JPH05129870A - Air-tight package for surface mount vibrator - Google Patents

Abstract

PURPOSE:To improve the conductivity, adhesive strength resistance, stability and air-tightness by adopting titanium inclusive silver solder paste print for a ceramic forming board, utilizing forming of a rugged face to the board, and adopting the method of strong welding of a case and a connector and slot fitting fixing of the case. CONSTITUTION:An electrode 3 including a throughhole 2 is provided to a ceramic forming board 1 not by the metallizing system but by titanium inclusive silver solder past print with high adhesive strength to the ceramic with respect to both sides of the board 1 and a welded frame face 3'' of a metallic case K is provided to the front side. A metallic case K used to be covered is positioned and welded to the paste print welded frame face 3'' on the front side of the board. A couple of connection wires R,R' provided to a support plate U of a crystal vibration element or the like are fixed and fitted to throughholes 2,2'.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is to generate a sawtooth wave having a constant frequency for operating semiconductors such as measuring instruments, computer equipment, VTRs, electronic timepieces, IC cards, LSIs and mobile communication bodies. The present invention relates to an airtight container for a surface-mounted oscillator used.

[0002]

2. Description of the Related Art Most of surface mount type vibrators are very small products (for example, length of about 10 mm, height of about 2 to 3 mm), and their bodies have reliable and safe airtightness and conductive performance. Easy production, low cost and mass productivity are important issues. However, the conventional body is composed of a metallized electrode substrate D, as shown in the enlarged cross-sectional view of the main part of the conventional product of FIG. That is, with respect to a substrate G such as a commonly used alumina material, molybdenum, tungsten, etc. are metallized at the electrode portions on the front and back surfaces and the surface portions where the bottom portion of the metal case K is welded, and nickel plating treatment N is performed thereon. Metallized electrodes M on the front and back surfaces of the ultrathin plate electrode made of silver brazing foil a1 by high temperature firing
And a through hole H is provided at a predetermined position, and a silver brazing frame foil a2 welded to the case K is also simultaneously fired on the surface to produce a metallized substrate. A metal case K having a window frame-shaped bottom surface T provided with a window hole W is welded and fixed by simultaneous firing, and a connection line R provided with a support plate portion U for supporting a vibrating element such as a crystal is fitted in the through hole H. In order to prevent the minute gap P generated by fitting the hole and the wire and ensure the conductivity of both,
The configuration is such that two silver brazing rings a3 are fitted vertically and brazed to the fitting hole opening of the connection line R in simultaneous firing.

Therefore, the assembly and manufacture of this container body uses a large number of extremely small parts, a multi-step manufacturing process which requires a high degree of precision due to the metallizing method, and the use of a complicated and expensive carbon jig (not shown). It is done in and. It is a silver brazing foil a1 of an electrode in which a through hole H is provided under a metallized electrode M on both sides of the above-mentioned substrate G of a plated micro chip using the above carbon jig under tweezers work. And a step of fitting the soldered silver brazing frame foil a2 of the metal case K on the front surface side in the jig in a positioned state. Simultaneously, a step of inserting a connecting wire R in which two silver brazing frame foils a2 are fitted vertically into the hole H and fitting it into a jig. A step of positioning a metal case K having a window frame-shaped bottom surface T provided with a window frame W on the surface of the substrate on the frame foil a2 and fitting the metal case K in a jig. With a carbon jig that incorporates each part, high temperature firing (about 1,
000 ° C to 1,100 ° C). This is a very time-consuming manufacturing process, and the supporting plate portion U of the connection line R is made to support a vibrating element such as a crystal according to the intended use, and the case F is hermetically sealed with the lid F to meet the intended use. Surface mount oscillators are manufactured and provided. In addition,
The through hole H, the connecting line R, and the window hole W are all a pair.

