JPH0513551A - 処理装置 - Google Patents

処理装置

Info

Publication number
JPH0513551A
JPH0513551A JP3260909A JP26090991A JPH0513551A JP H0513551 A JPH0513551 A JP H0513551A JP 3260909 A JP3260909 A JP 3260909A JP 26090991 A JP26090991 A JP 26090991A JP H0513551 A JPH0513551 A JP H0513551A
Authority
JP
Japan
Prior art keywords
wafer
transfer
semiconductor wafer
processing
transfer mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3260909A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0584059B2 (enExample
Inventor
Hirotoshi Oshiro
宏利 大城
Masami Akumoto
正巳 飽本
Osamu Hirakawa
修 平河
Noriyuki Anai
徳行 穴井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Tokyo Electron Kyushu Ltd
Original Assignee
Tokyo Electron Ltd
Tokyo Electron Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Tokyo Electron Kyushu Ltd filed Critical Tokyo Electron Ltd
Priority to JP3260909A priority Critical patent/JPH0513551A/ja
Publication of JPH0513551A publication Critical patent/JPH0513551A/ja
Publication of JPH0584059B2 publication Critical patent/JPH0584059B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP3260909A 1991-10-09 1991-10-09 処理装置 Granted JPH0513551A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3260909A JPH0513551A (ja) 1991-10-09 1991-10-09 処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3260909A JPH0513551A (ja) 1991-10-09 1991-10-09 処理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP28080090A Division JPH0666377B2 (ja) 1990-03-30 1990-10-19 処理装置および処理方法およびレジスト処理装置

Publications (2)

Publication Number Publication Date
JPH0513551A true JPH0513551A (ja) 1993-01-22
JPH0584059B2 JPH0584059B2 (enExample) 1993-11-30

Family

ID=17354446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3260909A Granted JPH0513551A (ja) 1991-10-09 1991-10-09 処理装置

Country Status (1)

Country Link
JP (1) JPH0513551A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034000A (en) * 1997-07-28 2000-03-07 Applied Materials, Inc. Multiple loadlock system
EP0800203A3 (en) * 1996-04-04 2001-07-04 Applied Materials, Inc. Multiple load lock system
US6318948B1 (en) * 1998-05-15 2001-11-20 Tokyo Electron Limited Substrate transfer apparatus and substrate processing apparatus
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
KR100471936B1 (ko) * 1996-06-04 2005-09-09 미쓰비시 마테리알 가부시키가이샤 웨이퍼의세정·박리방법및장치
US7158857B2 (en) 1999-04-19 2007-01-02 Applied Materials, Inc. Method and apparatus for aligning a cassette

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0800203A3 (en) * 1996-04-04 2001-07-04 Applied Materials, Inc. Multiple load lock system
KR100471936B1 (ko) * 1996-06-04 2005-09-09 미쓰비시 마테리알 가부시키가이샤 웨이퍼의세정·박리방법및장치
US6034000A (en) * 1997-07-28 2000-03-07 Applied Materials, Inc. Multiple loadlock system
US6450750B1 (en) 1997-07-28 2002-09-17 Applied Materials, Inc. Multiple loadlock system
US6318948B1 (en) * 1998-05-15 2001-11-20 Tokyo Electron Limited Substrate transfer apparatus and substrate processing apparatus
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
US7158857B2 (en) 1999-04-19 2007-01-02 Applied Materials, Inc. Method and apparatus for aligning a cassette

Also Published As

Publication number Publication date
JPH0584059B2 (enExample) 1993-11-30

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