JPH07101799B2 - Printed wiring board wire machine - Google Patents
Printed wiring board wire machineInfo
- Publication number
- JPH07101799B2 JPH07101799B2 JP5158294A JP15829493A JPH07101799B2 JP H07101799 B2 JPH07101799 B2 JP H07101799B2 JP 5158294 A JP5158294 A JP 5158294A JP 15829493 A JP15829493 A JP 15829493A JP H07101799 B2 JPH07101799 B2 JP H07101799B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- wiring
- robot
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板布線機
に布線を行う布線機に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring machine for wiring a printed wiring board wiring machine.
【０００２】[0002]
【従来の技術】従来、プリント配線板布線機の布線は手
作業により表面実装部品のリードへ線材を糸はんだとは
んだコテで一箇所づつはだ付け接続を行っていた。2. Description of the Related Art Conventionally, in the wiring of a printed wiring board laying machine, the wire material is manually attached to the leads of the surface mount component by soldering and soldering one by one.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来のプリン
ト配線板布線機の布線方法は、手作業に頼っているため
に作業能率が悪く、また表面実装部品のリード間ピッチ
が狭くなると、線材を布線箇所に合わせる位置決め作業
が困難になり、隣接リードへの誤布線が発生しやすいと
いう問題点があった。The above-mentioned conventional wiring method for the printed wiring board wiring machine is poor in work efficiency because it relies on manual work, and when the pitch between the leads of the surface mount component becomes narrow, There is a problem that it is difficult to perform the positioning work for aligning the wire material with the wiring location, and erroneous wiring is likely to occur on the adjacent lead.
【０００４】また、手作業を自動化するためには、糸は
んだの曲がりくせや、はんだ量のコントロール、隣接リ
ードとのはんだによるショート不良などの困難な問題を
解決しなければならないという問題点があった。In addition, in order to automate the manual work, there are problems that it is necessary to solve difficult problems such as bending of the solder wire, control of the amount of solder, and short circuit defects due to soldering with adjacent leads. It was
【０００５】[0005]
【課題を解決するための手段】本発明のプリント配線板
布線機は、Ｘ−Ｙロボットと、Ｘ−Ｙロボットに固定さ
れたヘッドと、ヘッドに保持され、かつ垂直方向に移動
可能な２つの垂直移動部と、表面実装部品が上面に露出
して取り付けられているプリント配線板を水平に保持す
るプリント配線板固定部と、線材を保持し、プリント配
線板の布線箇所に線材を仮固定するための垂直移動部の
片方に固定されたチャック部と、プリント配線板の布線
箇所にはんだ溶解に必要な熱を供給するための垂直移動
部のもう片方に固定された熱源部と、ヘッドに固定さ
れ、線材の先端位置管理、布線箇所位置管理、熱源部先
端位置管理を行い、Ｘ−Ｙロボットおよび２つの垂直移
動部に補正を加えるための状態把握用の認識カメラとを
有することを特徴としている。SUMMARY OF THE INVENTION A printed wiring board wiring machine according to the present invention comprises an XY robot, a head fixed to the XY robot, a head held by the head and vertically movable. Two vertical moving parts, a printed wiring board fixing part that horizontally holds the printed wiring board with surface-mounted components exposed on the top surface, a wire rod, and temporarily attach the wire rod to the wiring position on the printed wiring board. A chuck part fixed on one side of the vertical moving part for fixing, and a heat source part fixed on the other side of the vertical moving part for supplying heat necessary for melting the solder to the wiring position of the printed wiring board, It has a recognition camera that is fixed to the head and that manages the position of the tip of the wire, the position of the wiring, the position of the heat source, and the XY robot and the state-recognizing camera for correcting the two vertically moving parts. Characterized by To have.
【０００６】また、線材が、あらかじめ予備はんだがほ
どこされたものであることを特徴としている。Further, the wire is characterized by being preliminarily soldered.
【０００７】[0007]
【作用】あらかじめ予備はんだがほどこされた線材を垂
直移動部片方のチャック部に把持させ、線材の先端位置
状態を認識カメラにて認識させる。Function: The wire rod preliminarily pre-soldered is gripped by the chuck on one side of the vertical moving part, and the recognition camera recognizes the position of the tip of the wire rod.
【０００８】次に、Ｘ−Ｙロボットがプリント配線板上
の指定の布線箇所に移動し、布線箇所の認識を行い、位
置補整後チャック部が下降して線材の仮固定をし、もう
片方の熱源部が下降し、布線箇所および線材に熱を与
え、線材にあらかじめほどこされている予備はんだを溶
解させることにより、布線箇所への線材のはんだ付けが
自動的に行われる。Next, the XY robot moves to a designated wiring position on the printed wiring board, recognizes the wiring position, and after the position adjustment, the chuck portion descends to temporarily fix the wire rod. One of the heat sources descends, heat is applied to the wiring part and the wire material, and the preliminary solder previously applied to the wire material is melted, so that the wire material is automatically soldered to the wiring part.