As a result, the above-mentioned conventional metallization manufacturing device requires (a) substrate plating treatment and high temperature firing, and
Many silver brazing foil parts, cases, complicated and expensive carbon jigs are used, and the manufacturing cost is high due to the troublesome work and many processes. (B) Due to the slight deviation of the jig and the subtle deviation of each part, defective products are likely to occur frequently, so the jig's high precision and
Jigs are very expensive, due to the need for skilled built-in work
The work efficiency is very low and the manufacturing cost is naturally high. (C) The metallizing method does not lead to strong and safe welding of the silver brazing member unless it is plated and baked at a high temperature, and the plating is an uneconomical measure because it is an essential means for preventing oxidation and increasing the conductivity of the substrate. On the other hand, the metallized silver brazing electrode has low conductivity. (D) The fitting of the connection line R into the through hole H related to metallization is not a surface contact between the circular hole and the line, and therefore a slight gap P is likely to occur. Therefore, the two silver brazing rings a3 are Airtightness and electrical conductivity must be ensured by brazing, the number of parts is large, manufacturing is tedious and uneconomical. (E) Since the metallized surface of the silver brazing foil has a weak bonding force,
Depending on the application, when the protruding wire of the connecting wire R is cut, there is an instability in which the brazing portion to the wire body or the case is damaged by the cutting impact and the airtightness and conductivity are recurred. (F) Further, since the metallized substrate cannot be formed with concavities and convexities on its plate surface, it is not possible to expect reliable and secure attachment of the connector and the case, which is resistant to impact, by utilizing the concavities and convexities. Have many drawbacks such as.

[0005]

DISCLOSURE OF THE INVENTION The present invention is intended to eliminate many of the drawbacks associated with the conventional metallization fabrication described above. It eliminates the troublesome precision assembling work due to the use of precision and expensive jigs and ensures low-cost mass production based on a minimal number of parts savings and a simple manufacturing process. Originally, we realized a product with high airtightness, and with a strong bondability of the titanium-containing silver brazing paste printed surface to the ceramic substrate, a product with strong impact resistance and long-term stable use, and by ceramic molding By utilizing the simple formation of irregularities on the substrate, the strong bonding properties of the paste printing described above and the firm attachment and mounting of the case and connecting lines are further strengthened. By simplifying the manufacturing process, it is convenient to mass-produce ultra-small products at low cost, and it is possible to provide economically highly demanding bodies.

[0006]

[Means for Solving the Problems] An electrode including a through hole is provided on both sides of a ceramic molded substrate by printing a silver brazing paste containing titanium, which has a strong bonding property to the ceramic, instead of a metallizing method, and a metal case is welded to the surface side. A means for providing a frame surface, a means for welding and fixing a metal case to the welding frame surface of the paste printing on the surface of the substrate based on positioning, and a support plate portion for supporting a vibrating element such as a crystal for the through hole are provided. It consists of a fitting means for connecting wires, and in addition to positioning welding of the metal case and fixed welding in accordance with the welding frame surface, a downward bending protrusion is provided on the bottom surface of the case, and a ceramic board In molding, a means for forming a recess for the projection and inserting the projection into the recess, or a pair for inserting the central frame surface of the bottom surface of the case on the substrate surface. Means for providing convex walls and sandwiching the central frame surface between the convex walls, and means for fixing the fitting portion by inserting silver brazing filler metal containing titanium in the recess for fitting the case projecting piece, Further, a concave groove for fitting the lower side portion of the bottomless case is provided on the surface of the substrate, and silver brazing paste containing titanium is printed in the concave groove so that the lower side portion of the case is fitted in the concave groove. And a means for fixing and fitting the bottomless case to the substrate surface by printing welding.

[0007]

[Function] Printing formation of the electrode surface including the through holes by the silver brazing paste containing titanium on the ceramic molded substrate and the welding frame surface on the case has a very strong bondability to the ceramic substrate without plating treatment, Has a very high conductivity, and the attachment of the connecting line to the through hole in the paste printing ensures a conductivity and an airtightness by a tight fit. Further, the paste printed surface is effective for airtightness because it secures a strong fixing and adhesion of the case, and the fixing of the connecting wire also gives impact resistance under certainty. In addition, the case is fixed by fixing the projection or the bottom of the case to the concave and convex parts that are easily provided by molding the ceramic substrate at a fixed position, and by inserting and fixing a homogenous brazing material into the recess, Fixed with high impact resistance. Also, the bottomless case can be attached firmly by fitting the lower side of the case into the groove of the substrate with the paste printing.

