JPH048960B2 - - Google Patents
Info
- Publication number
- JPH048960B2 JPH048960B2 JP2053934A JP5393490A JPH048960B2 JP H048960 B2 JPH048960 B2 JP H048960B2 JP 2053934 A JP2053934 A JP 2053934A JP 5393490 A JP5393490 A JP 5393490A JP H048960 B2 JPH048960 B2 JP H048960B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- liquid
- tank
- plating tank
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 105
- 239000007788 liquid Substances 0.000 claims description 58
- 238000007772 electroless plating Methods 0.000 claims description 11
- 239000000243 solution Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5393490A JPH0375377A (ja) | 1990-03-06 | 1990-03-06 | プリント基板のスルーホールメッキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5393490A JPH0375377A (ja) | 1990-03-06 | 1990-03-06 | プリント基板のスルーホールメッキ装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3792983A Division JPS59161895A (ja) | 1983-03-07 | 1983-03-07 | プリント基板のスルーホールメッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0375377A JPH0375377A (ja) | 1991-03-29 |
| JPH048960B2 true JPH048960B2 (US20020095090A1-20020718-M00002.png) | 1992-02-18 |
Family
ID=12956573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5393490A Granted JPH0375377A (ja) | 1990-03-06 | 1990-03-06 | プリント基板のスルーホールメッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375377A (US20020095090A1-20020718-M00002.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2935335B2 (ja) * | 1993-10-01 | 1999-08-16 | 住友電気工業株式会社 | アンチスキッド制御装置のモータ故障判定装置 |
| JP4692742B2 (ja) * | 2005-06-24 | 2011-06-01 | 富士電機ホールディングス株式会社 | 試料分析装置 |
| US11803047B2 (en) * | 2019-02-04 | 2023-10-31 | Thorlabs Measurement Systems Inc. | Actuator and beam steering mechanism using an actuator |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54155473A (en) * | 1978-05-29 | 1979-12-07 | Hitachi Electronics | Method of plating printed circuit board |
-
1990
- 1990-03-06 JP JP5393490A patent/JPH0375377A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54155473A (en) * | 1978-05-29 | 1979-12-07 | Hitachi Electronics | Method of plating printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0375377A (ja) | 1991-03-29 |
