JPH05107740A - Reticle - Google Patents

Abstract

PURPOSE:To detect whether or not an electrostatic breakdown is caused on a circuit pattern without requiring a large number of man-hours by forming a pattern for easily deciding whether or not the electrostatic breakdown is caused outside the light shield pattern of the reticle. CONSTITUTION:When the circuit pattern 2 and light shield pattern 3 are formed on a glass substrate 1, the electrostatic breakdown check pattern 4 is formed outside the light shield pattern 3. Namely, the electrostatic breakdown check pattern 4 is formed at a corner part of the light shield pattern 3 at a distance less than the minimum pattern interval in the circuit pattern. This pattern 4 is so structured that an acute pattern which causes the electrostatic breakdown more easily than the circuit pattern 2 faces the light shield pattern. Consequently, if the electrostatic breakdown occurs to the circuit pattern 2, an electrostatic breakdown is caused under the condition where the electrostatic breakdown occurs more easily than the circuit pattern 2. For the purpose, only this pattern is checked right before the reticle is used to detect whether or not the electrostatic breakdown occurs to the circuit pattern part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reticle used for manufacturing a semiconductor integrated circuit.

[0002]

2. Description of the Related Art Steppers have become the mainstream of exposure machines for printing circuits on a wafer according to the fine patterning of semiconductor integrated circuits. The stepper uses a reticle having a pattern size 1 to 10 times larger than the pattern size on the wafer. An electron beam exposure apparatus is mainly used for drawing a circuit pattern for creating a reticle. At this time, when a negative type resist that a photosensitive region remains in a subsequent process step is used as a resist that is exposed to an electron beam. As shown in FIG. 5, conventionally, the structure of the completed reticle includes a circuit pattern 2 formed of a light-shielding metal film such as chromium or chromium oxide on a transparent glass substrate 1 and a light-shielding pattern 3 formed around the circuit pattern 2. It consisted of

Further, the structure of the reticle formed when a positive type resist whose photosensitive region is removed in the subsequent process step is used as the resist has the structure shown in FIG.

[0004]

Since the reticle has a structure in which a metal film is formed on a glass substrate which is an insulator, the flow of air in a clean room in which the reticle is manufactured or used, and the reticle It is charged by high-pressure shower water washing with pure water used for washing, or by friction with the reticle carrier of an insulator or the case. When the charge amount is large, it may reach several KV to several + KV. For this reason, a discharge phenomenon occurs in the pattern area of the reticle, and a part of the metal pattern is destroyed, so-called electrostatic breakdown may occur. If the above-mentioned electrostatic breakdown occurs in the conventional reticle after the completion of the shipping inspection, a part of the circuit pattern is destroyed, which makes it impossible to manufacture a normal semiconductor integrated circuit and causes a large decrease in diffusion yield. It was. Further, in order to prevent this, it is necessary to inspect the entire pattern area immediately before using the reticle, which requires a great number of man-hours.

[0005]

A reticle of the present invention is a reticle having a circuit pattern formed on one main surface of a transparent substrate and a light-shielding pattern formed around the circuit pattern. It has a pattern for checking the presence or absence of destruction.

[0006]

The present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram of a first embodiment of the present invention. When the circuit pattern 2 and the light shielding pattern 3 are formed on the glass substrate 1, the electrostatic breakdown check pattern 4 is formed outside the light shielding pattern.

FIG. 2 is an enlarged view of the destruction check pattern. Electrostatic breakdown check patterns 4 are formed in the corners of the light-shielding pattern 3 at a distance narrower than the minimum pattern interval existing inside the circuit pattern. The pattern has a structure in which an acute-angled pattern faces the light-shielding pattern so that electrostatic breakdown is more likely to occur than the circuit pattern.

In the reticle configured as described above, when electrostatic breakdown occurs in the circuit pattern, electrostatic breakdown always occurs in the electrostatic breakdown check pattern under the condition that electrostatic breakdown is more likely to occur than in the circuit pattern. To do. Therefore, if only this pattern is inspected immediately before using the reticle, the presence or absence of electrostatic breakdown of the circuit pattern portion can be detected. That is, it is sufficient to re-inspect the circuit pattern portion and inspect for the presence or absence of electrostatic waves only when electrostatic breakdown has occurred in the electrostatic breakdown check pattern, which can greatly reduce the number of steps.

It is obvious that the shape, position and number of the electrostatic breakdown check pattern are not limited to those in this embodiment.

FIG. 3 is a schematic diagram of a second embodiment of the present invention. In contrast to the case where the negative resist is used in the first embodiment, this embodiment is an example in which the reticle is formed using the positive resist. The electrostatic breakdown check pattern is formed in the light-shielding pattern outside the area required as the light-shielding pattern.

FIG. 4 is an enlarged view of the electrostatic breakdown check pattern. A pattern is formed which is independent of the light-shielding pattern and has a shape like that extended in the first embodiment.

[0012]

As described above, according to the present invention, since a pattern for easily determining the presence or absence of electrostatic breakdown is formed on the outer side of the light-shielding pattern of the reticle, the pattern is generated on the number-of-times pattern without using a lot of man-hours. It is effective in detecting the presence or absence of electrostatic breakdown.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing an example of an electrostatic breakdown check pattern according to the first embodiment.

FIG. 3 is a schematic diagram showing a second embodiment.

FIG. 4 is a diagram showing an example of an electrostatic breakdown check pattern according to a second embodiment.

FIG. 5 is a schematic view of a conventional reticle.

FIG. 6 is a schematic view of a conventional reticle.

[Explanation of symbols]

 1 Glass substrate 2 Circuit pattern 3 Light-shielding pattern 4 Electrostatic breakdown check pattern

Claims (1)

[Claims] 1. A reticle having a circuit pattern formed on one main surface of a transparent substrate and a light-shielding pattern formed around the circuit pattern, wherein an electrostatic breakdown check pattern is provided outside the light-shielding pattern. Reticle characterized by.