JPH0514430Y2 - - Google Patents

Info

Publication number

JPH0514430Y2

JPH0514430Y2 JP19356486U JP19356486U JPH0514430Y2 JP H0514430 Y2 JPH0514430 Y2 JP H0514430Y2 JP 19356486 U JP19356486 U JP 19356486U JP 19356486 U JP19356486 U JP 19356486U JP H0514430 Y2 JPH0514430 Y2 JP H0514430Y2

Authority

JP

Japan

Prior art keywords

electrodes

electrode

melting point

substrate

point metal

Prior art date

1986-12-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

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• 238000002844 melting Methods 0.000 claims description 18
• 239000002184 metal Substances 0.000 claims description 15
• 229910052751 metal Inorganic materials 0.000 claims description 15
• 230000008018 melting Effects 0.000 claims description 14
• 239000000758 substrate Substances 0.000 claims description 11
• 238000007639 printing Methods 0.000 claims description 5
• 239000002245 particle Substances 0.000 description 8
• 239000000919 ceramic Substances 0.000 description 3
• 230000004907 flux Effects 0.000 description 3
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
• 230000007423 decrease Effects 0.000 description 2
• 230000005611 electricity Effects 0.000 description 2
• 239000003822 epoxy resin Substances 0.000 description 2
• 230000005012 migration Effects 0.000 description 2
• 238000013508 migration Methods 0.000 description 2
• 229920000647 polyepoxide Polymers 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 229910052709 silver Inorganic materials 0.000 description 2
• 239000004332 silver Substances 0.000 description 2
• 230000007704 transition Effects 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229910045601 alloy Inorganic materials 0.000 description 1
• 239000000956 alloy Substances 0.000 description 1
• 239000011230 binding agent Substances 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 239000004020 conductor Substances 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000003111 delayed effect Effects 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000011521 glass Substances 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 239000005355 lead glass Substances 0.000 description 1
• 230000007257 malfunction Effects 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 238000007650 screen-printing Methods 0.000 description 1
• 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
• 238000003466 welding Methods 0.000 description 1