【０００９】[0009]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１０】図１は本発明によるプリント配線板布線機
の一実施例の一部を切り欠いた正面図、図２から図５は
本実施例のプリント配線板布線機における布線作業の各
工程を順に示す説明図である。FIG. 1 is a partially cutaway front view of an embodiment of a printed wiring board wiring machine according to the present invention, and FIGS. 2 to 5 show wiring work in the printed wiring board wiring machine of this embodiment. It is explanatory drawing which shows each process in order.
【００１１】ここで、図２は予備はんだ済み線材の認識
工程の説明図、図３は布線箇所の認識工程の説明図、図
４は予備はんだ済み線材の仮固定の説明図、図５ははん
だ付け工程の説明図である。Here, FIG. 2 is an explanatory view of the step of recognizing the pre-soldered wire rod, FIG. 3 is an explanatory view of the step of recognizing the wiring portion, FIG. 4 is an explanatory view of temporary fixing of the pre-soldered wire rod, and FIG. It is an explanatory view of a soldering process.
【００１２】Ｘ−Ｙロボット３がフレーム（図示せず）
に固着され、ヘッド４がＸ−Ｙロボット３の可動部（図
示せず）に固着されている。ヘッド４によって保持され
た２つの垂直移動部４ａが移動装置（図示せず）によっ
て上下に移動できる。片方の垂直移動部４ａの先端に予
備はんだ済み線材８を把持およびプリント配線板２の表
面実装部品２ａのリード２ｂの布線箇所２ｃに仮固定す
るためのチャック６が固着されている。もう片方の垂直
可動部４ａの先端には、はんだ付け接続を行うための熱
源部７が固着されている。ヘッド４には、予備はんだ済
み線材８の先端位置管理、布線箇所２ｃの位置管理、熱
源部７の先端位置管理を行うための状態把握用認識カメ
ラ５が固着されている。フレームに垂直に固定された、
プリント配線板固定部１によってプリント配線板２を水
平に保持する。予備はんだ済み線材８を片方の垂直移動
部４ａのチャック部６に把持させ、線材の先端位置状態
を認識カメラ５にて認識させる。熱源部７の位置状態を
認識カメラ５にて認識させる。Ｘ−Ｙロボット３がプリ
ント配線板２上の表面実装部品２ａ、布線箇所２ｃのリ
ード２ｂ上に移動し、布線箇所２ｃの認識を行い、位置
補正後、チャック部６が下降し予備はんだ済み線材８を
表面実装部品２ａのリード２ｂの布線箇所２ｃに仮固定
をし、もう片方の熱源部７が下降し、布線箇所２ｃへの
予備はんだ済み線材８のはんだ付け接続を自動的に行
う。The XY robot 3 has a frame (not shown).
The head 4 is fixed to a movable part (not shown) of the XY robot 3. The two vertical moving parts 4a held by the head 4 can be moved up and down by a moving device (not shown). A chuck 6 for holding the pre-soldered wire 8 and temporarily fixing it to the wiring portion 2c of the lead 2b of the surface-mounted component 2a of the printed wiring board 2 is fixed to the tip of one of the vertical moving portions 4a. A heat source portion 7 for soldering connection is fixed to the tip of the other vertically movable portion 4a. The head 4 is provided with a state-recognition recognition camera 5 for managing the tip position of the pre-soldered wire 8, the position of the wiring portion 2c, and the tip position of the heat source section 7. Fixed vertically to the frame,
The printed wiring board 2 is held horizontally by the printed wiring board fixing portion 1. The pre-soldered wire rod 8 is gripped by the chuck portion 6 of one vertical moving portion 4a, and the recognition camera 5 recognizes the tip end position state of the wire rod. The recognition camera 5 recognizes the position state of the heat source unit 7. The XY robot 3 moves to the surface mounting component 2a on the printed wiring board 2 and the lead 2b of the wiring portion 2c, recognizes the wiring portion 2c, and after the position correction, the chuck portion 6 descends and preliminary soldering is performed. The pre-soldered wire 8 is automatically soldered to the wiring part 2c by temporarily fixing the pre-soldered wire 8 to the wiring part 2c of the lead 2b of the surface mount component 2a and lowering the other heat source part 7c. To do.
【００１３】次に、本実施例の布線機の動作について図
２から図５を参照して説明する。Next, the operation of the wiring machine of this embodiment will be described with reference to FIGS. 2 to 5.
