JPH05109800A - Semiconductor device resin sealing method and semiconductor device resin sealing device - Google Patents

Abstract

PURPOSE:To make it possible to release a lead frame from a mold reliably without installing an ejection pin in a cavity portion. CONSTITUTION:Resin drain pots 21 and 22 are formed in cavities 3 and 11 on a molding die and their adjacent part. An ejection pin 23 is installed to a portion corresponding to the resin drain pots 21 and 22. Since the ejection pin 23 pushes the resin cured in the resin drain pots 21 and 22 during mold release, the force of extrusion exerts on the resin portion during mold release. It is, therefore, possible to release a molded article from the molding die without failure, suppressing the generation of a gap on the interface between the lead frames and the resin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation method for a semiconductor device and a resin encapsulation device for a semiconductor device, in which a semiconductor device is resin-encapsulated by a mold.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor device assembled by using a lead frame, a semiconductor device having a thin resin-sealed portion (resin package portion) is resin-sealed by using a molding die having a structure shown in FIG. Was there.

FIG. 3 is a sectional view showing a conventional resin sealing device. In FIG. 1, reference numeral 1 is an upper die surface plate portion, and 2 is an upper die cavity block attached to the upper die surface plate portion 1.
3 is an upper mold cavity, 4 is a gate, 5 is a runner, 6 is a runner upper eject pin, and 7 and 8 are eject pins for ejecting a lead frame described later.

Reference numeral 9 is a lower die surface plate portion, and 10 is the lower die surface plate portion 9.
The lower mold cavity block is attached to the lower mold cavity block 10, and the lower mold cavity block 10 has a lower mold cavity 11. The upper die surface plate portion 1 is provided so as to be vertically movable with respect to the lower die surface plate portion 9, and the upper die cavity block 2 is pressed against the lower die cavity block 10 by a driving device (not shown). It is configured to be tightened.

A lead frame 12 has a semiconductor element (not shown) mounted on the lead frame 12 in a portion corresponding to the upper mold cavity 3 and the lower mold cavity 11. In this example, both sides of the runner 5 are mounted. Two are loaded.

Reference numeral 13 is a runner portion eject pin provided on the lower mold cavity block side, and 14 and 15 are eject pins for ejecting the lead frame 12.

Next, a resin encapsulation method using the conventional resin encapsulation device for a semiconductor device configured as described above will be described. The lead frame 12 is set, the mold is clamped, and the preheated resin is put into the apparatus. Next, a plunger (not shown) is driven to inject the resin into the upper and lower molds (the injection mechanism and the resin injection portion are not shown).

The resin passes through the runner 5 and the gate 4 and is filled in the cavities 3 and 11. After the filling is completed and the resin is solidified, the cavity block is opened above and below the parting surface 16. At this time, the eject pins 6, 7, and 8 are driven to eject the molded product from the upper mold.

After that, the lower eject pins 13, 1
4, 5 are driven to take out the molded product from the lower mold. Although not shown, the upper die surface plate portion 1 and the lower die surface plate portion 9 have an eject pin drive mechanism and a function of keeping the cavity blocks 2 and 10 at a constant temperature.

In this example, since the cavity is small and the cavity is extremely thin, the eject pin cannot be arranged above the cavity. Further, as shown in FIG. 4, the tip end surface of the eject pin projects toward the runner side, and it was difficult for the resin portion to release from the eject pin.

FIG. 4 is an enlarged view showing a tip portion of an eject pin used in a conventional resin sealing device.

[0012]

However, since the conventional resin sealing device for a semiconductor device is constructed as described above, the lead frame is pushed when the molded product is ejected from the cavity block. As shown, there are problems that a gap is generated at the interface between the resin package portion and the lead frame, and the release is unstable.

FIG. 5 is a view showing a state where the lead frame is released from the conventional resin sealing device. Figure 5
In the figure, reference numeral 17 denotes a resin package, and 18 denotes a gap generated at the interface between the resin package 17 and the lead frame 12.

[0014]

According to a method of resin-sealing a semiconductor device according to the present invention, when a lead frame is loaded in a resin-sealing mold and a sealing resin is supplied to the cavity, the resin is adjacent to the cavity. The resin solidified in the resin reservoir is pressed by the eject pin when the sealing resin is poured into the resin reservoir and the lead frame is released from the mold by the eject pin after the resin is solidified.

