JPH05107194A - Inspecting apparatus for printed wiring board - Google Patents

Inspecting apparatus for printed wiring board

Info

Publication number
JPH05107194A
JPH05107194A JP3296514A JP29651491A JPH05107194A JP H05107194 A JPH05107194 A JP H05107194A JP 3296514 A JP3296514 A JP 3296514A JP 29651491 A JP29651491 A JP 29651491A JP H05107194 A JPH05107194 A JP H05107194A
Authority
JP
Japan
Prior art keywords
hole
conductive paint
filling
substrate
paint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3296514A
Other languages
Japanese (ja)
Inventor
Masao Akabane
正夫 赤羽根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
CMK Corp
Original Assignee
Nippon CMK Corp
CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp, CMK Corp filed Critical Nippon CMK Corp
Priority to JP3296514A priority Critical patent/JPH05107194A/en
Publication of JPH05107194A publication Critical patent/JPH05107194A/en
Pending legal-status Critical Current

Links

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  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Image Processing (AREA)
  • Closed-Circuit Television Systems (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To enable uniform inspection while achieving a reduction in labor by detecting how a conductive paint fills a through hole with a CCD camera from the opposite side to the side of filling to eliminate the need for visual inspection with a possible automatic inspection. CONSTITUTION:A squeegee 2 is kept running at a specified angle on a substrate 1 to make a conductive paint 3 fill a through hole 4. A detection means 6 has a CCD camera 9 so arranged on the rear of the substrate 1 to face the hole 4 which the paint 3 fills. So, a digital signal of an image of a peripheral part of the hole 4 is displayed visible on a video monitor while the diameter of the paint 3 extruded to the rear of the hole 4 is detected and the resulting detection signal is outputted to a judging means 7. The means 7 compares a data pertaining to the diameter of a land formed at the hole 4 and in the perimeter thereof stored therein with the diameter of the paint 3 inputted from the means 6 to judge the propriety of the filling. When receiving a judging signal of the poor filling level, a control means 8 increases or decreases in the angle of inclination of the squeegee 2 to correct the filling level of the paint 3.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、基板のスルーホールに
導電塗料を充填して基板の表裏両面の回路を導通させる
際の導電塗料の充填量を検査するプリント配線板の検査
装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board inspecting apparatus for inspecting a filling amount of a conductive paint when the through holes of the substrate are filled with the conductive paint so that circuits on both front and back surfaces of the substrate are electrically connected.

【0002】[0002]

【従来の技術】プリント配線板の製造では、基板の表裏
両面に回路を形成すると共に、この表裏両面の回路を相
互に電気的に接続することが行われている。かかる表裏
両面の回路を導通させるためには、基板にスルーホール
を穿設し、このスルーホール内に導電塗料を充填する必
要がある。このため基板の一方の面にスクリーンを介し
てスキージを走行させ、スキージの走行によって導通が
必要なスルーホールへの導電塗料の充填を行っている。
2. Description of the Related Art In the manufacture of printed wiring boards, circuits are formed on both front and back surfaces of a substrate, and the circuits on both front and back surfaces are electrically connected to each other. In order to electrically connect the circuits on both the front and back sides, it is necessary to form a through hole in the substrate and fill the through hole with a conductive paint. For this reason, a squeegee is run on one surface of the substrate through a screen, and conductive paint is filled into the through-holes that require conduction by running the squeegee.

【0003】ところで、このような導電塗料のスルーホ
ール内への充填にあっては、充填量が適切である必要が
ある。充填量が過少の場合には、基板両面の回路の導通
ができず、一方充填量が過剰の場合には基板両面の回路
が導電塗料によって短絡するためである。従って導電塗
料の充填両が適切であるか否かを検査する必要があり、
従来では製造されたプリント配線板を所定枚数毎に抜き
取り、スルーホール内への導電塗料の充填状態をオペレ
ータが目視により検査していた。
By the way, when the conductive paint is filled into the through hole, the filling amount must be appropriate. This is because if the filling amount is too small, the circuits on both sides of the substrate cannot be conducted, while if the filling amount is too large, the circuits on both sides of the substrate are short-circuited by the conductive paint. Therefore, it is necessary to inspect whether the filling of the conductive paint is appropriate,
Conventionally, the operator has visually inspected the filled state of the conductive paint in the through holes by pulling out the manufactured printed wiring boards for every predetermined number.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、従来の
オペレータによる目視検査では、オペレータを専用に必
要とするため、プリント配線板の製造の労力軽減を図る
ことが難しい。また、目視検査ではオペレータによって
検査基準が異なるため、画一的な検査を行うことができ
ず、検査ミスが多発していた。
However, in the conventional visual inspection by the operator, it is difficult to reduce the labor for manufacturing the printed wiring board because the operator is required exclusively. Further, in the visual inspection, since the inspection standard differs depending on the operator, it is not possible to perform a uniform inspection, so that inspection errors frequently occur.

【0005】本発明は、このような従来の問題点を考慮
してなされたものであり、導電塗料のスルーホールへの
充填状態を自動的に検出して労力軽減を図ると共に、正
確な検査を可能としたプリント配線板の検査装置を提供
することを目的とする。
The present invention has been made in consideration of the above-mentioned conventional problems, and it is possible to automatically detect the filling state of the conductive paint in the through hole to reduce the labor and to perform an accurate inspection. It is an object of the present invention to provide a possible printed wiring board inspection device.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
本発明は、基板に穿孔されたスルーホール内に導電塗料
を充填して基板表裏両面の回路を導通するプリント配線
板の製造において、前記スルーホールへの充填後の導電
塗料の充填状態を検出するCCDカメラが充填面と反対
側の基板面に臨むように配設されていることを特徴とす
るものである。
In order to achieve the above object, the present invention relates to a method of manufacturing a printed wiring board for filling a through hole formed in a substrate with a conductive paint to conduct circuits on both sides of the substrate. A CCD camera for detecting the filling state of the conductive paint after filling the through hole is arranged so as to face the substrate surface opposite to the filling surface.

【0007】[0007]

【作用】上記構成では、検出手段がスルーホールへの導
電塗料の充填をCCDカメラにより検出するため、オペ
レータによるプリント配線板の抜き取りと、その目視検
査が不要となる。このため、検査のためのオペレータが
不要となり、労力軽減が可能となると共に、画一的な検
査ができ検査ミスがなくなる。
In the above construction, since the detecting means detects the filling of the conductive paint in the through hole with the CCD camera, it is not necessary for the operator to pull out the printed wiring board and visually check it. For this reason, an operator for inspection is not required, labor can be reduced, and uniform inspection can be performed to eliminate inspection errors.

【0008】[0008]

【実施例】図1は本発明が適用された全体構成を示し、
回路が表裏両面に形成された基板1に対してスクリーン
(図示省略)が張設され、このスクリーン上をスキージ
2が走行することにより、導電塗料3が基板1の所定部
位に印刷される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an overall configuration to which the present invention is applied.
A screen (not shown) is stretched on the substrate 1 on which circuits are formed on both front and back surfaces, and the squeegee 2 runs on this screen, whereby the conductive paint 3 is printed on a predetermined portion of the substrate 1.

【0009】本発明はこの基板1に形成されたスルーホ
ール4内に導電塗料3を充填する工程に適用されるもの
である。すなわち、図2に示すように、基板1にはパン
チ、ドリル等によってスルーホール4が貫通状に穿設さ
れると共に、このスルーホール4の周囲の基板1の両面
には回路接続用のランド5が形成されている。
The present invention is applied to the step of filling the conductive paint 3 into the through holes 4 formed in the substrate 1. That is, as shown in FIG. 2, through holes 4 are formed in the substrate 1 in a penetrating manner by a punch, a drill or the like, and lands 5 for circuit connection are formed on both sides of the substrate 1 around the through holes 4. Are formed.

