JP2788816B2 - IC package positioning device - Google Patents
IC package positioning deviceInfo
- Publication number
- JP2788816B2 JP2788816B2 JP6446492A JP6446492A JP2788816B2 JP 2788816 B2 JP2788816 B2 JP 2788816B2 JP 6446492 A JP6446492 A JP 6446492A JP 6446492 A JP6446492 A JP 6446492A JP 2788816 B2 JP2788816 B2 JP 2788816B2
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- package
- positioning device
- bearing
- bearings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はＩＣパッケージ位置決め
装置に関し、特にＩＣパッケージに半導体素子を実装す
る半導体装置用のマウンタの位置決め装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package positioning apparatus, and more particularly to a mounter positioning apparatus for a semiconductor device in which a semiconductor element is mounted on an IC package.
【０００２】[0002]
【従来の技術】従来、この種のマンウンタの位置決め装
置は、図２の上面図に示すような１対の位置決め爪１
ｂ，１のうち片側の位置決め爪１ｂに固定された２個の
ＸＹ方向位置決めベアリング６と、もう片側の位置決め
爪１に固定された２個のＸＹ方向位置決めベアリング３
とでＩＣパッケージ４の位置決めをするようになってい
た。2. Description of the Related Art Conventionally, this type of mounter positioning apparatus has a pair of positioning claws 1 as shown in a top view of FIG.
b, 1, two XY positioning bearings 6 fixed to one positioning claw 1 b, and two XY positioning bearings 3 fixed to the other positioning claw 1
Thus, the IC package 4 is positioned.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来のマウン
タの位置決め装置の１対の位置決め爪のうち片側の位置
決め爪ベアリングの位置がＩＣパッケージのコーナーに
接する位置となっていた為に、ＩＣパッケージを位置決
めした時にＩＣパッケージの回転ずれが発生しやすいと
いう欠点がある。Since the position of the positioning pawl bearing on one side of the pair of positioning pawls of the conventional mounter positioning device described above is in contact with the corner of the IC package, the IC package cannot be mounted. There is a drawback that the IC package is likely to be deviated when positioned.
【０００４】上述した従来のマウンタの位置決め装置
は、片側の位置決め爪ベアリング位置がＩＣパッケージ
のコーナーに接する位置にあったのに対し、本発明は位
置決め爪ベアリングの位置がＩＣパッケージ上下辺と右
辺（又は左辺）に接する位置にあり、位置決めをすると
いう相違点を有する。In the above-described conventional positioning device for a mounter, the position of the positioning claw bearing on one side is located at a position in contact with the corner of the IC package. (Or the left side), and has a different point of positioning.
【０００５】[0005]
【課題を解決するための手段】本発明のＩＣパッケージ
位置決め装置は、ＩＣパッケージをはさむ１対の位置決
め爪のうち片側の位置決め爪にＩＣパッケージの上辺お
よび下辺を位置決めするベアリングを各１個有し、その
間に右辺（又は左辺）を位置決めするベアリングを２個
有している。The IC package positioning apparatus of the present invention has one bearing for positioning the upper side and the lower side of the IC package on one of the pair of positioning claws sandwiching the IC package. , Two bearings for positioning the right side (or the left side) therebetween.
【０００６】[0006]
【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の一実施例を示す図で、同図（ａ）は
上面図であり、同図（ｂ）はその正面図である。本実施
例は、マウンタ等のＩＣ製造装置に用いるＩＣパッケー
ジの位置決め装置であって、Ｙ方向位置決めベアリング
２を２個およびＸ方向位置決めベアリング３を２個有す
る位置決め爪１ａと、Ｘ方向位置決めベアリング３を２
個有する位置決め爪１の１対から構成されている。この
際、Ｙ方向位置決めベアリング２のベアリング間隔Ｌ
は、ＩＣパッケージ４のＹ方向寸法が納まる寸法にクリ
アランスを考慮して決める。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. 1A and 1B show an embodiment of the present invention. FIG. 1A is a top view, and FIG. 1B is a front view thereof. The present embodiment relates to a positioning device for an IC package used in an IC manufacturing device such as a mounter, which comprises: a positioning claw 1a having two Y-direction positioning bearings 2 and two X-direction positioning bearings 3; 2
It is composed of a pair of positioning claws 1 having a plurality of positioning claws. At this time, the bearing interval L of the Y-direction positioning bearing 2
Is determined in consideration of the clearance in a dimension in which the dimension in the Y direction of the IC package 4 is accommodated.
