JPH0515108Y2 - - Google Patents
Info
- Publication number
- JPH0515108Y2 JPH0515108Y2 JP1985082462U JP8246285U JPH0515108Y2 JP H0515108 Y2 JPH0515108 Y2 JP H0515108Y2 JP 1985082462 U JP1985082462 U JP 1985082462U JP 8246285 U JP8246285 U JP 8246285U JP H0515108 Y2 JPH0515108 Y2 JP H0515108Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wire beam
- guide body
- base end
- wire guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007689 inspection Methods 0.000 claims description 21
- 238000003780 insertion Methods 0.000 claims description 14
- 230000037431 insertion Effects 0.000 claims description 14
- 238000012360 testing method Methods 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims 2
- 230000001012 protector Effects 0.000 description 16
- 239000011295 pitch Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082462U JPH0515108Y2 (de) | 1985-05-31 | 1985-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082462U JPH0515108Y2 (de) | 1985-05-31 | 1985-05-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61197576U JPS61197576U (de) | 1986-12-10 |
| JPH0515108Y2 true JPH0515108Y2 (de) | 1993-04-21 |
Family
ID=30630200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985082462U Expired - Lifetime JPH0515108Y2 (de) | 1985-05-31 | 1985-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0515108Y2 (de) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587835A (ja) * | 1981-06-30 | 1983-01-17 | インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン | プロ−ブ・アツセンブリ− |
| JPS6011170A (ja) * | 1983-06-30 | 1985-01-21 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 座屈はりテスト・プロ−ブ組立体 |
-
1985
- 1985-05-31 JP JP1985082462U patent/JPH0515108Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587835A (ja) * | 1981-06-30 | 1983-01-17 | インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン | プロ−ブ・アツセンブリ− |
| JPS6011170A (ja) * | 1983-06-30 | 1985-01-21 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 座屈はりテスト・プロ−ブ組立体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61197576U (de) | 1986-12-10 |
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