[0008]

EXAMPLES Examples of the present invention will be described below with reference to the accompanying drawings. The drawing is an enlarged view considerably larger than the product. First embodiment. The configuration is shown in FIGS. 1 to 3. That is, the plating treatment N is applied to the electrode locations on both surfaces and the surface location where the metal case K is welded in the conventional configuration of FIG.
Then, the metallized electrode M is applied to the through hole H.
And a metallized electrode substrate D provided with a welding frame surface for case welding, and a window frame-shaped bottom surface T provided with a window hole W are welded and fixed to the welding frame surface on the substrate surface. And a connection plate R provided with a support plate portion U for supporting a vibrating element S such as a crystal according to the application, and a connection line R fitted into the through hole H.

The substrate is a ceramic molded substrate 1, and a pair of predetermined through holes 2 and 2'is formed on the substrate 1 by a silver brazing paste printing containing titanium, which has a very strong bond to the ceramic, rather than a metallizing method. Predetermined electrodes 3 and 3'included and a welding frame surface 3 "of the case K provided on the front surface side, and a window frame-shaped bottom surface T provided with opposing window holes W and W'on the welding frame surface 3". The metal case K to be covered is welded and fixed on the basis of positioning, and the supporting plate portion U of the vibrating element S such as crystal is
An airtight container for a surface mount type vibrator, comprising a pair of connecting lines R and R'provided with U'fixed and fitted to the through holes 2 and 2 '.

In the figure, T'is the central frame surface of the window frame bottom surface T of the case. The vibrating element S is mainly crystal, but other combinations of ceramics and auxiliary elements such as coils or transformers and capacitors are also applicable depending on the application. In this case, the supporting plate portions of the connection lines R and R'are applied. The shapes of U and U'will be changed in design so as to be suitable for supporting the target vibration element S.

Second embodiment. With the configuration shown in FIGS. 4 to 6,
At the inner center of the window frame-shaped bottom surface T of the metal case K in the first embodiment facing each other, a positioning facing projection piece 4, 4'is provided for downward bending, and the projection piece 4, 4 is formed on the surface of the substrate in molding a ceramic substrate. 4'is formed with recesses 5 and 5'suitable for fitting,
The airtight container according to the first embodiment, wherein the protrusions 4 and 4'are fitted into the corresponding recesses 5 and 5'and the case is positioned and fixed.

Third embodiment. In the configuration shown in FIGS. 7 and 8, the opposing convex portions are formed on the surface of the ceramic molded substrate 1 at a positioning interval suitable for inserting the center frame surface T ′ of the window frame-shaped bottom surface T of the metal case K in the substrate molding. The airtight container according to the first embodiment, in which walls 6, 6'are provided, and the central frame surface T'is fitted between the convex walls 6, 6'to fix and fix the case.

Fourth embodiment. With the configuration shown in FIG. 9, the facing protrusion 4 of the metal case K provided on the surface of the ceramic molded substrate 1
The airtight container body according to the second embodiment, in which the silver brazing filler metal 7 containing titanium is inserted into the recess 5 into which the tab 4 is fitted, and the protruding piece 4 is fitted and fixed. The connecting line R, the opposing projecting piece 4, and the recess 5 are a pair.

Fifth embodiment. In the configuration shown in FIGS. 10 and 11, the metal case K has no bottom, and the concave groove 8 suitable for inserting the lower side portion of the case is provided in the peripheral portion of the surface of the ceramic molded substrate 1. Titanium-containing silver solder paste printing 9 is applied, the lower side of the case is fitted into the groove 8, and the lower side of the fitting is fixed by welding of the paste printing 9 to fix the bottomless case to the substrate surface. The airtight container body according to the first embodiment, which is fitted. The same reference numerals as those in the first embodiment in the other respective embodiments of the first embodiment indicate the same parts as those in the first embodiment.