【０００７】本実施例のＩＣパッケージ４の中心に向っ
て左右１対の位置決め爪１，１ａを水平方向に移動さ
せ、ＩＣパッケージ４にＹ方向位置決めベアリング２を
２個とＸ方向位置決めベアリング３を４個、それぞれ接
触させてＩＣパッケージ４を一定位置に位置決めする。[0007] A pair of left and right positioning claws 1 and 1a are moved in the horizontal direction toward the center of the IC package 4 of the present embodiment, and two Y direction positioning bearings 2 and an X direction positioning bearing 3 are mounted on the IC package 4. Four IC packages are brought into contact with each other to position the IC package 4 at a fixed position.
【０００８】[0008]
【発明の効果】以上説明したように本発明は、位置決め
ベアリングをＸ方向とＹ方向に分けたことにより、位置
決め時のＩＣパッケージの回転ずれが発生しない。この
為に正確な位置決めができる効果がある。As described above, according to the present invention, since the positioning bearing is divided into the X direction and the Y direction, the rotation of the IC package at the time of positioning does not occur. Therefore, there is an effect that accurate positioning can be performed.
【図１】本発明の一実施例を示す図で、同図（ａ）は上
面図、同図（ｂ）はその正面図である。FIG. 1 is a view showing one embodiment of the present invention, wherein FIG. 1 (a) is a top view and FIG. 1 (b) is a front view thereof.
【図２】従来のパッケージ位置決め装置の上面図であ
る。FIG. 2 is a top view of a conventional package positioning device.
１，１ａ，１ｂ 位置決め爪 ２ Ｙ方向位置決めベアリング ３ Ｘ方向位置決めベアリング ４ ＩＣパッケージ ５ ＩＣパッケージ受け台 ６ ＸＹ方向位置決めベアリング 1, 1a, 1b Positioning claw 2 Y direction positioning bearing 3 X direction positioning bearing 4 IC package 5 IC package receiving stand 6 XY direction positioning bearing
Claims (1)
装置において、ＩＣパッケージをはさむ１対の位置決め
爪のうち片方の位置決め爪に４個の位置決めベアリング
を有し、そのうち両端の２個がそれぞれＩＣパッケージ
上辺および下辺側面に接し、残りの２個がパッケージ右
辺又は左辺側面に接する位置にあることを特徴とするＩ
Ｃパッケージ位置決め装置。1. A positioning device for an IC package of an IC manufacturing apparatus, wherein one of a pair of positioning claws sandwiching an IC package has four positioning bearings, and two of the two bearings at both ends are respectively upper sides of the IC package. And the lower two sides are in contact with the right side or the left side of the package.
C package positioning device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6446492A JP2788816B2 (en) | 1992-03-23 | 1992-03-23 | IC package positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6446492A JP2788816B2 (en) | 1992-03-23 | 1992-03-23 | IC package positioning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05267365A JPH05267365A (en) | 1993-10-15 |
| JP2788816B2 true JP2788816B2 (en) | 1998-08-20 |
Family
ID=13258985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6446492A Expired - Fee Related JP2788816B2 (en) | 1992-03-23 | 1992-03-23 | IC package positioning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2788816B2 (en) |
-
1992
- 1992-03-23 JP JP6446492A patent/JP2788816B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05267365A (en) | 1993-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2788816B2 (en) | IC package positioning device | |
| JPS63211739A (en) | Semiconductor device | |
| JP3157249B2 (en) | Semiconductor device package and mounting method | |
| JPH0697355A (en) | Stacked electronic component | |
| JPH08762Y2 (en) | Frame for semiconductor device | |
| JPH0471288A (en) | Semiconductor packaging substrate | |
| JPH0387013A (en) | Manufacture of semiconductor device | |
| JPS622764Y2 (en) | ||
| JPS6117742U (en) | semiconductor manufacturing equipment | |
| JPH0113423Y2 (en) | ||
| JPS5895042U (en) | Semiconductor element with V-shaped groove | |
| JP2776852B2 (en) | Liquid crystal display | |
| JPS60106297U (en) | ROM package | |
| JPH0650990Y2 (en) | Lead terminal parts | |
| JPS607120A (en) | Method for positioning semiconductor wafer | |
| JPS6334287Y2 (en) | ||
| JPS588697Y2 (en) | Holding tape for electronic parts | |
| JPS59111040U (en) | Jig for semiconductor manufacturing | |
| JPS58140144A (en) | Semiconductor device | |
| JPH0469941A (en) | Bonding method for integrated circuit | |
| JPH03150869A (en) | Memory module | |
| JPH0760850B2 (en) | Semiconductor device | |
| JPH04201880A (en) | Embossed type carrier tape | |
| JPH0682852U (en) | Tape carrier for parallel measurement | |
| JPH062693U (en) | Tape carrier with excellent bendability |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980512 |
|
| LAPS | Cancellation because of no payment of annual fees |