The resin encapsulation device for a semiconductor device according to the present invention forms a resin reservoir portion into which a sealing resin flows in a portion adjacent to a cavity in a molding die, and eject pin is formed in a portion corresponding to the resin reservoir portion. Is provided.

[0016]

According to the present invention, since the eject pin pushes the resin solidified in the resin reservoir portion at the time of releasing, the pressing force applied at the time of releasing acts on the resin portion.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to FIGS. FIG. 1 is a cross-sectional view showing a resin sealing device for a semiconductor device according to the present invention, and FIG. 2 is a diagram showing a tip portion of an eject pin used in the resin sealing device for a semiconductor device according to the present invention. In these figures, the same or equivalent members as those described in FIGS. 3 to 5 are designated by the same reference numerals, and detailed description thereof will be omitted.

In these figures, 21 is an upper mold resin reservoir formed in the upper mold cavity block 2, 22 is a lower mold resin reservoir formed in the lower mold cavity block 10, and these resin reservoirs 21, 22 is formed adjacent to the upper mold cavity 3 and the lower mold cavity 11,
The sealing resin is made to flow from these cavities.

Reference numeral 23 is an eject pin for the reservoir portion, and 24 is an eject pin for the gate portion. The eject pin for the reservoir portion is arranged at a position corresponding to the reservoir portions 21 and 22, and the eject pin 24 for the gate portion is disposed at a portion corresponding to the gate portion. Then, these eject pins are configured to be driven by the upper and lower surface plate portions 1 and 9 in the same manner as the other eject pins.

Further, in this embodiment, the eject pin 23 for the pool portion and the eject pin 24 for the gate portion on the upper die cavity block 2 side are arranged in a portion corresponding to the lead frame 12.

Further, in this embodiment, each eject pin has a resin portion (runner,
It is located at a position retracted by A dimension from the bottom of the gate and the reservoir). The resin is filled in the state shown in FIG. The dimension A is 0.05 mm or more and is, for example, 0.
It is about 1 mm to 0.2 mm.

By retracting the eject pin in this manner, the contact area of the eject pin with the resin portion is reduced, and the tip of the eject pin is easily separated from the resin portion.

Next, a resin encapsulation method for a semiconductor device using the resin encapsulation device configured as described above will be described. It is the same as before until the resin is filled. At the time of resin filling, the resin flows from the upper mold cavity 3 and the lower mold cavity 11 into the resin reservoirs 21 and 22.

After the resin is solidified, the upper and lower molds are opened from the parting surface 16. At this time, eject pins 6 and 2
By driving 3, 24, the molded product is ejected from the upper mold.

After that, the lower eject pins 13, 2
3 and 24 are driven to take out the molded product from the lower mold. In the conventional case, the eject pin is structured to push the lead frame 12, but in the present embodiment, the resin in the resin reservoir portions 21 and 22 which is continuous with the resin solidified in the upper mold cavity 3 and the lower mold cavity 11 is removed. Moreover, since the eject pin position is within the area of the lead frame 12,
There is no gap at the interface between the resin in the cavity and the lead frame 12, and a high-quality sealed product can be obtained.
The releasability is also stable.

Therefore, at the time of mold release, the resin reservoir 2
Since the eject pin 23 pushes the resin solidified by 1 and 22, the pushing force applied at the time of mold release acts on the resin portion.

Further, as shown in this embodiment, if the resin solidified by the gate 4 is pushed by the eject pin 24, the releasability can be further enhanced.

Further, as shown in this embodiment, when the portions corresponding to the lead frame 12 are pushed by the eject pins 23 and 24, the mold can be reliably released and the release is stable.

[0029]

As described above, according to the resin encapsulation method for a semiconductor device of the present invention, when the lead frame is loaded in the resin encapsulation mold and the encapsulation resin is supplied to the cavity, When the sealing resin is poured into the adjacent resin reservoir and the lead frame is released from the resin after the resin is solidified by the eject pin, the resin solidified in the resin reservoir is pressed by the eject pin. Such a resin sealing device for a semiconductor device is a device in which a resin reservoir portion into which a sealing resin flows is formed in a portion adjacent to a cavity in a molding die, and an eject pin is disposed in a portion corresponding to the resin reservoir portion. Therefore, since the eject pin pushes the resin solidified in the resin reservoir at the time of mold release, the pressing force applied at the time of mold release acts on the resin part. That.

