JPH051173U - Heater fin unit with jumper wire - Google Patents

Abstract

(57) [Summary] [Purpose] The jumper wire is arranged by effectively utilizing the substantially flat surface portion of the upper surface of the electronic component and its upper space area to improve the mounting density, and at the same time, the amount of heat generated from the electronic component is reduced. It is an object of the present invention to provide a jumper wire unit with a heat dissipation fin that can efficiently dissipate heat. [Structure] A surface which conforms to at least the upper shape of the electronic component 20 mounted on the jumper wire 3 at a position where the jumper wire 3 is straddled is a lower shape, and the upper shape is a convex portion capable of radiating the heat generated by the electronic component 20. It is formed by molding with an insulating material having a good thermal conductivity which is integrally formed into one shape. And
By sandwiching the jumper wire above the electronic component 20, the heat from the electronic component 20 can be efficiently radiated, and the jumper wire can be reliably fixed with a minimum area.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jumper wire unit with a heat radiation fin, and more particularly to an electronic component such as an integrated circuit and a jumper wire unit with a heat radiation fin that can be laid on or straddled.

[0002]

[Prior Art]

 In conventional electronic components such as integrated circuits, circuit patterns are often connected by lead wires or the like. This lead wire is generally called a jumper wire and one lead wire in at least one direction is known.

[0003]

[Problems to be solved and used by the device]

 However, in the conventional jumper wire as described above, when fixing an electronic component having a large number of lead wires, such as an integrated circuit (IC) and a large scale integrated circuit (LSI), to the circuit board, Since the front and back areas of the electronic component itself are relatively large, there is a problem that it is difficult to effectively use the mounting density when fixing to the circuit board.

Further, the number of lead wires of electronic components is increasing steadily with the progress of digitalization in the future. In the electronic circuit board formed in this way, the number of signal lines that should connect the electronic components (between through holes) increases as the density increases, and as a result, expensive double-sided boards or multilayer boards are required. It was necessary to take measures such as using or arranging multiple Jyanpa lines.

The use of the double-sided circuit board or the multi-layer board has a problem of increasing the production cost. Further, as the mounting density of electronic components increases, the amount of heat radiation from these electronic components becomes a problem.

[0006]

[Means for Solving the Problems]

 The present invention has been made for the purpose of solving the above problems, and has the following configuration as one means for solving the above problems. That is, in a jumper wire unit that connects through holes of an electronic circuit board, a surface that matches at least the upper shape of an electronic component mounted on the jumper wire straddling the jumper wire has a lower shape and at least an upper surface. It is formed by molding with an insulating material having a high thermal conductivity, which is integrally formed so as to have a heat radiation fin shape capable of radiating the amount of heat generated by the electronic component.

[0007]

[Action]

 With the above configuration, it is possible to reduce the number of production steps as much as possible, to minimize the labor required for arranging the jumper wires, and to make the type and number of members used effective and simple. For this reason, even when an electronic component such as an IC or LSI is mounted on a circuit board, the substantially flat portion of the upper surface of the electronic component and the upper space area thereof are effectively used for improving the mounting density. Lines can be placed. Along with this, the amount of heat generated from electronic components can be efficiently dissipated.

[0008]

【Example】

 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. 1 is a plan view of an embodiment according to the present invention, FIG. 2 is a right side view of this embodiment, and FIG. 3 is a sectional view taken along the line AA of FIG. 1 of this embodiment. In the figure, reference numeral 1 is a convex portion of a heat dissipation fin provided at a predetermined interval on the jumper wire unit 2 of the present embodiment, which can efficiently dissipate heat generated by an electronic component sandwiched under the heat dissipation fin. It is configured. In this embodiment, a total of seven heat dissipation fin convex portions are provided. 2 is a jumper wire unit in which a large number of jumper wires are integrated and molded, and 3 is a jumper wire (lead wire). In this embodiment, a large number of jumper wires are arranged in parallel in a predetermined number. The number of Jihampa lines can be any desired number.

At the lower portions of both ends of the jumper wire unit 2, lower projecting pieces 4 and 5 for sandwiching an electronic component according to the size of the electronic component on which the jumper wire unit 2 is to be placed are provided. The electronic component is closely sandwiched between the portions 6 sandwiched by the lower protruding pieces 4 and 5. This jumper wire unit 2 is formed by molding the jumper wire 3 with a synthetic resin such as ABS resin or epoxy resin having good thermal conductivity and good insulating properties, and integrally forming a heat dissipation fin having a convex portion 1 formed on the upper part thereof. It is a formed thing.

The jumper wire 3 may have any cross-sectional shape such as a substantially square shape or a circular shape. Further, in this embodiment, the terminal pitch is set to about 2.54 mm in accordance with the terminal pitch of the mounted electronic component or the like. However, this terminal pitch can also be arbitrary. Further, the shape of the convex portion 3 of the heat dissipation fin is not limited to the shape shown in FIG. 2, and may be any shape as long as it is effective for increasing the surface area.

FIG. 4 shows an example of the jumper wire unit 2 of the present embodiment having the above-mentioned configuration, mounted on a circuit board together with actual electronic components. FIG. 4 shows a cross section taken along the line AA of FIG. 1 of the jumper wire unit 2 of this embodiment in which electronic components are sandwiched. In FIG. 4, 10 is a circuit board, and 20 is the sandwiched electronic component of this embodiment.

Prior to mounting the jumper wire unit 2 of this embodiment, first, an electronic component is inserted into a component mounting through hole provided on a substrate. Next, the jumper wire unit 2 of this embodiment is placed on the electronic component (FIG. 4 shows an example in which an integrated circuit is mounted as the electronic component) and is formed between the lower protruding pieces 4 and 5. 6 so that they straddle each other, and insert the jumper wire 3 into the through hole for the jumper wire which is provided outside the mounting position of the electronic component, and pushes it in until it comes into close contact with the upper surface of the electronic circuit component. In this state, the jumper wire 3 expands outward in the through hole. For this reason, the jumper wire unit 2 maintains a close contact state with the electronic parts and is stably fixed.

Therefore, after that, the solder layer or the like may be passed through and soldered and fixed on the substrate. As described above, according to this embodiment, the jumper wire unit 2 can also serve as the heat dissipation fin, and the jumper wire can be disposed on the upper surface of the electronic component. Therefore, even if the packaging density of the electronic circuit board is increased, it is possible to provide a jumper line unit that requires almost no space required for arranging the jumper lines and has a great effect in improving the packaging density.

Further, the heat generated by the electronic parts straddling the jumper wire unit 2 of this embodiment can be efficiently radiated. As described above, according to the present embodiment, even in a board on which an electronic component such as an LSI having a large front and back surface area and a large amount of heat generated by the component itself is mounted, the jumper wire is completely fixed, and It can be installed in the minimum space. In addition, the problem of heat dissipation of electronic parts that generate a large amount of heat can be solved at the same time.

As described above, according to the present embodiment, the production process can be reduced as much as possible, the labor required for arranging the jumper wires can be minimized, and the type and number of members used can be effectively and simply. can do. Therefore, even if at least one electronic component such as an IC or LSI and at least one layer, or an electronic component by the TAB (tape aid bonding) method or the like is mounted on a circuit board, the electronic component The substantially flat portion of the upper surface and the upper space area thereof can be effectively used for improving the mounting density, and the amount of heat generated from electronic components can be efficiently radiated.

[0016]

[Effect of the device]

 As described above, according to the present invention, the production process can be reduced as much as possible, the labor required for arranging the jumper wire can be minimized, and the type and number of members used can be made effective and simple. it can. Therefore, even when an electronic component such as an IC or an LSI is mounted on a circuit board, the substantially flat surface portion of the upper surface of the electronic component and the upper space area thereof are effectively used to improve the mounting density. A jumper wire can be installed. Along with this, the amount of heat generated from electronic components can be efficiently dissipated.

[Brief description of drawings]

FIG. 1 is a plan view showing the configuration of an embodiment according to the present invention,

FIG. 2 is a right side view showing the configuration of the present embodiment,

3 is a sectional view taken along the line AA of FIG.

FIG. 4 is a diagram showing a state where the present embodiment is mounted on an actual board together with electronic components.

[Explanation of symbols]

 1 convex part 2 jumper wire unit 3 jumper wire 4, 5 lower protruding piece 10 substrate 20 electronic component.

Claims (1)

Claims for utility model registration 1. A jumper wire unit for connecting through-holes of an electronic circuit board, wherein the jumper wire has at least an upper shape of an electronic component mounted at a portion straddling the jumper wire. The matching surface has a lower shape, and at least the upper shape is integrally molded so as to have a radiating fin shape capable of radiating the amount of heat generated by the electronic component, and is molded with an insulating material having good thermal conductivity. A jumper wire unit with a heat dissipation fin.