JP3023029U - Electrode substrate for surface mount oscillator - Google Patents

Abstract

(57) [Abstract] [Purpose] A through-hole of a metallized substrate is provided with a diaphragm projecting circle suitable for fitting the hole on the lower side, and a connecting plate of plate processing for supporting a vibrating element such as a crystal By fitting and fitting the fitting base with silver brazing, the number of silver brazing ring parts can be saved and the hole-fitting air-tightness is highly conductive. Enables assembly manufacturing efficiency and inexpensive mass production. [Structure] For a through hole 2 of a metallized substrate 4 provided with a through hole 2, the projection of a connecting plate 9 of a plate processing for supporting a vibrating element such as a crystal provided with a diaphragm projecting circle portion 7 fitted into the hole 2. The circle portion 7 is fitted, and the fitting base is attached to the silver brazing ring 10.
With the structure in which the connection plate 9 is welded and fitted, the airtightness and conductivity of the metallized electrode substrate are increased, and at the same time, parts saving and low-cost manufacturing efficiency are increased.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 INDUSTRIAL APPLICABILITY The present invention is a surface mount type device used for generating a constant frequency sawtooth wave or the like for operating semiconductors such as measuring instruments, computer devices, VTRs, electronic timepieces, IC cards, LSIs, and mobile communication devices. The present invention relates to an electrode substrate for a vibrator.

[0002]

[Prior art]

 As shown in the partial cross-sectional view of the conventional product shown in FIG. 6, a conventional electrode substrate of this type is a silver brazing foil in which a substrate of aluminum or the like is subjected to nickel plating treatment N on metallization of molybdenum, tungsten or the like. Through the metallization process, metallization electrodes 1 and 1'having a predetermined pattern are provided with through holes 2 and 2 ', and a metallization welding frame surface 3 is provided on the surface side to fix the metal case. 2'A pair of opposing connecting lines R and R'provided with supporting plate portions 5 and 5'of the vibrating element, and upper and lower hole fitting portions of the connecting lines R and R'are fitted to achieve welding. It consists of a high temperature firing metallized structure assembled with two silver brazing rings 10, 11, 10 ', 11'.

When the connection lines R and R ′ are fitted into the through holes 2 and 2 ′, a minute gap is generated between the hole and the wire body, and fitting backlash easily occurs, resulting in poor airtightness of the hole. Since the fixing property of the silver brazing foil to the metallized electrode surface is weak and the conductive failure is apt to occur, a total of four silver brazing rings 10, 11, 10 ', 11' of the above-mentioned two upper and lower ones are interposed and welded. As a result of the indispensable structure that the tightness of the hole fitting and the fixed conductivity of the connector to the electrode are secured by close contact fixing, the number of parts is large, and it is possible to fit the four extremely small ring parts. The production of the electrode substrate which requires the process of fitting the connection lines R and R'into holes is very troublesome, inefficient, costly, and uneconomical.

[0004]

[Problems to be solved by the device]

 The above-mentioned conventional connection line mounting is carried out by the fitting mounting of the connecting plate for plate processing, which is provided with the drawing protruding circular part to be fitted into the through hole of the metallized electrode substrate of the silver brazing foil, at the protruding circular part. Eliminates the drawbacks of the above, secures and secures the attachment of the connector to the through hole, as well as conductivity and airtightness, and saves the number of silver brazing ring parts, simplifying the attachment and manufacturing of the connector to the through hole. The purpose of the present invention is to improve the manufacturing efficiency, and to provide an electrode substrate for surface-mounted oscillators that is highly airtight and highly conductive and safe and reliable.

[0005]

[Means for solving the problem]

 Through-holes are provided at predetermined places with metallized electrodes of silver brazing foil, and the metallized substrate on the front side is used to fix the metal case. Through-holes on the metallized substrate are supported by metal plate processing to support vibration elements such as quartz. A connecting plate is formed by drawing a downward projecting circular portion suitable for fitting a through hole into the center of the base plate surface provided with the plate, and forming a horizontal surface from the base plate surface to the substrate surface. In the configuration described above, the diaphragm projecting circle is fitted into the hole under the condition of supporting the vibrating element, and the fitting base is welded with a single silver brazing ring to be airtightly fitted. .

[0006]

[Work]

 When the connecting plate is inserted into the metallized through-hole by inserting and fixing the drawing projection circle part of the connecting plate under the interposition welding of the silver brazing ring, the fitting of the drawing projecting circle part adheres closely to the hole. As a result of contact, the hole is sealed without any looseness, and the airtightness and conductivity are secured and secured under fixing to the electrode surface.

