JPH0472654A - Package for integrated circuit use - Google Patents

Abstract

PURPOSE:To discriminate pins in a package and to prevent an erroneous wiring operation by a method wherein the thickness of the pins at the package for integrated-circuit use is changed depending on the pins. CONSTITUTION:Pins 2 and pins 3 having a second thickness are formed in a package 1. When the thickness of the pins at the package for integrated-circuit use is changed depending on the pins, the pins in the package are discriminated and it is possible to prevent an erroneous wiring operation and to prevent an integrated circuit from being destroyed. In a package which is symmetric with respect to a line, the thickness of the pins is changed and their thicknesses are made asymmetric with respect to a line. Thereby, when the package is mounted on a socket for package use, it has an effect to prevent a trouble that the integrated circuit is destroyed by an erroneous mounting operation that the right and the left are reversed.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to external connection leads (
(hereinafter referred to as "bin").

[Conventional technology]

FIG. 2 is a top view showing a conventional package, in which (1) is the package and (2) is a bottle of the same thickness. In the conventional package (1), all the pins (2) have the same thickness.

[Problem to be solved by the invention]

Conventional integrated circuit pancases are constructed as described above, and as integrated circuits increase in number of pins, when prototyping a system using integrated circuits, there is a problem that the integrated circuits may be destroyed due to incorrect wiring. There was a point. One of the causes of the above-mentioned wiring errors is that all the pins of an integrated circuit package have the same shape, making it difficult to distinguish them.

The present invention has been made to solve the above-mentioned problem, and aims to provide an integrated circuit package in which the thickness of the pins of the package is differentiated, thereby preventing the occurrence of wiring errors.

[Means to solve the problem]

In the integrated circuit package superior to this invention, the thickness of the pins varies depending on the pins.

[Effect]

By varying the thickness of the bins of integrated circuit packages, the pins of the package can be distinguished and wiring errors can be prevented.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a top view of an integrated circuit package. In the figure, (1) is the package, (2) is the bottle, and (3) is the bottle (
2) is a bottle with a different thickness @2.

The package (1) is provided with a bottle (2) and a bottle (3) of a second thickness.

〔Effect of the invention〕

By varying the thickness of the bins of the integrated circuit package, it is easy to distinguish between the bins of the package, and erroneous wiring is prevented and damage to the integrated circuit is prevented.

In addition, in the case of a linearly symmetrical package, by changing the thickness of the bottle to eliminate the linear symmetry, it is possible to damage the integrated circuit if the package is inserted incorrectly upside down or left/right when inserted into the package socket. It also has the effect of preventing such troubles.

[Brief explanation of drawings]

Fig. 1 is a top view of an integrated circuit bag according to an embodiment of the present invention, and Fig. 2 is a top view of a conventional integrated circuit package. (3
) is the second-thickness bin. In addition, in the figure, 8 digits are the same.

Claims (1)

[Claims] 1. An integrated circuit package having a plurality of external connection leads, characterized in that the external connection leads are provided with a plurality of different thicknesses.