JPH0514434Y2 - - Google Patents

Info

Publication number

JPH0514434Y2

JPH0514434Y2 JP1109887U JP1109887U JPH0514434Y2 JP H0514434 Y2 JPH0514434 Y2 JP H0514434Y2 JP 1109887 U JP1109887 U JP 1109887U JP 1109887 U JP1109887 U JP 1109887U JP H0514434 Y2 JPH0514434 Y2 JP H0514434Y2

Authority

JP

Japan

Prior art keywords

melting point

temperature fuse

point metal

metal body

insulating

Prior art date

1986-09-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

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• 239000000758 substrate Substances 0.000 claims description 17
• 239000004020 conductor Substances 0.000 claims description 16
• 238000002844 melting Methods 0.000 claims description 14
• 239000002184 metal Substances 0.000 claims description 14
• 229910052751 metal Inorganic materials 0.000 claims description 14
• 239000011247 coating layer Substances 0.000 claims 1
• 239000010410 layer Substances 0.000 claims 1
• 230000008018 melting Effects 0.000 description 8
• 239000011248 coating agent Substances 0.000 description 7
• 238000000576 coating method Methods 0.000 description 7
• 238000009413 insulation Methods 0.000 description 5
• 238000003780 insertion Methods 0.000 description 4
• 230000037431 insertion Effects 0.000 description 4
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 238000005530 etching Methods 0.000 description 1
• 230000004907 flux Effects 0.000 description 1
• 239000011888 foil Substances 0.000 description 1
• -1 for example Substances 0.000 description 1
• 238000012966 insertion method Methods 0.000 description 1
• 238000009434 installation Methods 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 239000003973 paint Substances 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 239000010409 thin film Substances 0.000 description 1