JPH0476946B2 - - Google Patents

Info

Publication number
JPH0476946B2
JPH0476946B2 JP2006869A JP686990A JPH0476946B2 JP H0476946 B2 JPH0476946 B2 JP H0476946B2 JP 2006869 A JP2006869 A JP 2006869A JP 686990 A JP686990 A JP 686990A JP H0476946 B2 JPH0476946 B2 JP H0476946B2
Authority
JP
Japan
Prior art keywords
drying
thick
ceramic body
lid
bottomed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2006869A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03215338A (ja
Inventor
Shuji Nishimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP686990A priority Critical patent/JPH03215338A/ja
Publication of JPH03215338A publication Critical patent/JPH03215338A/ja
Publication of JPH0476946B2 publication Critical patent/JPH0476946B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Insulating Bodies (AREA)
JP686990A 1990-01-16 1990-01-16 有底肉厚陶磁器素体の乾燥方法 Granted JPH03215338A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP686990A JPH03215338A (ja) 1990-01-16 1990-01-16 有底肉厚陶磁器素体の乾燥方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP686990A JPH03215338A (ja) 1990-01-16 1990-01-16 有底肉厚陶磁器素体の乾燥方法

Publications (2)

Publication Number Publication Date
JPH03215338A JPH03215338A (ja) 1991-09-20
JPH0476946B2 true JPH0476946B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-07

Family

ID=11650242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP686990A Granted JPH03215338A (ja) 1990-01-16 1990-01-16 有底肉厚陶磁器素体の乾燥方法

Country Status (1)

Country Link
JP (1) JPH03215338A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7138295B2 (en) 1997-04-04 2006-11-21 Elm Technology Corporation Method of information processing using three dimensional integrated circuits
US7176545B2 (en) 1992-04-08 2007-02-13 Elm Technology Corporation Apparatus and methods for maskless pattern generation
US7193239B2 (en) 1997-04-04 2007-03-20 Elm Technology Corporation Three dimensional structure integrated circuit
US7385835B2 (en) 1992-04-08 2008-06-10 Elm Technology Corporation Membrane 3D IC fabrication

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2527861B2 (ja) * 1991-09-25 1996-08-28 日本碍子株式会社 肉厚セラミック製品の乾燥方法
JP5874973B2 (ja) * 2012-03-19 2016-03-02 日本碍子株式会社 碍管の乾燥方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54158414A (en) * 1978-06-05 1979-12-14 Yuzuru Matsubara Process for drying pottery and other earthen products

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7485571B2 (en) 1992-04-08 2009-02-03 Elm Technology Corporation Method of making an integrated circuit
US7176545B2 (en) 1992-04-08 2007-02-13 Elm Technology Corporation Apparatus and methods for maskless pattern generation
US7615837B2 (en) 1992-04-08 2009-11-10 Taiwan Semiconductor Manufacturing Company Lithography device for semiconductor circuit pattern generation
US7223696B2 (en) 1992-04-08 2007-05-29 Elm Technology Corporation Methods for maskless lithography
US7242012B2 (en) 1992-04-08 2007-07-10 Elm Technology Corporation Lithography device for semiconductor circuit pattern generator
US7385835B2 (en) 1992-04-08 2008-06-10 Elm Technology Corporation Membrane 3D IC fabrication
US7550805B2 (en) 1992-04-08 2009-06-23 Elm Technology Corporation Stress-controlled dielectric integrated circuit
US7479694B2 (en) 1992-04-08 2009-01-20 Elm Technology Corporation Membrane 3D IC fabrication
US7474004B2 (en) 1997-04-04 2009-01-06 Elm Technology Corporation Three dimensional structure memory
US7504732B2 (en) 1997-04-04 2009-03-17 Elm Technology Corporation Three dimensional structure memory
US7138295B2 (en) 1997-04-04 2006-11-21 Elm Technology Corporation Method of information processing using three dimensional integrated circuits
US7193239B2 (en) 1997-04-04 2007-03-20 Elm Technology Corporation Three dimensional structure integrated circuit
US8928119B2 (en) 1997-04-04 2015-01-06 Glenn J. Leedy Three dimensional structure memory
US8933570B2 (en) 1997-04-04 2015-01-13 Elm Technology Corp. Three dimensional structure memory
US9401183B2 (en) 1997-04-04 2016-07-26 Glenn J. Leedy Stacked integrated memory device

Also Published As

Publication number Publication date
JPH03215338A (ja) 1991-09-20

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