JPH0510382Y2 - - Google Patents
Info
- Publication number
- JPH0510382Y2 JPH0510382Y2 JP3182587U JP3182587U JPH0510382Y2 JP H0510382 Y2 JPH0510382 Y2 JP H0510382Y2 JP 3182587 U JP3182587 U JP 3182587U JP 3182587 U JP3182587 U JP 3182587U JP H0510382 Y2 JPH0510382 Y2 JP H0510382Y2
- Authority
- JP
- Japan
- Prior art keywords
- thick
- lead frame
- film printed
- hybrid
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 125000006850 spacer group Chemical group 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3182587U JPH0510382Y2 (enrdf_load_stackoverflow) | 1987-03-06 | 1987-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3182587U JPH0510382Y2 (enrdf_load_stackoverflow) | 1987-03-06 | 1987-03-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63140675U JPS63140675U (enrdf_load_stackoverflow) | 1988-09-16 |
| JPH0510382Y2 true JPH0510382Y2 (enrdf_load_stackoverflow) | 1993-03-15 |
Family
ID=30837917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3182587U Expired - Lifetime JPH0510382Y2 (enrdf_load_stackoverflow) | 1987-03-06 | 1987-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510382Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5241454A (en) * | 1992-01-22 | 1993-08-31 | International Business Machines Corporation | Mutlilayered flexible circuit package |
-
1987
- 1987-03-06 JP JP3182587U patent/JPH0510382Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63140675U (enrdf_load_stackoverflow) | 1988-09-16 |
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