JPH04949B2 - - Google Patents
Info
- Publication number
- JPH04949B2 JPH04949B2 JP60122123A JP12212385A JPH04949B2 JP H04949 B2 JPH04949 B2 JP H04949B2 JP 60122123 A JP60122123 A JP 60122123A JP 12212385 A JP12212385 A JP 12212385A JP H04949 B2 JPH04949 B2 JP H04949B2
- Authority
- JP
- Japan
- Prior art keywords
- aln
- thermal conductivity
- weight
- sintered body
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 18
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 10
- 150000001247 metal acetylides Chemical class 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229910052735 hafnium Inorganic materials 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- 229910052720 vanadium Inorganic materials 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 19
- 239000002184 metal Substances 0.000 description 15
- 239000000843 powder Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000001272 pressureless sintering Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- -1 boric acid nitride Chemical class 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- FQMNUIZEFUVPNU-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co] FQMNUIZEFUVPNU-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910003470 tongbaite Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60122123A JPS61281074A (ja) | 1985-06-05 | 1985-06-05 | メタライズ用高熱伝導性窒化アルミニウム焼結体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60122123A JPS61281074A (ja) | 1985-06-05 | 1985-06-05 | メタライズ用高熱伝導性窒化アルミニウム焼結体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61281074A JPS61281074A (ja) | 1986-12-11 |
JPH04949B2 true JPH04949B2 (ko) | 1992-01-09 |
Family
ID=14828187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60122123A Granted JPS61281074A (ja) | 1985-06-05 | 1985-06-05 | メタライズ用高熱伝導性窒化アルミニウム焼結体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61281074A (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0717453B2 (ja) * | 1985-11-28 | 1995-03-01 | 京セラ株式会社 | 窒化アルミニウム質焼結体およびその製造方法 |
JP2678213B2 (ja) * | 1988-05-27 | 1997-11-17 | 住友電気工業株式会社 | 窒化アルミニウム焼結体の製造方法 |
JPH02271969A (ja) * | 1989-04-12 | 1990-11-06 | Toshiba Ceramics Co Ltd | AlN質焼結体 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49126707A (ko) * | 1973-04-05 | 1974-12-04 |
-
1985
- 1985-06-05 JP JP60122123A patent/JPS61281074A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49126707A (ko) * | 1973-04-05 | 1974-12-04 |
Also Published As
Publication number | Publication date |
---|---|
JPS61281074A (ja) | 1986-12-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4877760A (en) | Aluminum nitride sintered body with high thermal conductivity and process for producing same | |
US4571610A (en) | Semiconductor device having electrically insulating substrate of SiC | |
US4695517A (en) | Composite layer aluminum nitride base sintered body | |
JPH0569797B2 (ko) | ||
US5679469A (en) | Metallized ceramic substrate having smooth plating layer and method for producing the same | |
JPH0261539B2 (ko) | ||
JPS62197379A (ja) | 窒化アルミニウム基板 | |
JPH06296084A (ja) | 高熱伝導体及びこれを備えた配線基板とこれらの製造方法 | |
JPH0243700B2 (ko) | ||
JP3408298B2 (ja) | 高熱伝導性窒化けい素メタライズ基板,その製造方法および窒化けい素モジュール | |
JPH022836B2 (ko) | ||
JPH0969672A (ja) | 窒化けい素回路基板 | |
JPH0323512B2 (ko) | ||
KR20050029128A (ko) | 반도체 장치용 부재 | |
JPH04949B2 (ko) | ||
JPH0313190B2 (ko) | ||
JP3833410B2 (ja) | セラミックス回路基板 | |
JP2563809B2 (ja) | 半導体用窒化アルミニウム基板 | |
JPH04950B2 (ko) | ||
JPH07105464B2 (ja) | 半導体素子搭載用半導体装置 | |
JP2677748B2 (ja) | セラミックス銅回路基板 | |
JPH06166573A (ja) | 高熱伝導性窒化アルミニウム焼結体 | |
JPH0323511B2 (ko) | ||
JP2650044B2 (ja) | 半導体装置用部品間の接続構造 | |
JP3420424B2 (ja) | 配線基板 |