【0010】この基板1に対して、スキージ2が所定角
度αを維持しながら矢印A方向に走行することによって
導電塗料3がスルーホール4内に充填される。これによ
り図3に示すように、導電塗料3が基板1の表裏両面の
ランド5を導通して、基板1の表裏両面に形成されてい
る回路を電気的に接続する。
The squeegee 2 runs in the direction of arrow A while maintaining a predetermined angle α with respect to the substrate 1, so that the conductive paint 3 is filled in the through holes 4. As a result, as shown in FIG. 3, the conductive paint 3 conducts the lands 5 on both the front and back surfaces of the substrate 1 to electrically connect the circuits formed on both the front and back surfaces of the substrate 1.

【0011】このようなスルーホール4内への導電塗料
3の充填に対し、本実施例では図1に示すように、検出
手段6,判定手段7および制御手段8が設けられてい
る。検出手段7はスルーホール4内への導電塗料3の充
填量を検出するものである。この検出手段7は導電塗料
3の充填量を、その充填と反対側の基板面、すなわち基
板1の裏面から検出するものである。このため、検出手
段7は導電塗料の充填側と反対側の基板面に臨むように
設けられたCCDカメラ9を有すると共に、CCDカメ
ラ9からのビデオ画像が入力されるビデオモニタ(図示
省略)を有している。CCDカメラ9は導電塗料3が充
填されるスルーホール4に臨むように、基板1の裏側に
配設されており、スルーホール4周辺部分のビデオ画像
をデジタル化し、そのビデオ信号をビデオモニタに出力
する。ビデオモニタは入力されたビデオ信号をディスプ
レイ(図示省略)に可視表示すると共に、スルーホール
4から基板1の裏側に押し出された導電塗料の径を検出
し、その検出信号を判定手段7に出力する。 なお、C
CDカメラ9としては、ビデオ画像を2値化し、白黒画
像として出力するカメラでも良く、カラー画像として出
力するカメラでも良い。
In order to fill the conductive paint 3 in the through hole 4 as described above, in this embodiment, as shown in FIG. 1, a detecting means 6, a judging means 7 and a controlling means 8 are provided. The detection means 7 detects the filling amount of the conductive paint 3 in the through hole 4. The detection means 7 detects the filling amount of the conductive paint 3 from the substrate surface opposite to the filling, that is, the back surface of the substrate 1. Therefore, the detection means 7 has a CCD camera 9 provided so as to face the surface of the substrate opposite to the side where the conductive paint is filled, and a video monitor (not shown) to which a video image from the CCD camera 9 is input. Have The CCD camera 9 is arranged on the back side of the substrate 1 so as to face the through hole 4 filled with the conductive paint 3. The video image of the peripheral portion of the through hole 4 is digitized and the video signal is output to a video monitor. To do. The video monitor visually displays the input video signal on a display (not shown), detects the diameter of the conductive paint extruded from the through hole 4 to the back side of the substrate 1, and outputs the detection signal to the determination means 7. .. Note that C
The CD camera 9 may be a camera that binarizes a video image and outputs it as a monochrome image, or a camera that outputs it as a color image.

【0012】このような検出手段6は、スルーホール4
から基板1の裏側に押し出された導電塗料3のビデオ画
像をディスプレイに可視表示するため、オペレータはこ
の導電塗料3のビデオ画像を目視することにより、スル
ーホール4内への導電塗料3の充填量の良否を判別する
ことができる。すなわち、スルーホール4から基板1の
裏側に押し出された導電塗料3が基板1裏面のスルーホ
ール4周囲のランド5の内周側を覆った状態であり、し
かも導電塗料3がそのランド5の外周側に、はみ出して
いない場合、充填量が良好であると判別できる。一方、
導電塗料3が基板1裏面のランド5の内周側を覆ってい
ない場合、基板1の表裏両面のランド5が導通していな
いため、不良と判別できると共に、導電塗料3がランド
5の外周面にまではみ出している場合、回路が導電塗料
3によって短絡するため不良と判別できる。
The detecting means 6 as described above is provided in the through hole 4
Since the video image of the conductive paint 3 extruded from the backside of the substrate 1 is visually displayed on the display, the operator visually checks the video image of the conductive paint 3 to check the filling amount of the conductive paint 3 into the through hole 4. The quality of can be determined. That is, the conductive paint 3 extruded from the through hole 4 to the back side of the substrate 1 covers the inner peripheral side of the land 5 around the through hole 4 on the back surface of the substrate 1, and the conductive paint 3 is the outer periphery of the land 5. If it does not extend to the side, it can be determined that the filling amount is good. on the other hand,
When the conductive paint 3 does not cover the inner peripheral side of the land 5 on the back surface of the substrate 1, the lands 5 on both the front and back surfaces of the substrate 1 are not electrically connected, and therefore it can be determined as defective, and the conductive paint 3 forms the outer peripheral surface of the land 5. If it extends beyond the range, it can be determined that the circuit is defective because the circuit is short-circuited by the conductive paint 3.

【0013】従って、導電塗料3の充填後に、基板1を
裏返して目視検査する必要がなくなるため、検査を簡単
に、しかも確実に行うことができる。また、導電塗料3
の充填量の良否を、その充填時に同時に行うことができ
るため、充填補正などの対応を迅速に行うことができ、
プリント配線板の製造を迅速化できると共に、不良品の
発生を防止することができる。さらには、製造されるプ
リント配線板の全てに対しての検査も可能なため、全体
としての品質向上も図ることができる。
Therefore, since it is not necessary to turn over the substrate 1 and visually inspect it after the conductive paint 3 is filled, the inspection can be performed easily and surely. In addition, conductive paint 3
The quality of the filling amount of can be checked at the same time as the filling, so that it is possible to promptly take measures such as filling correction.
It is possible to speed up the production of the printed wiring board and prevent the occurrence of defective products. Furthermore, since it is possible to inspect all manufactured printed wiring boards, it is possible to improve the quality as a whole.

【0014】図3は、CCDカメラ9による導電塗料充
填の良否を検出する別の態様を示す。この場合、CCD
カメラ9はスルーホール4から基板1の裏面に押し出さ
れた導電塗料3の径Dを検出する。検出した導電塗料3
の径Dは検出手段6に送出され、検出手段6から判定手
段7に出力される(図1参照)。判定手段7には導電塗
料3が充填されるスルーホール4の径に関するデータお
よびスルーホール4周囲に形成されたランドの径に関す
るデータが格納されており、判定手段7はこれらの基準
値と、検出手段6から入力された導電塗料の径とを比較
する。
FIG. 3 shows another mode for detecting the quality of the conductive paint filling by the CCD camera 9. In this case, CCD
The camera 9 detects the diameter D of the conductive paint 3 extruded from the through hole 4 to the back surface of the substrate 1. Detected conductive paint 3
The diameter D is sent to the detection means 6 and output from the detection means 6 to the determination means 7 (see FIG. 1). The determination means 7 stores data regarding the diameter of the through hole 4 filled with the conductive paint 3 and data regarding the diameter of the land formed around the through hole 4, and the determination means 7 detects these reference values and detection. The diameter of the conductive paint input from the means 6 is compared.

【0015】この比較において、判定手段7は、(スル
ーホールの径+0.1mm)≦D≦(ランドの径)の場
合、導電塗料3の充填量を良と判定する。一方、導電塗
料3の径Dがスルーホールの径+0.1mmよりも小さい
場合、充填量が不足して基板1の表裏両面のランド5が
導通しないため不良と判定すると共に、導電塗料3の径
Dがランド5の径よりも大きい場合、充填量が過剰で、
基板の回路間が短絡するため不良と判定する。そして、
判定手段7が不良と判定したとき、判定手段7は判定信
号を制御手段8に出力する(図1参照)。
In this comparison, the judging means 7 judges that the filling amount of the conductive paint 3 is good when (the diameter of the through hole + 0.1 mm) ≦ D ≦ (the diameter of the land). On the other hand, when the diameter D of the conductive paint 3 is smaller than the diameter of the through hole +0.1 mm, the filling amount is insufficient and the lands 5 on both the front and back surfaces of the substrate 1 are not electrically connected, so that it is determined to be defective and the diameter of the conductive paint 3 When D is larger than the diameter of the land 5, the filling amount is excessive,
It is determined to be defective because the circuit on the board is short-circuited. And
When the judging means 7 judges that it is defective, the judging means 7 outputs a judgment signal to the control means 8 (see FIG. 1).

【0016】このような判定手段7では、検出手段6か
らの検出信号に基づいて、充填量の良否を機械的に判定
するため、オペレータによる目視検査が不要となり、作
業性が向上する。また、画一的に良否判定を行うことが
できると共に、オペレータによる判定誤差もなくなるた
め、正確な良否判定が可能となる。
Since the determination means 7 mechanically determines the quality of the filling amount on the basis of the detection signal from the detection means 6, visual inspection by an operator is not required and workability is improved. Further, it is possible to make a uniform quality determination and eliminate an error in determination by an operator, so that an accurate quality determination can be performed.

【0017】前記制御手段8は導電塗料3を基板にスク
リーン印刷する印刷機全体の作動を制御するが、本実施
例ではスクリーンを介して、基板1上を走行するスキー
ジ2の傾斜角度αを制御する。この制御手段8は、充填
量不足の判定信号が判定手段7から入力されると、スキ
ージを基板1方向に傾倒させることにより傾斜角度αを
小さくする。これにより、スキージ2による押し出し圧
が増大するため、導電塗料の充填量が増大し、充填不足
が解消する。一方、充填量過剰の判定信号が判定手段7
から入力されると、制御手段8はスキージ2を起立させ
ることにより傾斜角度αを大きくする。これにより、ス
キージ2による押し出し圧が減少するため導電塗料の充
填量が減少し、充填過剰が解消する。
The control means 8 controls the operation of the entire printing machine for screen-printing the conductive paint 3 on the substrate. In this embodiment, the inclination angle α of the squeegee 2 traveling on the substrate 1 is controlled via the screen. To do. When the determination signal indicating that the filling amount is insufficient is input from the determination unit 7, the control unit 8 reduces the inclination angle α by inclining the squeegee toward the substrate 1. As a result, the pushing pressure by the squeegee 2 increases, so that the filling amount of the conductive paint increases and the insufficient filling is eliminated. On the other hand, the determination signal of the excess filling amount is the determination means 7.
The control means 8 raises the squeegee 2 to increase the inclination angle α. As a result, the pushing pressure by the squeegee 2 is reduced, so that the filling amount of the conductive paint is reduced and the overfilling is eliminated.

【0018】従って、このような制御手段8による制御
を行うことにより、スルーホール4内への導電塗料3の
充填と同時に、その充填不足または充填過剰を補正して
一定量の充填量を確保できるため、プリント配線板を迅
速に製造できると共に、不良品発生量が少なくなる。ま
た、適量の導電塗料3を常にスルーホール4内に充填で
きるため、充填後の目視検査も不要となり、作業性が向
上する。
Therefore, by performing the control by the control means 8 as described above, at the same time as the filling of the conductive coating material 3 into the through hole 4, the underfilling or overfilling of the conductive coating material 3 is corrected and a certain filling amount can be secured. Therefore, the printed wiring board can be rapidly manufactured, and the amount of defective products is reduced. Further, since the appropriate amount of the conductive coating material 3 can be always filled in the through hole 4, the visual inspection after the filling is unnecessary, and the workability is improved.

【0019】[0019]

【発明の効果】以上説明したように本発明は、スルーホ
ールへの導電塗料の充填状態を充填と反対側から検出す
るため、自動的な検査が可能となり、オペレータによる
目視検査が不要となり、労力軽減を図ることができると
共に、画一的な検査を行うことができる。
As described above, according to the present invention, since the filling state of the conductive paint in the through hole is detected from the side opposite to the filling side, automatic inspection is possible, and visual inspection by an operator is not required, which is labor intensive. It is possible to reduce the amount and to perform uniform inspection.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示すブロック図である。FIG. 1 is a block diagram showing an embodiment of the present invention.

【図2】導電塗料の充填工程を示す断面図である。FIG. 2 is a cross-sectional view showing a step of filling conductive paint.

【図3】充填の検査工程を示す断面図である。FIG. 3 is a cross-sectional view showing a filling inspection process.

【符号の説明】[Explanation of symbols]

1 プリント配線板 2 スキージ 3 導電塗料 4 スルーホール 5 ランド 6 検出手段 7 判定手段 8 制御手段 9 CCDカメラ 1 Printed Circuit Board 2 Squeegee 3 Conductive Paint 4 Through Hole 5 Land 6 Detection Means 7 Judgment Means 8 Control Means 9 CCD Camera

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H05K 3/00 Q 6921−4E 3/40 K 6736−4E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI Technical display location H05K 3/00 Q 6921-4E 3/40 K 6736-4E

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 基板に穿孔されたスルーホール内に導電
塗料を充填して基板表裏両面の回路を導通するプリント
配線板の製造において、前記スルーホールへの充填後の
導電塗料の充填状態を検出するCCDカメラが充填面と
反対側の基板面に臨むように配設されていることを特徴
とするプリント配線板の検査装置。
1. A manufacturing method of a printed wiring board in which a conductive paint is filled in a through hole formed in a board to conduct circuits on both front and back surfaces of the board, and a filling state of the conductive paint after filling the through hole is detected. The printed wiring board inspecting device is characterized in that the CCD camera is disposed so as to face the surface of the substrate opposite to the filling surface.
JP3296514A 1991-10-17 1991-10-17 Inspecting apparatus for printed wiring board Pending JPH05107194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3296514A JPH05107194A (en) 1991-10-17 1991-10-17 Inspecting apparatus for printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3296514A JPH05107194A (en) 1991-10-17 1991-10-17 Inspecting apparatus for printed wiring board

Publications (1)

Publication Number Publication Date
JPH05107194A true JPH05107194A (en) 1993-04-27

Family

ID=17834529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3296514A Pending JPH05107194A (en) 1991-10-17 1991-10-17 Inspecting apparatus for printed wiring board

Country Status (1)

Country Link
JP (1) JPH05107194A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078291A (en) * 2006-09-20 2008-04-03 Matsushita Electric Ind Co Ltd Method and device for inspecting resin composition inside through-hole
JP2008145300A (en) * 2006-12-11 2008-06-26 Sharp Corp Phosphor layer thickness determination method and manufacturing method of light-emitting device
CN113567433A (en) * 2021-06-09 2021-10-29 中车青岛四方机车车辆股份有限公司 Method and device for detecting adhesive joint

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078291A (en) * 2006-09-20 2008-04-03 Matsushita Electric Ind Co Ltd Method and device for inspecting resin composition inside through-hole
JP2008145300A (en) * 2006-12-11 2008-06-26 Sharp Corp Phosphor layer thickness determination method and manufacturing method of light-emitting device
CN113567433A (en) * 2021-06-09 2021-10-29 中车青岛四方机车车辆股份有限公司 Method and device for detecting adhesive joint

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