JPH0479157B2 - - Google Patents
Info
- Publication number
- JPH0479157B2 JPH0479157B2 JP613685A JP613685A JPH0479157B2 JP H0479157 B2 JPH0479157 B2 JP H0479157B2 JP 613685 A JP613685 A JP 613685A JP 613685 A JP613685 A JP 613685A JP H0479157 B2 JPH0479157 B2 JP H0479157B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- protective layer
- upper cladding
- cladding layer
- gaas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 76
- 238000005253 cladding Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 25
- 239000011241 protective layer Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 16
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 14
- 238000001704 evaporation Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 12
- 230000008020 evaporation Effects 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 230000031700 light absorption Effects 0.000 claims description 10
- 230000002265 prevention Effects 0.000 claims description 7
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims 1
- 239000002019 doping agent Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 235000002597 Solanum melongena Nutrition 0.000 description 1
- 244000061458 Solanum melongena Species 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP613685A JPS61164291A (ja) | 1985-01-16 | 1985-01-16 | 半導体レ−ザの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP613685A JPS61164291A (ja) | 1985-01-16 | 1985-01-16 | 半導体レ−ザの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61164291A JPS61164291A (ja) | 1986-07-24 |
| JPH0479157B2 true JPH0479157B2 (cs) | 1992-12-15 |
Family
ID=11630086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP613685A Granted JPS61164291A (ja) | 1985-01-16 | 1985-01-16 | 半導体レ−ザの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61164291A (cs) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2717016B2 (ja) * | 1990-03-19 | 1998-02-18 | シャープ株式会社 | 半導体レーザおよびその製造方法 |
| JP4737876B2 (ja) * | 2001-07-24 | 2011-08-03 | 岡本レース株式会社 | 経編組織の芯鞘ニットヤーン、およびその編成方法 |
-
1985
- 1985-01-16 JP JP613685A patent/JPS61164291A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61164291A (ja) | 1986-07-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |