JPH0514780B2 - - Google Patents

Info

Publication number
JPH0514780B2
JPH0514780B2 JP19645590A JP19645590A JPH0514780B2 JP H0514780 B2 JPH0514780 B2 JP H0514780B2 JP 19645590 A JP19645590 A JP 19645590A JP 19645590 A JP19645590 A JP 19645590A JP H0514780 B2 JPH0514780 B2 JP H0514780B2
Authority
JP
Japan
Prior art keywords
lead
press punching
alloy
content
lead material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP19645590A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0375325A (ja
Inventor
Rensei Futatsuka
Tadao Sakakibara
Masuhiro Izumida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP19645590A priority Critical patent/JPH0375325A/ja
Publication of JPH0375325A publication Critical patent/JPH0375325A/ja
Publication of JPH0514780B2 publication Critical patent/JPH0514780B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP19645590A 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材 Granted JPH0375325A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19645590A JPH0375325A (ja) 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19645590A JPH0375325A (ja) 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP700886A Division JPS62164843A (ja) 1986-01-16 1986-01-16 半導体装置用Ｃｕ合金リ−ド素材

Publications (2)

Publication Number Publication Date
JPH0375325A JPH0375325A (ja) 1991-03-29
JPH0514780B2 true JPH0514780B2 (OSRAM) 1993-02-25

Family

ID=16358097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19645590A Granted JPH0375325A (ja) 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材

Country Status (1)

Country Link
JP (1) JPH0375325A (OSRAM)

Also Published As

Publication number Publication date
JPH0375325A (ja) 1991-03-29

Similar Documents

Publication Publication Date Title
JP2565029B2 (ja) 半導体装置リード材
JP3957391B2 (ja) 剪断加工性に優れる高強度、高導電性銅合金
JPS6254852B2 (OSRAM)
JPH0480102B2 (OSRAM)
JPH06207232A (ja) 電子電気機器用銅合金とその製造法
JP3807475B2 (ja) 端子・コネクタ用銅合金板及びその製造方法
JPS61257443A (ja) 半導体装置用Ｃｕ合金リ−ド素材
JP3459520B2 (ja) リードフレーム用銅合金
JPH0314897B2 (OSRAM)
JPH10324935A (ja) リードフレーム用銅合金およびその製造方法
JP2503793B2 (ja) 打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材
JPH0514780B2 (OSRAM)
JPS64449B2 (OSRAM)
JP2662209B2 (ja) メッキ密着性及びハンダ接合性に優れた電子機器用銅合金とその製造法
JP2994230B2 (ja) Ａｇめっき性が優れた半導体リードフレーム用銅合金
JPS58147140A (ja) 半導体装置のリ−ド材
JPS58147139A (ja) 半導体装置のリ−ド材
JPH11323464A (ja) 耐打抜き金型摩耗性に優れた銅合金および銅合金薄板
JP2576853B2 (ja) はんだ接合強度に優れた電子機器用銅合金とその製造法
JPH11350055A (ja) 耐打抜き金型摩耗性、耐繰り返し曲げ疲労特性およびはんだ付け性に優れた銅合金
JP2001049366A (ja) 耐熱性に優れた高強度高導電性銅合金
JPS6242018B2 (OSRAM)
JPH0380856B2 (OSRAM)
JPH0788546B2 (ja) 電子機器用銅合金とその製造法
JPS6218615B2 (OSRAM)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees