JPH0480554A - Motor integral type air conditioner - Google Patents

Abstract

PURPOSE:To enable cooling of an element by utilizing a refrigerant without using a large aluminum block and an axial-flow fan by a method wherein a power semiconductor module is mounted on a shell to which a motor and an air conditioner are securely held in a closed state. CONSTITUTION:A motor integral type air conditioner comprises a motor 103 and a compressor 104. A suction port 105 and a delivery port 106 are formed in a shell 102 wherein the air conditioner is securely closed. A refrigerant in a low pressure low temperature state flows through a suction port to the shell and produces a high temperature high pressure refrigerant by means of a compressor 104 after the flow of it through the gap of the motor 103. The refrigerant flows through the delivery port 106 to the outside of the shell. For a feed to a motor armature, a power semiconductor module 101 is secured to the shell 102 by weld. A motor armature coil is connected to an output terminal 204, arranged in a shell, through wiring, and a power source and a control signal are connected to an input terminal 202 and a control terminal 203, arranged to the outside of the shell, through a wiring. A low temperature low pressure refrigerant cools a semiconductor module 101 before the refrigerator flows in the compressor 104.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a motor-type air conditioner used in air conditioners, refrigerators, and the like.

[Prior Art] Conventionally, a motor-type air conditioner consists of an induction motor or a DC brushless motor, and an air conditioner that is driven by directly connecting the shaft output of the motor, and these have a refrigerant inlet and outlet. It is held and fixed in an airtight state by a shell with a In this way, in the motor-type air conditioner, the air conditioner and the motor that drives the air conditioner are integrated and hermetically sealed, so that stable quality can be maintained for a long period of time without leakage of refrigerant.

On the other hand, power is supplied to the motor through a hermetic connector having a plurality of terminals on the inside and outside of the shell, which is fixed by welding or the like to keep the shell sealed. The motor windings inside the shell are wired to a hermetic connector using faston terminals, etc., and the hermetic connector terminals outside the shell connect to an output switch for an external cantering circuit, such as a three-phase bipolar output. Connected to a power semiconductor element. In addition, element structures such as 1-wire packages and module structures in which multiple power semiconductor elements are enclosed within an 1-package are also used, and these are used in a variety of applications such as inverters, motor drive circuits, and UPS. ing.

Since power semiconductor elements cannot be ideal switches, energy loss occurs inside the switch and is converted into heat as Joule loss. Therefore, when using these power semiconductor devices, it is necessary to consider cooling.

In a typical configuration for cooling semiconductor devices, an aluminum block with extremely high thermal conductivity is prepared, and the heat sink of the power semiconductor device is placed between the aluminum block and silicone grease, etc., which has relatively good thermal conductivity. Fix tightly. This will suffice as long as the aluminum block is large enough to handle the Joule heat generated due to internal loss of the element, and the atmosphere can be sufficiently cooled.

However, these are incorporated into the drive circuit, and forced cooling is often required in a confined space or a tightly closed atmosphere, so the aluminum block is designed to have a larger surface area. The device is cooled by combining it with an axial fan or blower. When power semiconductor modules are used, they are usually used with forced air cooling as described above.

[Problems and objects to be solved by the invention] However, when an aluminum block and an axial fan are used to cool the device as described above, a very large space is required compared to the volume of the device itself, and the drive circuit is This is a major factor hindering miniaturization.

An object of the present invention is to provide a structure in which an element can be cooled using a refrigerant used in a motor-type air conditioner without using a large aluminum block and an axial fan.

[Means for Solving the Problem] The present invention provides a motor-type air conditioner, characterized in that a power semiconductor module is attached to a shell that holds and fixes the motor and the air conditioner in a sealed state. Machine.

[Example] The configuration of a motor-type air conditioner according to the present invention will be explained based on FIG. 1. The motor-type air conditioner consists of 103 motors and 104 compressors, and 1
The 02 shell is provided with an inlet 105 and an outlet 106, and the refrigerant in a low-pressure and low-temperature state flows into the shell from the inlet 105, passes through the gap of the motor 103, becomes high-temperature and high-pressure refrigerant by the compressor 104, and is refrigerated at 106. It flows out of the shell from the discharge port. Power supply line to the motor armature Conventionally, power was supplied by connecting wiring using a terminal block (not shown) that was fixed to the shell and had connection terminals inside and outside in order to maintain a sealed state inside the shell. The 101 power semiconductor module is fixed to the 102 shell by welding or the like, the motor armature coil is wired to the output terminal arranged inside the shell, and the power and control signals are sent to the input terminal and control terminal arranged outside the shell. Connect the wiring. The low temperature, low pressure refrigerant cools the 101 power semiconductor module before entering the 104 compressor.

Next, an example of the package structure of the power semiconductor module of the present invention will be explained with reference to FIG. 201 chip is 205
Adhesively fixed on a base material insulated from the housing, 2
An input terminal 02 and a control terminal 203 are appropriately arranged on the upper lid of 207, and are fixed by wiring to predetermined positions of chip 201, respectively. This example shows a module configuration in which six basic switch elements are arranged in a housing 205 to obtain a three-phase bipolar output.
7. Two 202 input terminals (10, -) and 2 on the top lid, respectively.
03 control terminals (Gl, El to G6.E6) are arranged and fixed, and the above-mentioned upper lid is made by pouring heated fluidized synthetic resin etc. into the gap with the 205 housing and cooling and solidifying it. Fixed.

On the other hand, three output terminals 204 are arranged in a direction protruding from the bottom surface of the 205 housing, and are hermetically fixed to the housing with a 206 sealant, and wired to a predetermined position on the 201 chip.

[Effects of the Invention] According to the above configuration, since the power semiconductor module can be directly attached to the shell, the power semiconductor module can be cooled with a low-temperature, low-pressure refrigerant. This eliminates the need for a fan, which contributes to cost reduction, and also contributes to miniaturization of the drive circuit, since no space is required for the power semiconductor module, aluminum block, and axial fan within the drive circuit. Furthermore, since the power semiconductor module functions as a terminal block for wiring connections between the inside and outside of the shell, there is no need to use a dedicated terminal block, and conventionally the power semiconductor module and terminal block were connected. No need for wiring connection terminals.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the configuration of a motor type air conditioner according to the present invention. FIG. 2 is a diagram illustrating an example of the package structure of the power semiconductor module of the present invention. shell. Outlet. Chip. Output terminal. Top lid. 103 motor, 104 inlet. 106 mechanical seal 202 input terminal, 203 control terminal. 205 housing, 206 sealant. 101 power semiconductor module. Applicant: Seiko Epson Co., Ltd. Representative Patent Attorney Kizobe Suzuki and one other personC) Figure 2Cb)

Claims (3)

[Claims] (1) A motor-type air conditioner characterized in that a power semiconductor module is attached to a low-pressure chamber of the air conditioner. (2) The motor-type air conditioner according to claim 1, characterized in that a power semiconductor module is attached to the low-pressure side of the shell that holds and fixes the motor and the air conditioner in a sealed state. (3) The motor-type air conditioner according to claim 1, characterized in that a power semiconductor module is attached to an accumulator installed outside the motor-type air conditioner.