JPH048451U - - Google Patents
Info
- Publication number
- JPH048451U JPH048451U JP4944790U JP4944790U JPH048451U JP H048451 U JPH048451 U JP H048451U JP 4944790 U JP4944790 U JP 4944790U JP 4944790 U JP4944790 U JP 4944790U JP H048451 U JPH048451 U JP H048451U
- Authority
- JP
- Japan
- Prior art keywords
- silicon substrate
- junction surface
- silicon
- diode
- series
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 1
- 150000003377 silicon compounds Chemical class 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Photovoltaic Devices (AREA)
- Light Receiving Elements (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第１図は本案の一実施例の略断面図、第２図は
他の実施例の略断面図、第３図は従来の一例の略
断面図である。 １ａ，５ａ……Ｎ型シリコン基板、１ｂ，５ｂ
……Ｐ層、２……銀層、３……シリコン酸化膜、
４，４−１……酸化膜、５ｂ……Ｐ層、６，６−
１……Ｐ電極、７……インタコネクタ、８，９，
９−１……Ｎ電極。
他の実施例の略断面図、第３図は従来の一例の略
断面図である。 １ａ，５ａ……Ｎ型シリコン基板、１ｂ，５ｂ
……Ｐ層、２……銀層、３……シリコン酸化膜、
４，４−１……酸化膜、５ｂ……Ｐ層、６，６−
１……Ｐ電極、７……インタコネクタ、８，９，
９−１……Ｎ電極。
Claims (1)
- 第１のシリコン基板のＰＮ接合面に対向するよ
うに、第２のシリコン基板のＰＮ接合面を直列又
は並列に接続できるように配置し、第２のシリコ
ン基板の他方の面に金属層を介してシリコン化合
物の膜を有するダイオード。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4944790U JP2509647Y2 (ja) | 1990-05-11 | 1990-05-11 | ダイオ―ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4944790U JP2509647Y2 (ja) | 1990-05-11 | 1990-05-11 | ダイオ―ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH048451U true JPH048451U (ja) | 1992-01-27 |
| JP2509647Y2 JP2509647Y2 (ja) | 1996-09-04 |
Family
ID=31567148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4944790U Expired - Fee Related JP2509647Y2 (ja) | 1990-05-11 | 1990-05-11 | ダイオ―ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509647Y2 (ja) |
-
1990
- 1990-05-11 JP JP4944790U patent/JP2509647Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2509647Y2 (ja) | 1996-09-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |