JPH0513510A - Tape carrier for tab - Google Patents

Abstract

PURPOSE:To provide a tape carrier for TAB which has high adhesion to solder resists and can be efficiently manufactured. CONSTITUTION:This tape carrier for TAB is provided with a plated layer 36 on the surface of rolled copper foil 16 and a solder resist layer 38 on the surface of the layer 36 after removing an inner and outer leads 16a and 16b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a TAB (Tape Automat).
ed Bonding) tape carrier.

[0002]

2. Description of the Related Art TAB is a mounting method developed for efficiently mounting highly integrated ICs, and is one in which ICs are continuously mounted on a long tape carrier. Figure 5
The surface structure of the conventional TAB tape carrier is shown in FIG. 6, the cross-sectional structure in the AA direction of FIG. 5 is shown in FIG. 6, and the BB line of FIG.
The cross-sectional structure in each direction is shown.

In manufacturing the conventional TAB tape carrier 10, first, a metal foil 16 is attached by an adhesive 14 onto an insulating film 12 having device holes or the like formed therein. Next, a predetermined wiring pattern is formed on the surface of the metal foil 16 by photoetching, and a solder resist layer 18 is formed as an insulating layer on a portion of the wiring pattern excluding the inner leads 16a and the outer leads 16b. After that, a plating layer 20 of Sn, Au, or the like is formed on the portions where the solder resist 18 is not formed, that is, the inner lead 16a and outer lead 16b portions.

[0004]

However, in the conventional TAB tape carrier as described above, since the plating layer 20 is formed after the solder resist layer 18 is formed on the surface of the conductor pattern, the solder is used in the plating process. There is a disadvantage that the resist layer 18 is eroded by the plating solution and the adhesiveness with the metal foil 16 is lowered. Further, there is a problem that corrosion is likely to occur at the interface between the metal foil 16 and the solder resist layer 18. Further, while the etching process and the plating process are generally liquid treatment processes, the formation of the resist layer 18 performed during the process is a dry process such as printing and thermosetting, which promotes the efficiency of the production of the TAB tape carrier. There was a limit to it. Further, there is a problem that cracks are likely to occur in the solder resist layer 18 due to changes in temperature cycle in the manufacturing process.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a TAB tape carrier which has high solder resist adhesion and can be manufactured efficiently.

[0006]

In order to achieve the above object, the TAB tape carrier according to the present invention has a plating layer formed on the surface of a conductor layer, and then the plating layer excluding inner leads and outer leads. A solder resist layer is laminated on the surface of the.

[0007]

As described above, in the TAB tape carrier according to the present invention, since the solder resist layer is formed on the plating layer, the solder resist layer digs into the rough surface of the plating layer, and the so-called anchor effect is used to form the resist. Adhesion is greatly improved. Further, even if corrosion occurs between the solder resist layer and the plating layer, the conductor layer is not affected. Further, in the manufacturing process, the liquid treatment is continuous such as etching (liquid treatment) -plating treatment (liquid treatment) -resist formation (dry treatment), and the drying operation only needs to be performed once at the final stage. ..

[0008]

An embodiment of the present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 shows a planar structure of a TAB tape carrier according to an embodiment, and FIG. 2 shows A- of FIG.
A sectional structure in the A direction is shown, and FIG. 3 shows a sectional structure in the BB direction in FIG.

The TAB tape carrier 30 includes a flexible insulating film 12 (thickness) made of an organic polyimide in which a device hole 32 for mounting an IC element and a perforation (feed hole) 34 used for positioning are formed. 75 μm, width 35 mm), rolled copper foil 16 (thickness 18 to 35 μm) having a predetermined pattern laminated on the surface of the insulating film 12 with the adhesive 14, and tin, solder, etc. coated on the surface of the copper foil 16. Metallic coating layer 36 (thickness 0.
4 to 0.65 μm) and the solder resist layer 38 (thickness 10 to 10) formed on the surface of the metal coating layer 36 excluding the inner leads 16a and the outer leads 16b.
30 μm).

The insulating film 12 is not limited to the above, but glass reinforced epoxy or the like may be used in addition to polyimide, and the size is 50 to 125 μm in thickness and 4 in width.
It is about 8,70 mm. In addition, the solder resist layer 3
Reference numeral 8 is formed to prevent migration, prevent corrosion of the wiring pattern, and protect the pattern, and a thermosetting epoxy resin or the like is used.

Next, the manufacturing process of the TAB tape carrier 30 constructed as described above will be described with reference to the flowchart of FIG. First, the device holes 32 and the perforations 34 are formed in the insulating film 12 by punching. Next, the rolled copper foil 16 is laminated on the surface of the insulating film 12 with the adhesive 14. Next, a photoresist is coated on the surface of the rolled copper foil 16, a wiring pattern having a predetermined shape is baked and developed, and then an etching solution such as ferric chloride is used to etch the conductor pattern (width 50 μm, pitch 100
μm) 16a, 16b are formed. After that, a plating layer 36 of 0.4 to 0.65 μm is formed on the surfaces of the conductor patterns 16a and 16b by electrolytic plating. Then, finally, the solder resist layer 38 is applied to the rolled copper foil 16 excluding the inner leads 16a and the outer leads 16b and cured in a hot air oven or the like.

As described above, in this embodiment, the solder resist layer 38 is formed on the copper foil 16 coated with the plating layer 36.
Therefore, the solder resist layer 38 digs into the rough surface of the plating layer 36, and the so-called anchor effect significantly improves the adhesion of the resist layer 38. Further, even if corrosion occurs between the solder resist layer 38 and the plating layer 36, the copper foil 16 is not affected, so that no wire breakage occurs. Further, unlike the conventional method, since the liquid treatment is continuous such as etching (liquid treatment) -plating treatment (liquid treatment) -resist formation (dry treatment), the manufacturing efficiency is improved. In addition, the TAB tape carrier 30 manufactured as described above is subjected to PC at 120 ° C. for 5 hours.
As a result of performing T (pressure cooker test),
No problems occurred.

[0014]

As described above, the TA according to the present invention
In the tape carrier for B, the plating layer is formed on the surface of the conductor layer, and then the solder resist layer is formed on the surface of the plating layer excluding the inner lead and the outer lead. There is an effect that it is possible to improve the manufacturing efficiency and to achieve high efficiency manufacturing.

[Brief description of drawings]

FIG. 1 is a plan view showing the structure of a TAB tape carrier according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA of FIG.

FIG. 3 is a sectional view taken along the line BB of FIG.

FIG. 4 is a flow chart showing the manufacturing process of the embodiment.

FIG. 5 is a plan view showing a structure of a conventional TAB tape carrier.

6 is a cross-sectional view taken along the line AA of FIG.

7 is a cross-sectional view taken along the line BB of FIG.

[Explanation of symbols]

 30 TAB Tape Carrier 12 Insulating Film 14 Adhesive 16 Rolled Copper Foil 16a Inner Lead 16b Outer Lead 32 Device Hole 34 Perforation 36 Plating Layer 38 Solder Resist Layer

Claims (1)

Claim: What is claimed is: 1. A TAB tape carrier comprising a conductive layer having a predetermined pattern formed on a surface of an insulating film,
A plating layer is formed on the surface of the conductor layer, and a solder resist layer is formed on the surface of the plating layer excluding inner leads and outer leads.
Tape carrier.