterally of the bridge and for finely moving the spatula-shaped member in a direction substantially intersecting the connecting direction of the bridge. Ridge of the correction device.