JPH0513608A - Semiconductor device - Google Patents

Abstract

PURPOSE:To miniaturize a frame body constituting a package and to prevent corrosion of the bonding material of a substrate or a frame body by diminishing dispersion in warp or height of a sealing junction with regard to a semiconductor device having a ceramic package. CONSTITUTION:A device comprises: a ceramic-made substrate 1 which mounts a semiconductor chip 2; a frame body 6 formed into a ring out of a material of a coated metal film 8 or a metal material without drawing work and having an opening 7 which surrounds a wiring 4 on the top of the substrate 1; a lid body 9 mounted on the frame body 6; a sealant 12 interposed between the substrate 1 and the frame body 6 and between the frame body 6 and the lid body 9; and an adhesive 11 which makes the semiconductor chip 2 and the lid body 9 adhered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device having a ceramic package.

[0002]

2. Description of the Related Art As shown in FIG. 3, a ceramic IC package has a ceramic substrate 3 on which a semiconductor chip 31 is mounted.
2 and the semiconductor chip 31 on the ceramic substrate 32.
The semiconductor chip 31 is sealed by a metal frame 33 that surrounds the frame 33 and a plate-shaped ceramic lid 34 that covers the frame 33.

Gold films 35 and 36 are formed on the upper peripheral edge of the ceramic substrate 32 and the lower surface of the ceramic lid 34, while the surface of the frame 33 is covered with a gold film 37. Further, the inner peripheral portion of the frame body 33 has the ceramic substrate 32.
It is lifted by drawing so as not to come into contact with the wiring 38 on the upper surface.

When the semiconductor chip 31 is sealed, thin-film solder 39 is attached to the center of the ceramic lid 34 while the semiconductor chip 31 is connected to the wiring 38 on the upper surface of the substrate 32, and the ceramic substrate 32 is sealed. The gold-tin alloy material 40 is attached to the peripheral edge of the upper surface. Then, the frame 33 and the ceramic lid 34 are placed in this order on the ceramic substrate 32, placed in a heating furnace, and the solder 39 and the gold-tin alloy material 40 are reflowed to hermetically seal.

[0005]

However, according to such a structure, the width of the frame body 33 is 1 in view of drawing.
Since it is necessary to secure about mm, it hinders the reduction of the outer shape of the package. In addition, there is a disadvantage that the diaphragm-shaped frame body 33 cannot cope with the warp of the sealing joint portion and the stabilization of the height of the sealing portion.

Further, when the ceramic substrate 32, the frame 33 and the ceramic lid 34 are joined, the solder 39 and the gold-tin alloy material 40 are melted, but these joining materials form the surface of the ceramic lid 34 and the like. Since they move along the gold films 35 to 37, these sealing materials are easily mixed and corroded on the outer side of the frame body 33, which causes a problem of appearance failure and crack generation.

The present invention has been made in view of the above problems, and is intended to reduce the warp and height variation of the sealing joint portion, to reduce the size of the frame constituting the package, and to reduce the board and substrate. An object of the present invention is to provide a semiconductor device capable of preventing corrosion of a bonding material such as a frame body.

[0008]

The above-mentioned problems are, as illustrated in FIG. 1, drawn by a ceramic substrate 1 on which a semiconductor chip 2 is mounted and a material coated with a metal film 8 or a metal material. A frame body 6 which is formed in an annular shape without being formed and has an opening 7 surrounding the wiring 4 on the upper surface of the substrate 1, a lid body 9 mounted on the frame body 6, the substrate 1 and the A semiconductor comprising a frame body 9, a sealing material 12 respectively interposed between the frame body 9 and the lid body 6, and an adhesive 11 for bonding the semiconductor chip 2 and the lid body 9 together. Achieved by the device.

[0009]

[Operation] According to the present invention, the frame body is formed into an annular shape without being drawn, and the size of the opening 7 is set so as to surround the wiring 6 on the surface of the substrate 1.

Therefore, since it is not necessary to perform the drawing process, the width of the frame body 6 can be reduced, and the area occupied on the substrate 1 is reduced accordingly, and the semiconductor device can be further miniaturized. It will be possible. Moreover, since the drawing process is not performed, the warp of the sealing joint portion and the variation of the height of the sealing portion are reduced.

Further, a sealing material 12 such as a gold-tin alloy is interposed between the substrate 1, the lid body 9 and the frame body 6, while the width of the frame body 6 is narrowed to increase the distance from the semiconductor chip 2. As a result, the adhesive 11 on the semiconductor chip 2 moves to the outside and is difficult to mix with the encapsulant 12, cracks at the joint are eliminated, and the appearance is improved.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view and a partially enlarged sectional view of an apparatus showing an embodiment of the present invention.