Therefore, even if the resin cured in the cavity cannot be pushed by the eject pin, the molded product can be reliably released from the mold while suppressing the formation of a gap at the interface between the resin and the lead frame.

[Brief description of drawings]

FIG. 1 is a sectional view showing a resin sealing device for a semiconductor device according to the present invention.

FIG. 2 is a diagram showing a tip end portion of an eject pin used in the resin sealing device for a semiconductor device according to the present invention.

FIG. 3 is a cross-sectional view showing a conventional resin sealing device.

FIG. 4 is an enlarged view showing a tip portion of an eject pin used in a conventional resin sealing device.

FIG. 5 is a diagram showing a state in which a lead frame is released from a conventional resin sealing device.

[Explanation of symbols] 2 upper mold cavity block 3 upper mold cavity 4 gate 5 runner 10 lower mold cavity block 11 lower mold cavity 12 lead frame 21 resin reservoir 22 resin reservoir 23 eject pin

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[Procedure amendment]

[Submission date] July 8, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0002

[Correction method] Change

[Correction content]

[0002]

2. Description of the Related Art Conventionally, in a semiconductor device having a small resin sealing portion (resin package portion) among semiconductor devices assembled using a lead frame, resin molding is performed using a molding die having a structure shown in FIG. It had been.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction content]

[0014]

According to a method of resin-sealing a semiconductor device according to the present invention, when a lead frame is loaded in a resin-sealing mold and a sealing resin is supplied to the cavity, the resin is adjacent to the cavity. When the lead frame is released by the eject pin after the resin is solidified by pouring the sealing resin into the resin pool ,
The resin solidified at the gate portion is pressed by the eject pin.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0015

[Correction method] Change

[Correction content]

The semiconductor device for resin sealing apparatus according to the present invention forms a resin reservoir that the sealing resin flows at a site adjacent to the cavity in the mold, the parts corresponding to the resin reservoir and the gate portion , Eject pins are provided.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Change

[Correction content]

Therefore, at the time of mold release, the resin reservoir 2
The resin solidified by 1, 2 and gate 4 is eject pin 2
Since 3 and 24 press, the pressing force applied at the time of mold release acts on the resin portion.

[Procedure correction 6]

[Document name to be amended] Statement

[Name of item to be corrected] 0029

[Correction method] Change

[Correction content]

[0029]

As described above, according to the resin encapsulation method for a semiconductor device of the present invention, when the lead frame is loaded in the resin encapsulation mold and the encapsulation resin is supplied to the cavity, When the sealing resin is poured into the adjacent resin reservoir and the lead frame is released by the eject pin after the resin is solidified, the resin reservoir is removed.
The resin solidified at the gate or the gate is pressed by the eject pin, and the resin sealing device for a semiconductor device according to the present invention has a resin reservoir portion in which the sealing resin flows into a portion adjacent to the cavity in the molding die. However, since the eject pin is arranged at the portion corresponding to the resin reservoir and the gate , the eject pin pushes the resin solidified in the resin reservoir at the time of mold release, so the pressing force applied at the time of mold release. Will act on the resin part.

Claims (2)

[Claims] 1. When a lead frame is loaded in a resin sealing mold and a sealing resin is supplied to a cavity,
The resin solidified in the resin reservoir is pressed by the eject pin when the sealing resin is poured into the resin reservoir adjacent to the cavity and the lead frame is released by the eject pin after the resin is solidified. Resin encapsulation method for semiconductor device. 2. A resin encapsulation device for a semiconductor device, comprising a two-divided mold for resin encapsulation in which a lead frame is loaded, and an eject pin for releasing the lead frame after resin encapsulation. A resin for a semiconductor device, characterized in that a resin reservoir portion into which a sealing resin flows is formed in a portion adjacent to a cavity in the molding die, and the eject pin is disposed in a portion corresponding to the resin reservoir portion. Sealing device.