JPH0514548Y2 - - Google Patents
Info
- Publication number
- JPH0514548Y2 JPH0514548Y2 JP1987200460U JP20046087U JPH0514548Y2 JP H0514548 Y2 JPH0514548 Y2 JP H0514548Y2 JP 1987200460 U JP1987200460 U JP 1987200460U JP 20046087 U JP20046087 U JP 20046087U JP H0514548 Y2 JPH0514548 Y2 JP H0514548Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- film resistor
- circuit board
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 50
- 239000004020 conductor Substances 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987200460U JPH0514548Y2 (US07943777-20110517-C00090.png) | 1987-12-30 | 1987-12-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987200460U JPH0514548Y2 (US07943777-20110517-C00090.png) | 1987-12-30 | 1987-12-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104765U JPH01104765U (US07943777-20110517-C00090.png) | 1989-07-14 |
| JPH0514548Y2 true JPH0514548Y2 (US07943777-20110517-C00090.png) | 1993-04-19 |
Family
ID=31490866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987200460U Expired - Lifetime JPH0514548Y2 (US07943777-20110517-C00090.png) | 1987-12-30 | 1987-12-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514548Y2 (US07943777-20110517-C00090.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5386465A (en) * | 1977-01-08 | 1978-07-29 | Mitsubishi Electric Corp | Semiconductor device |
| JPS60124856A (ja) * | 1983-12-09 | 1985-07-03 | Toshiba Corp | 電子部品の製造方法 |
| JPS6049693B2 (ja) * | 1982-01-20 | 1985-11-05 | ロザイ工業株式会社 | スラブの急速焼入れ方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049693U (ja) * | 1983-09-14 | 1985-04-08 | 株式会社日立製作所 | 厚膜回路基板 |
-
1987
- 1987-12-30 JP JP1987200460U patent/JPH0514548Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5386465A (en) * | 1977-01-08 | 1978-07-29 | Mitsubishi Electric Corp | Semiconductor device |
| JPS6049693B2 (ja) * | 1982-01-20 | 1985-11-05 | ロザイ工業株式会社 | スラブの急速焼入れ方法 |
| JPS60124856A (ja) * | 1983-12-09 | 1985-07-03 | Toshiba Corp | 電子部品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01104765U (US07943777-20110517-C00090.png) | 1989-07-14 |
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