【００１４】まず、チャック部６に把持された予備はん
だ済み線材８を認識カメラ５により先端形状を認識する
（図２）。次にＸ−Ｙロボット３が移動し、認識カメラ
５にてプリント配線板２の表面実装部品２ａの布線箇所
２ｃのリード２ｂを認識する（図３）。次に予備はんだ
済み線材８の先端位置及び布線箇所２ｃのリード２ｂの
位置の差異を計算しＸ−Ｙロボット３が移動して位置補
正を行った後、垂直移動部４ａが下降し、仮固定を行う
（図４）。次に熱源部７ついた垂直移動部４ａが下降
し、予備はんだ済み線材８の予備はんだを溶融させて、
布線箇所２ｃへの予備はんだ済み線材８のはんだ付け接
続を行う（図５）。First, the tip shape of the pre-soldered wire 8 held by the chuck 6 is recognized by the recognition camera 5 (FIG. 2). Next, the XY robot 3 moves and the recognition camera 5 recognizes the lead 2b of the wiring portion 2c of the surface mounting component 2a of the printed wiring board 2 (FIG. 3). Next, after calculating the difference between the position of the tip of the pre-soldered wire 8 and the position of the lead 2b at the wiring portion 2c, the XY robot 3 moves and corrects the position, and then the vertical moving unit 4a descends, Fix it (Fig. 4). Next, the vertical moving part 4a with the heat source part 7 descends to melt the pre-soldered pre-soldered wire 8 and
The pre-soldered wire rod 8 is soldered and connected to the wiring portion 2c (FIG. 5).
【００１５】[0015]
【発明の効果】以上説明したように、本発明のプリント
配線板布線機は、あらかじめ予備はんだした線材を用
い、線材先端の位置、布線箇所リード位置、熱源部先端
位置を認識させ、位置方向を補整したのちに布線を行う
ようにすることにより、表面実装部品のリード間ピッチ
が狭くても、作業能率良く、かつ隣接リードへの誤布線
なく布線を行うことができるという効果がある。As described above, the printed wiring board wiring machine according to the present invention uses the wire material preliminarily soldered, and recognizes the position of the wire material tip, the lead position of the wiring location, and the tip position of the heat source part. By performing wiring after adjusting the direction, the work efficiency can be improved and wiring can be performed without erroneous wiring to adjacent leads even if the pitch between leads of surface mount components is narrow. There is.
【００１６】また、本発明のプリント配線板布線機は、
布線箇所と線材のはんだ付け接続にはあらかじめ線材に
予備はんださせているはんだを用いることにより、はん
だ量が過剰にならず、隣接リードとのはんだによるショ
ート不良を防止できるという効果がある。The printed wiring board wiring machine of the present invention is
By using the solder preliminarily soldered to the wire material for the soldering connection between the wiring portion and the wire material, there is an effect that the solder amount does not become excessive and a short circuit defect due to the solder with the adjacent lead can be prevented.
【図１】本発明によるプリント配線板布線機の一実施例
の布線機の一部を切り欠いた正面図である。FIG. 1 is a partially cutaway front view of a wiring machine of an embodiment of a printed wiring board wiring machine according to the present invention.
【図２】本実施例のプリント配線板布線機の予備はんだ
済み線材の認識工程の説明図である。FIG. 2 is an explanatory diagram of a process of recognizing a pre-soldered wire rod of the printed wiring board wiring machine according to the present embodiment.
【図３】本実施例のプリント配線板布線機の布線箇所の
認識工程の説明図である。FIG. 3 is an explanatory diagram of a process of recognizing a wiring portion of the printed wiring board wiring machine according to the present embodiment.
【図４】本実施例のプリント配線板布線機の予備はんだ
済み線材の仮固定の説明図である。FIG. 4 is an explanatory diagram of temporary fixing of the pre-soldered wire rod of the printed wiring board wiring machine of the present embodiment.
【図５】本実施例のプリント配線板布線機のはんだ付け
工程の説明図である。FIG. 5 is an explanatory diagram of a soldering process of the printed wiring board wiring machine of the present embodiment.
【符号の説明】 １ プリント配線板固定部 ２ プリント配線板 ２ａ 表面実装部品 ２ｂ リード ２ｃ 布線箇所 ３ Ｘ−Ｙロボット ４ ヘッド ４ａ 垂直移動部 ５ 認識カメラ ６ チャック部 ７ 熱源部 ８ 予備はんだ済み線材[Explanation of reference numerals] 1 printed wiring board fixing portion 2 printed wiring board 2a surface mounting component 2b lead 2c wiring portion 3 XY robot 4 head 4a vertical moving portion 5 recognition camera 6 chuck portion 7 heat source portion 8 pre-soldered wire rod
Claims (2)
の垂直移動部と、 表面実装部品が上面に露出して取り付けられているプリ
ント配線板を水平に保持するプリント配線板固定部と、 線材を保持し、前記プリント配線板の布線箇所に前記線
材を仮固定するための前記垂直移動部の片方に固定され
たチャック部と、 前記プリント配線板の布線箇所にはんだ溶解に必要な熱
を供給するための前記垂直移動部のもう片方に固定され
た熱源部と、 前記ヘッドに固定され、前記線材の先端位置管理、前記
布線箇所位置管理、前記熱源部先端位置管理を行い、前
記Ｘ−Ｙロボットおよび前記２つの垂直移動部に補正を
加えるための状態把握用の認識カメラとを有することを
特徴とするプリント配線板布線機。1. An XY robot, a head fixed to the XY robot, two vertical moving portions held by the head and movable in a vertical direction, and surface mount components exposed on the upper surface. The printed wiring board fixing part that horizontally holds the printed wiring board that is attached to the printed wiring board, and the vertical movement part that holds the wire rod and temporarily fixes the wire rod to the wiring position of the printed wiring board. A fixed chuck part, a heat source part fixed to the other side of the vertical moving part for supplying heat necessary for melting the solder to the wiring part of the printed wiring board, the wire member fixed to the head And a recognition camera for grasping a state for performing the correction of the tip position management, the wiring position management, the heat source tip position management, and the correction of the XY robot and the two vertical moving parts. Printed circuit board wiring machine characterized.
どこされたものであることを特徴とするプリント配線板
布線機。2. The printed wiring board wiring machine according to claim 2, wherein the wire is pre-soldered beforehand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5158294A JPH07101799B2 (en) | 1993-06-29 | 1993-06-29 | Printed wiring board wire machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5158294A JPH07101799B2 (en) | 1993-06-29 | 1993-06-29 | Printed wiring board wire machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0722799A JPH0722799A (en) | 1995-01-24 |
| JPH07101799B2 true JPH07101799B2 (en) | 1995-11-01 |
Family
ID=15668469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5158294A Expired - Fee Related JPH07101799B2 (en) | 1993-06-29 | 1993-06-29 | Printed wiring board wire machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07101799B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1122552C (en) | 1999-05-21 | 2003-10-01 | 崔凤奎 | Toy car |
| JP5050953B2 (en) * | 2008-03-25 | 2012-10-17 | 富士通株式会社 | Wiring work support device |
| CN112601382B (en) * | 2020-12-18 | 2022-01-04 | 南京海索信息科技有限公司 | Wiring device for experiment board and use method thereof |
-
1993
- 1993-06-29 JP JP5158294A patent/JPH07101799B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0722799A (en) | 1995-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4751948B1 (en) | Component mounting apparatus and component mounting method | |
| JPH07101799B2 (en) | Printed wiring board wire machine | |
| CN105983739B (en) | Solder paste welding device and method | |
| JPH11233910A (en) | Method for mounting component | |
| JPH06302947A (en) | Automatically correcting equipment for imperfect soldering | |
| JPH10209622A (en) | Method for mounting insertion-type component | |
| US20220416118A1 (en) | Component mounting method, and component mounting system | |
| EP0521338B1 (en) | Method and arrangement for soldering surface mounted components on printed circuit boards | |
| JPH03248768A (en) | Improved hot bar suspension device | |
| JP2990866B2 (en) | Electronic component mounting equipment | |
| CN213497398U (en) | Integrated circuit board packaging and welding jig | |
| EP0305696B1 (en) | Process for desoldering glued smd components | |
| JP2001119199A (en) | Working machine for electronic component and working and mounting machine for electronic component | |
| JP2531359Y2 (en) | Electronic component lead forming equipment | |
| JP2573420B2 (en) | Connection terminal soldering method | |
| CN217336092U (en) | FFC welding device | |
| JPS62172800A (en) | Method for automatically mounting free-form leaded parts on printed board | |
| JP3082599B2 (en) | Connector soldering method | |
| JPS60163496A (en) | Printed circuit board | |
| JP2525533B2 (en) | Mounted component insertion device | |
| JPH0319242Y2 (en) | ||
| JPH07176570A (en) | Lead jointing method of ic component | |
| JP2001015906A (en) | Automatic continuous soldering device and its controlling method | |
| JPS61189692A (en) | Circuit pattern correction for printed wiring board | |
| JPH05211390A (en) | Mounting method of surface mounting part |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960416 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |