JPH051077Y2 - - Google Patents
Info
- Publication number
- JPH051077Y2 JPH051077Y2 JP2583688U JP2583688U JPH051077Y2 JP H051077 Y2 JPH051077 Y2 JP H051077Y2 JP 2583688 U JP2583688 U JP 2583688U JP 2583688 U JP2583688 U JP 2583688U JP H051077 Y2 JPH051077 Y2 JP H051077Y2
- Authority
- JP
- Japan
- Prior art keywords
- lacquer
- resist
- coating
- nozzle
- device hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004922 lacquer Substances 0.000 claims description 42
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 239000006096 absorbing agent Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2583688U JPH051077Y2 (cg-RX-API-DMAC7.html) | 1988-02-27 | 1988-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2583688U JPH051077Y2 (cg-RX-API-DMAC7.html) | 1988-02-27 | 1988-02-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01129871U JPH01129871U (cg-RX-API-DMAC7.html) | 1989-09-04 |
| JPH051077Y2 true JPH051077Y2 (cg-RX-API-DMAC7.html) | 1993-01-12 |
Family
ID=31246923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2583688U Expired - Lifetime JPH051077Y2 (cg-RX-API-DMAC7.html) | 1988-02-27 | 1988-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH051077Y2 (cg-RX-API-DMAC7.html) |
-
1988
- 1988-02-27 JP JP2583688U patent/JPH051077Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01129871U (cg-RX-API-DMAC7.html) | 1989-09-04 |
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