JPH0471865B2 - - Google Patents

Info

Publication number
JPH0471865B2
JPH0471865B2 JP313788A JP313788A JPH0471865B2 JP H0471865 B2 JPH0471865 B2 JP H0471865B2 JP 313788 A JP313788 A JP 313788A JP 313788 A JP313788 A JP 313788A JP H0471865 B2 JPH0471865 B2 JP H0471865B2
Authority
JP
Japan
Prior art keywords
metal
ceramics
temperature
fluctuating pressure
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP313788A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01179770A (ja
Inventor
Kazunori Sasaki
Takeshi Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HIROSHIMA DENKI GAKUEN
NIPPON SEIKOSHO KK
Original Assignee
HIROSHIMA DENKI GAKUEN
NIPPON SEIKOSHO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HIROSHIMA DENKI GAKUEN, NIPPON SEIKOSHO KK filed Critical HIROSHIMA DENKI GAKUEN
Priority to JP313788A priority Critical patent/JPH01179770A/ja
Publication of JPH01179770A publication Critical patent/JPH01179770A/ja
Publication of JPH0471865B2 publication Critical patent/JPH0471865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
JP313788A 1988-01-12 1988-01-12 金属とセラミックスとの接合方法 Granted JPH01179770A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP313788A JPH01179770A (ja) 1988-01-12 1988-01-12 金属とセラミックスとの接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP313788A JPH01179770A (ja) 1988-01-12 1988-01-12 金属とセラミックスとの接合方法

Publications (2)

Publication Number Publication Date
JPH01179770A JPH01179770A (ja) 1989-07-17
JPH0471865B2 true JPH0471865B2 (enrdf_load_html_response) 1992-11-16

Family

ID=11548964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP313788A Granted JPH01179770A (ja) 1988-01-12 1988-01-12 金属とセラミックスとの接合方法

Country Status (1)

Country Link
JP (1) JPH01179770A (enrdf_load_html_response)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090050610A1 (en) * 2004-10-13 2009-02-26 Mitsuboshi Diamond Industrial Co., Ltd. Method and apparatus for scribing brittle material board and system for breaking brittle material board
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
JP5862630B2 (ja) * 2013-09-20 2016-02-16 株式会社デンソー 接合体の製造方法
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
EP3552753A3 (en) 2014-07-14 2019-12-11 Corning Incorporated System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
WO2016115017A1 (en) 2015-01-12 2016-07-21 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
KR102546692B1 (ko) 2015-03-24 2023-06-22 코닝 인코포레이티드 디스플레이 유리 조성물의 레이저 절단 및 가공
KR20170131638A (ko) 2015-03-27 2017-11-29 코닝 인코포레이티드 가스 투과성 유리창 및 이의 제작방법
EP3319911B1 (en) 2015-07-10 2023-04-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
SG11201809797PA (en) 2016-05-06 2018-12-28 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
WO2018081031A1 (en) 2016-10-24 2018-05-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness

Also Published As

Publication number Publication date
JPH01179770A (ja) 1989-07-17

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