[0007]

【Example】

 Embodiments of the present invention will be described below with reference to the accompanying drawings (FIGS. 1 to 5). The drawing is an enlarged view considerably larger than the product. A substrate made of alumina or the like is metallized with molybdenum, tungsten or the like, and subjected to nickel plating treatment N to perform metallization of a silver brazing foil of an ultrathin plate, and through holes 2 are provided at predetermined positions with a metallized electrode 1 having a predetermined pattern. On the front surface side, the metallized substrate 4 is provided with a support plate portion 5 for a vibrating element S such as a crystal according to the application by using a metal plate processing for the through hole 2 of the metallized substrate 4 for fixing the metal case K by the metallized welding frame surface 3. A connection plate 9 formed by forming a drawing protrusion circular portion 7 having a diameter suitable for fitting into the hole 2 on the lower side with respect to the center of the base plate surface 6 and forming a horizontal plane 8 ahead of the base plate surface 6. On the surface of the substrate, under the condition that the vibrating element S is supported, the aperture projecting circle portion 7 is fitted in the hole 2, and a single silver brazing ring 10 is welded to the fitting base portion. A fitted equipped becomes a configuration in an airtight manner Te. The same reference numerals of the same symbols indicate the same parts, and the through hole 2 and the connecting plate 9 are paired as shown. In the figure, F indicates a lid for sealing the case K.

Most of the surface mount type vibrators are very small products (for example, length 10 mm, height 2 to 3 mm), and their body is important to ensure reliable and safe airtightness and conductivity. For that reason, the airtightness of the connector to the through hole 2 and the conductive mounting structure pose a problem. Further, although the vibrating element S is mainly crystal, other combinations of ceramics and auxiliary elements such as coils or transformers and capacitors are also applicable depending on the application. In this case, the support plate portion 5 of the connecting plate 9 is used. The design of the configuration will be changed so as to be suitable for supporting the target vibrating element S.

Since the present invention has the above-described structure, the metallized through holes 2 and 2 ′ are provided with the pair of plate-shaped connecting connection plates 9 and 9 ′ facing each other, and When the vibrating element S is supported by the supporting plate portions 5 and 5'of the connecting plates 9 and 9 ', and the fitting base portion is welded by the silver brazing rings 10 and 10' to be fitted. The fitting of the projecting circles 7 and 7'into the holes seals the holes to ensure the airtightness of the through holes 2 and 2'and the silver brazing rings 10 and 10 at the fitting base. The welding by means of ', not only secures the sealing of the hole in a single layer, but also secures the conductivity related to the fixing property to the surface of the metallized electrode 1. In addition, the horizontal surfaces 8 and 8'of the connecting plates 9 and 9'become wider in the welding surface in correlation with the base plate surfaces 6 and 6 ', which helps increase the welding and the wide plate surface is used for the hole fitting work. Easy to peel off. ,

[0010]

[Effect of device]

 From the above, the present invention is as follows. By fitting the drawing projection circles 7, 7'of the plate-formed connecting plates 9, 9'to the metallized through-holes 2, 2'and welding the silver base to the fitting base, the holes 2, 2 ' It is possible to manufacture a metallized electrode substrate with safe and secure conductivity and fixed conductivity when attaching the connector to the ', and the airtightness and conductivity of the metallized electrode substrate, which is an important issue in the surface-mounted oscillator, Security is guaranteed. 2. It is easy to fit the holes on the drawing projection circles 7 and 7'of the connecting plates 9 and 9'which are processed by a plate, and only a single silver brazing ring component is required to save parts. Compared with the conventional products, the manufacturing efficiency is extremely high and it is suitable for mass production at low cost because it requires only simple brazing work. 3. The horizontal surfaces 8 and 8'of the connection plates 9 and 9'become larger in welding surface, which is useful for increasing welding, and facilitates hole fitting work. 4. It is convenient to provide a metallized electrode substrate with reliable airtightness and electrical conductivity as described above, which makes it possible to provide an inexpensive surface-mounted oscillator that is easy to manufacture, secures airtightness and electrical conductivity, and is inexpensive. And so on.

[Brief description of drawings]

1 is an enlarged front view of a partial cross section of an electrode substrate of the present invention,
The metal case to be welded and sealed is shown by an imaginary line.

FIG. 2 is a surface view of the electrode substrate of the present invention.

FIG. 3 is a rear view of FIG.

FIG. 4 is a perspective view of a connection plate

5 is an enlarged view of the inside of the chain line, which is the main part of the device of FIG.

FIG. 6 is an enlarged front view of a partial cross section of a conventional product.

FIG. 7: Slope view of silver brazing ring

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metallized electrode 2, 2'Through hole 4 Metallized substrate 5, 5'Support plate part 7, 7'Aperture projecting circle part 8, 8 'Horizontal plane 9, 9' Connection plate 10, 10 'Silver brazing ring

Claims (1)

[Scope of utility model registration request] A through hole 2 is provided at a predetermined position in the metallized electrode 1 of silver brazing foil, and a metallized substrate 4 for fixing the metal case K on the metallized welding frame surface 3 on the front surface side, and a vibrating element S such as a crystal by a metal plate processing. A diaphragm projecting circular portion 7 suitable for fitting the hole 2 is formed on the lower side of the central portion of the base plate surface 6 provided with the support plate portion 5 and the front side of the base plate surface 6 is formed as a horizontal plane 8. The connection plate 9 and the single silver brazing ring 10 fitted in the diaphragm projection circular portion 7 support the connection plate 9 with respect to the through hole 2 on the substrate surface and the supporting plate portion 5 with the vibrating element S. 7
Is fitted in the hole 2, and the fitting base is welded by the silver brazing ring 10 to be fitted in an airtight manner, and an electrode substrate for a surface-mounted oscillator.