JPH04171897A - Tray for semiconductor device - Google Patents

Abstract

PURPOSE:To house semiconductor devices of different external dimensions in both faces of a tray for a semiconductor device and improve the efficiency of the tray by making recessions capable of housing the semiconductor devices in both faces of a substrate. CONSTITUTION:A substrate 1 of, for example, synthetic resin is shaped into a semiconductor device tray having recessions 3 and 4 capable of housing semiconductor devices 2 in both faces thereof. The recessions 3 and 4 are made in sizes corresponding to the different external dimensions of the semiconductor devices. Steps 5 are made in the periphery of the substrate 1 so that when a plurality of semiconductor device trays in which the semiconductor devices 2 are housed are piled one on top of another, the trays may not slip and the housed semiconductor devices 2 may not be overweighted. With the recessions 4 in the rear upward, semiconductor devices 6 of different external dimensions from the semiconductor devices 2 can be housed.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a tray for semiconductor devices.

[Conventional technology]

A conventional tray for semiconductor devices is shown in FIG. 4(a).

As shown in (b), a recess 3 in which a semiconductor device 2 can be accommodated was provided on the surface of a substrate 1 made of synthetic resin or the like.

[Problem to be solved by the invention]

The conventional semiconductor device tray described above has a recess that can accommodate semiconductor devices on only one side, and can accommodate semiconductor devices with one type of external dimension, but cannot accommodate semiconductor devices with two types of external dimensions. In order to do this, there is a problem in that two types of semiconductor device trays having recesses adapted to the respective external dimensions are required.

[Means to solve the problem]

The tray for semiconductor device 1 of the present invention has recesses provided on each of the front and back surfaces of the substrate for accommodating semiconductor devices having different external dimensions.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 (a> is a plan view showing one embodiment of the present invention;
Figure (b) is an enlarged cross-sectional view taken along line A-A' in Figure 1 (a);
The figure is a cross-sectional view of stacked trays for semiconductor devices 1 according to the present invention, and FIG. 3 is a cross-sectional view showing an example of use of the tray for semiconductor devices according to the present invention with its back side facing up.

As shown in FIGS. 1(a) and 1(b), a substrate 1 made of synthetic resin or the like is shaped to provide recesses 3 and 4 in which a semiconductor device 2 can be accommodated on both the front and back surfaces of the substrate 1, respectively. Configure the instrument tray. Here, the recesses 3 and 4 are formed in sizes corresponding to semiconductor devices having different external dimensions.

As shown in FIG. 2, a step is provided at the periphery of the substrate 1 to prevent the trays from shifting when a plurality of semiconductor device trays containing semiconductor devices 2 are stacked, and to prevent loads from being applied to the semiconductor devices 2 stored therein. 5 is set.

Further, as shown in FIG. 3, when the recess 4 on the back surface is turned upward, a semiconductor device 6 having external dimensions different from those of the semiconductor device IFI can be accommodated.

〔Effect of the invention〕

As explained above, by providing recesses in which semiconductor devices can be stored on both sides of the substrate, the present invention allows semiconductor devices with different external dimensions to be stored by using both sides of the semiconductor device tray, thereby increasing the efficiency of the tray. It has the effect of being able to.

[Brief explanation of drawings]

FIG. 1(a) is a plan view showing an embodiment of the present invention, FIG. 1(b) is an enlarged cross-sectional view taken along line A-A' in FIG. 1(a), and FIG. 2 is a semiconductor device of the present invention. Cross-sectional view of stacked trays, 3rd
The figure is a cross-sectional view showing an example of the use of the tray for semiconductor devices of the present invention with its back side facing up, and FIGS. FIG. 1...Substrate, 2...Semiconductor device! , 3.4... recessed part, 5... step part, 6... semiconductor device.

Claims (1)

[Claims] 1. A tray for a semiconductor device, comprising recesses provided on each of the front and back surfaces of a substrate for accommodating semiconductor devices having different external dimensions.