In the figure, reference numeral 1 is a ceramic substrate having a rectangular upper and lower surfaces having a wiring layer (not shown) inside, and the upper surface thereof is connected to the bumps 3 of the semiconductor chip 2 by the TAB method or the flip chip method. The wiring 4 is arranged, and the gold film 5 is formed in the region along the upper surface edge portion.

Reference numeral 6 denotes a Kovar frame body mounted on the substrate 1, which is formed into an annular shape by etching without being drawn, and the central opening 7 does not come into contact with the wiring 4 on the upper surface of the substrate 1. It has become large. Also, the frame body 6
Has almost the same height as the semiconductor chip 2, and
The cross section in the height direction is formed to have a rectangular shape as shown in FIG. 1 (b), and the surface thereof is uniformly covered with the gold film 8.

Reference numeral 9 denotes a plate-shaped ceramic lid which is placed on the upper surface of the frame body 7. The gold film 10 is uniformly formed on the lower surface of the lid, and the area where it abuts the semiconductor chip 2 is provided. Furthermore, solder (Pb / Sn alloy) 11 is attached.
The semiconductor chip 2 is configured to be bonded to the lid body 9 by 1.

Reference numeral 12 is a gold-tin alloy material for adhering the frame 7 between the substrate 1 and the lid 9, which is attached to an annular region along the edges of the substrate 1 and the lid 9. The frame 1 sandwiched between the substrate 1 and the lid 9 is closely fixed by melting and cooling.

Reference numeral 13 in the drawing denotes a pin attached to the lower surface of the ceramic substrate 1. In the above-mentioned embodiment, since the frame body 6 is not drawn,
The width can be reduced to about 0.5 mm, and the area occupied by the substrate 1 is reduced accordingly, and the size of the semiconductor device can be further reduced. Moreover, since the drawing process is not performed, the warp of the sealing joint portion and the variation of the height of the sealing portion are reduced.

The substrate 1 on which the semiconductor chip 2 is mounted, the frame body 6 and the lid body 9 are stacked in this order, and they are placed in a heating furnace (not shown) and heated to about 330.degree. The solder 11 and the gold-tin alloy material 12 are melted.

As a result, the substrate 1 and the lid 9 are made of the gold-tin alloy material 1.
While it is joined to the frame body 6 by means of 2, the frame body 6 is farther from the semiconductor chip 2 than the conventional device, so that the solder 11 on the semiconductor chip 2 does not leak beyond the frame body 6 to the outside of the semiconductor device. Solder 11 and gold-tin alloy material 1 outside
The two never mix. For this reason, corrosion does not occur from the sealed joint and cracks do not occur, and the appearance is also good.

Although the frame 6 is made of Kovar, it is also possible to use a metallized ceramic or the like, or a metal material such as 42 alloy.

[0021]

As described above, according to the present invention, the frame is formed into an annular shape without being drawn, and the size of the opening is wide enough to surround the wiring on the substrate surface. Therefore, the width of the frame body can be reduced, and the area occupied on the substrate can be reduced accordingly, and the size of the semiconductor device can be further reduced.

Moreover, since the drawing process is not performed, it is possible to reduce the warp of the sealing joint portion and the variation of the height of the sealing portion. In addition, while the sealing material such as gold-tin alloy is interposed between the substrate, the lid and the frame, the width of the frame is narrowed to increase the distance from the semiconductor chip, so that the semiconductor chip is fixed. It becomes difficult for the adhesive material to move to the outside and mix with the sealing material, which prevents the occurrence of cracks in the sealing joint and improves the appearance.

[Brief description of drawings]

FIG. 1 is a sectional view showing an apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an apparatus according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing an example of a conventional device.

[Explanation of symbols]

 1 Substrate 2 Semiconductor Chip 3 Bump 4 Wiring 5, 8, 10 Gold Film 6 Frame 7 Opening 9 Lid 11 Solder (Adhesive) 12 Gold Tin Alloy (Encapsulation)

Claims (1)

Claim: What is claimed is: 1. A ceramic substrate (1) on which a semiconductor chip (2) is mounted, and an annular material without being drawn by a material coated with a metal film (8) or a metal material. Formed on the substrate and the substrate (1)
A frame (6) having an opening (7) surrounding the upper wiring (4), a lid (9) placed on the frame (6), the substrate (1) and the frame Sealing material (12) interposed between the body (9), the frame body (9) and the lid body (6), respectively.
And a bonding agent (11) for bonding the semiconductor chip (2) and the lid body (9).