Since the present invention has a structure based on each of the above-described embodiments, the titanium-containing silver brazing paste printing on the ceramic molded substrate 1 is different from the conventional metallized structure described above.
No plating or high temperature baking is required, solvent drying is performed by low temperature baking, the bonding strength to the substrate is very strong, the conductivity of the electrodes 3, 3'is high, and the metal case K
The welding and fixing of the connection lines R and R ′ are also strong, and the adhesion and the airtightness due to the fixation of the lid case are secured. Moreover, the paste printing is different from the conventional metallization manufacturing related to the cumbersome tweezers mounting work of a large number of parts for each extremely small substrate material chip, and only a continuous predetermined pattern printing is performed on a large substrate material molded in advance in a large area. Then, the electrodes 3 and 3'which have high conductivity and the through holes 2 and 2 '
Then, the electrode substrate material in which the welding frame surface 3 "having a strong bonding property is continuously produced immediately is manufactured, and the connection lines R and R'are opposed to the holes 2 and 2'of the material, respectively. Even after a simple work process, the metal case K is placed in the welding frame surface 3 "one after another under a certain condition, and the large material is divided into individual electrode substrate chips after the solvent removal and drying by low temperature firing. ,
The body of the present invention is mass-produced. This is because the strong joint surface formed by the paste printing has a strong impact resistance against the division cut impact of the substrate material.

In the ceramic substrate molding, since it is easy to form irregularities on the plate surface, the opposing protrusions 4, 4'provided on the window frame-shaped bottom surface T of the case K are placed in the corresponding recesses 5, 5 '. With the configuration of the second embodiment in which the case is fitted, the positioning and fixing of the case becomes easier, and the opposing convex walls 6 and 6'are provided on the substrate surface so that the central frame surface T'of the bottom surface of the case is fitted. Also in the structure of the third embodiment, the positioning and fixing of the case can be simplified similarly to the above. Further, a silver brazing filler metal 7 containing titanium is put into the recesses 5 and 5'of the second embodiment to fix the fitting portion (for example, a dispenser of the same material paste or welding by filling a homogenous powder). The structure of the embodiment has a high degree of safety because the case K is securely strengthened and the external connection such as cutting the protruding lines of the connection lines R and R ′ is cut depending on the application.

The fitting of the connecting lines R and R'to the through-holes 2 and 2'for highly conductive paste printing results in a reliable fixed contact with the paste printing surface within the holes, which may cause contact failure. Not, as a result of the hole being sealed,
There is no fear of a gap or rattling with respect to the fitting hole, and not only conductivity but also airtightness in correlation with the case sealing. In the fifth embodiment, titanium-containing silver brazing paste printing is performed on the peripheral surface of the substrate. By providing the concave groove 8 provided with, it becomes possible to fit and fix the lower side portion of the non-low case whose manufacturing cost is low.

As a result, according to the present invention, the silver brazing paste containing titanium is printed on the ceramic molded substrate 1, the uneven surface is molded on the substrate, the case and the connector are strongly welded, and the case is fitted in the groove to fix the conductive property. Property, adhesion,
Higher impact resistance, stability and airtightness.

[0019]

As described above, the present invention provides: All the drawbacks of the conventional complicated and uneconomical metallizing method are solved. 2. Printing of silver brazing paste containing titanium on a ceramic plate eliminates the need for metallization plating and high-temperature firing of silver brazing foil, resulting in extremely high production efficiency of electrode substrates. 3. The above-mentioned paste printing has very strong bondability to the ceramic plate, high conductivity of the through holes 2, 2'and electrodes 3, 3 ', and strong removal of the solvent by low temperature firing to strengthen the case and the connector. It is possible to provide a body with excellent long-term stable usability, which ensures high welding fixation and has higher adhesion, airtightness, and impact resistance than metallized products. 4. Since only the ceramic substrate, the silver brazing paste containing titanium, the connector, and the case are required, many parts such as the plating member, the silver brazing foil, and the silver brazing ring member related to the metallizing method are extremely saved and complicated and complicated. No process is required, and an expensive assembling jig that requires high precision is also unnecessary. Therefore, the manufacturing can be greatly facilitated, and the manufacturing cost can be provided at a very low cost. 5. The fitting of the connection lines R and R'has a strong adhesiveness in the through holes 2 and 2'for printing the silver brazing paste containing titanium, so that a contact failure does not occur without assisting the interposition of the silver brazing ring member. Airtightness is also good. 6. Since the production of the electrode substrate is completed by a paste printing of a predetermined pattern by continuing to a large substrate material and cutting the material, the printing technique is also simple, and in this respect also the mass productivity is really low, and as a result, The manufacturing of the ultra-small airtight body will be simplified, and it will be convenient to provide the ultra-small surface-mounted oscillator with good performance at low cost. 7. Since the ceramic plate molding can form concavities and convexities, the concavities and convexities can be used for the locking means, so that the case can be easily locked and fixed, so that the case can be easily positioned and assembled, and the airtightness and impact resistance can be improved. It will be further strengthened. 8. Due to the correlation between the formation of the dents on the substrate and the above-mentioned paste printing, it is possible to form a bottomless case substrate fitting structure that is low in cost, which is useful for providing a cheaper body. There are many remarkable effects such as.

