JPH0514434Y2 - - Google Patents
Info
- Publication number
- JPH0514434Y2 JPH0514434Y2 JP1109887U JP1109887U JPH0514434Y2 JP H0514434 Y2 JPH0514434 Y2 JP H0514434Y2 JP 1109887 U JP1109887 U JP 1109887U JP 1109887 U JP1109887 U JP 1109887U JP H0514434 Y2 JPH0514434 Y2 JP H0514434Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- temperature fuse
- point metal
- metal body
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000011247 coating layer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1109887U JPH0514434Y2 (US06815460-20041109-C00097.png) | 1986-09-24 | 1987-01-27 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14700486 | 1986-09-24 | ||
JP1109887U JPH0514434Y2 (US06815460-20041109-C00097.png) | 1986-09-24 | 1987-01-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63127048U JPS63127048U (US06815460-20041109-C00097.png) | 1988-08-19 |
JPH0514434Y2 true JPH0514434Y2 (US06815460-20041109-C00097.png) | 1993-04-16 |
Family
ID=33100119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1109887U Expired - Lifetime JPH0514434Y2 (US06815460-20041109-C00097.png) | 1986-09-24 | 1987-01-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0514434Y2 (US06815460-20041109-C00097.png) |
-
1987
- 1987-01-27 JP JP1109887U patent/JPH0514434Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63127048U (US06815460-20041109-C00097.png) | 1988-08-19 |