[Brief description of drawings]

FIG. 1 is an enlarged front view of a partial cross section of a device body of the present invention according to a first embodiment.

FIG. 2 is a front view of the electrode substrate of FIG. 1 with a connecting plate fitted therein.

FIG. 3 is a rear view of FIG.

FIG. 4 is a surface view of an electrode substrate according to a second embodiment.

FIG. 5 is a plan view of a partial cross section of the case in which the case is fitted to the electrode substrate of the second embodiment.

6 is a front view of FIG.

FIG. 7 is a surface view of an electrode substrate according to a third embodiment.

FIG. 8 is a diagram of mounting the case on the board of FIG.

FIG. 9 is an enlarged sectional view of a case locking portion of the fourth embodiment.

FIG. 10 is a surface view of an electrode substrate according to a fifth embodiment.

FIG. 11 is a mounting view of the bottomless case on the board of FIG.

FIG. 12 is an enlarged sectional view of an essential part showing an assembled state of a conventional metallization device.

[Explanation of symbols]

 1 Ceramic Molded Substrate 2, 2'Through Hole 3, 3 'Electrode 3 "Welding Frame Surface K Metal Case T Window Frame Bottom T'Center Frame Surface S Vibration Element U, U'Support Plate R, R'Connecting Line 4 , 4'opposite projection piece 5,5 'recess 6,6'opposite convex wall 7 silver brazing filler metal containing titanium 8 concave groove 9 silver brazing paste containing titanium

Claims (5)

[Claims] 1. An electrode substrate having metallized electrodes on both sides and through holes provided at predetermined positions, a metal case for welding and fixing a window frame-shaped bottom surface to a silver brazing foil frame surface of the substrate surface, and vibration of a crystal or the like. Surface mount type vibrator for assembling with connecting wire that supports the element and fits into the through hole. Titanium-containing silver brazing paste printing with high bonding strength to ceramic, not metallized method, on both sides of ceramic molded substrate And means for providing an electrode including a through hole and providing a welding frame surface of a metal case on the surface side,
Means for welding and fixing the metal case to be covered on the welding frame surface of the paste printing on the surface of the substrate based on positioning, and fitting means for connecting wires provided with a supporting plate portion of a vibrating element such as a crystal for a through hole An airtight container for a surface-mount type vibrator, comprising: 2. A positioning facing projecting piece is provided at the center of the inner side of the window frame-shaped bottom surface of the metal case facing downward, and is suitable for corresponding fitting of the projecting piece on the surface of the ceramic molded substrate in molding the ceramic substrate. The airtight container for a surface-mounted vibrator according to claim 1, wherein a recess is formed, and the case is positioned and fixed by fitting the projection into the recess. 3. A ceramic convex substrate is provided with opposing convex walls at a positioning interval suitable for fitting a central frame surface of a window frame-shaped bottom surface of a metal case in the molding of the substrate, and the opposing convex walls are provided between the convex walls. The airtight container for a surface mount type vibrator according to claim 1, wherein the case is fitted in a central frame surface to position and fix the case. 4. A silver brazing filler metal containing titanium is placed in a recess for fitting a facing protrusion of a metal case provided on the surface of a ceramic molded substrate, and the protrusion is fitted and fixed by welding the brazing filler metal. An airtight container for the surface-mounted oscillator according to 2. 5. A concave groove suitable for inserting the lower side portion of the bottomless metal case is provided in the peripheral portion of the surface of the ceramic molded substrate, and a silver brazing paste containing titanium is printed in the concave groove, The airtight container for a surface-mounted oscillator according to claim 1, wherein a lower side of the case is fitted into the groove and the bottomless case is fixedly fitted to the surface of the substrate by welding of the paste printing.