JPH0471248A - Measuring probe - Google Patents
Measuring probeInfo
- Publication number
- JPH0471248A JPH0471248A JP18320690A JP18320690A JPH0471248A JP H0471248 A JPH0471248 A JP H0471248A JP 18320690 A JP18320690 A JP 18320690A JP 18320690 A JP18320690 A JP 18320690A JP H0471248 A JPH0471248 A JP H0471248A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- terminal
- sleeve
- measuring
- spiral groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 40
- 238000005259 measurement Methods 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 7
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体集積回路装置(以降ICと呼ぶ)の電
気的特性試験を行う際に、ICの回路端子と接触し、特
性値を拾う測定用プローブに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for testing the electrical characteristics of a semiconductor integrated circuit device (hereinafter referred to as an IC) by contacting a circuit terminal of the IC and collecting characteristic values. Regarding measurement probes.
従来、この種の測定用プローブは、ICの自動選別装置
(以下単にハンドラと呼ぶ)の測定素子として使用され
、ICの回路の出力あるいは入力端子と接触させ、信号
のやり取りを行っていた。Conventionally, this type of measurement probe has been used as a measurement element in an automatic IC sorting device (hereinafter simply referred to as a handler), and has been brought into contact with the output or input terminal of an IC circuit to exchange signals.
この測定用プローブの構造は、図面には示さないが、例
えば、導電材で製作された環状のスリーブに、コイルス
プリングが圧縮され、接触子を端子にコイルスプリング
の復元力で押圧していた。Although the structure of this measurement probe is not shown in the drawings, for example, a coil spring is compressed in an annular sleeve made of a conductive material, and the contactor is pressed against the terminal by the restoring force of the coil spring.
しかしながら、上述した従来の測定用プローブは、接触
子が一方向のみ押圧力を与えられているので、例えば、
ICの測定端子にほこりが乗っている場合、接触子がそ
のほこりを介して端子と接触することになる。このため
、しばしば、測定中に、接触不良を起し、正確な測定が
出来ないという欠点がある。However, in the conventional measurement probe described above, the contact is applied with a pressing force in only one direction, so for example,
If there is dust on the measurement terminal of the IC, the contactor will come into contact with the terminal through the dust. For this reason, there is a drawback that poor contact often occurs during measurement, making accurate measurement impossible.
本発明の目的は、かかる欠点を解消する測定用プローブ
を提供することである。The object of the present invention is to provide a measuring probe that overcomes these drawbacks.
本発明の測定用プローブは、半導体集積回路の測定端子
と接触する球形状の先端をもつ測定子と、この測定子の
後端部を挿入する環状のスリーブと、前記測定子の後端
部を押すとともに前記スリーブ内に挿入されるコイルス
プリングとを有する測定用プローブにおいて、前記スリ
ーブの内壁にはめ込められた球形外形の部材を備え、こ
の部材の前記スリーブの内壁より露出する部分が前記測
定子の外周囲に形成された螺旋状溝にはめ込められてい
ることを特徴としている。The measuring probe of the present invention includes a measuring element having a spherical tip that contacts a measuring terminal of a semiconductor integrated circuit, an annular sleeve into which the rear end of the measuring element is inserted, and a ring-shaped sleeve into which the rear end of the measuring element is inserted. A measuring probe having a coil spring that is pushed and inserted into the sleeve, includes a spherical external member fitted into the inner wall of the sleeve, and a portion of this member exposed from the inner wall of the sleeve is attached to the measuring tip. It is characterized by being fitted into a spiral groove formed around the outer periphery.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例を示す測定用プローブの断面
図である。この測定用プローブは、同図に示すように、
一端が球面形状に形成され、他端側の所定の範囲で螺旋
状溝2が形成された測定子1と、この螺旋状溝2にはめ
込まれるビン3が内側に埋設されるとともに測定子1の
一端を露出させ、他端側を挿入する環状のスリーブ4と
、この環状のスリーブ4内に挿入されるとともに一端で
測定子1の他端側を押し付けるコイルスプリング6とで
構成されている。FIG. 1 is a sectional view of a measurement probe showing an embodiment of the present invention. This measurement probe, as shown in the figure,
The gauge head 1 has one end formed into a spherical shape and a spiral groove 2 formed in a predetermined range on the other end side, and a bottle 3 to be fitted into the spiral groove 2 is embedded inside the gauge head 1. It consists of an annular sleeve 4 with one end exposed and the other end inserted, and a coil spring 6 inserted into the annular sleeve 4 and pressing the other end of the probe 1 with one end.
次に、この測定用プローブの動作を説明する。Next, the operation of this measurement probe will be explained.
まず、ICの端子部5に測定子1の一端を押し付けると
、測定子1はコイルスプリング6の圧縮に伴い測定子1
はスリーブ4内に押し込められると同時に螺旋状?l!
2にはめ込められたビン3に強制され、回転する。この
回転作用により、端子部5に付着したごみは取り除かれ
る。このように、測定する毎に測定子1は回転し、ごみ
を除去して、かつ所定の圧力で接触することになる。First, when one end of the probe 1 is pressed against the terminal portion 5 of the IC, the probe 1 is compressed by the compression of the coil spring 6.
Is it pushed into the sleeve 4 and spiral at the same time? l!
It is forced by the bottle 3 fitted in 2 and rotates. Due to this rotational action, dust attached to the terminal portion 5 is removed. In this way, the probe 1 rotates every time a measurement is made, removes dust, and makes contact with a predetermined pressure.
第2図は本発明の他の実施例を示す測定プローブの部分
の断面図である。この実施例における測定用プローブは
、同図に示すように、前述の実施例のビンの代りに、ボ
ール3aを設けたことである。このボール3aは、スリ
ーブ4の内側の窪みにはめ込められているので、前述の
実施例におけるビンと比べ、ボール3aは自由に窪み内
で回転するので、測定子の回転がより円滑に行なわれる
という利点がある。FIG. 2 is a sectional view of a portion of a measurement probe showing another embodiment of the present invention. As shown in the figure, the measuring probe in this embodiment is provided with a ball 3a in place of the bottle in the previous embodiment. Since this ball 3a is fitted into the recess inside the sleeve 4, the ball 3a rotates freely within the recess compared to the bottle in the above-mentioned embodiment, so that the rotation of the measuring tip is performed more smoothly. There are advantages.
以上説明したように本発明は、ICの端子に測定子が接
触するときに、接触圧力に伴い測定子を回転させる機構
を設けることによって、常に接触時に、測定子が端子面
の汚れを除去するので、良好な電気的接触を得て、正確
な測定が出来る測定用プローブが得られるという効果が
ある。As explained above, the present invention provides a mechanism that rotates the probe according to the contact pressure when the probe contacts the terminal of an IC, so that the probe always removes dirt from the terminal surface during contact. Therefore, there is an effect that a measurement probe that can obtain good electrical contact and perform accurate measurements can be obtained.
第1図は本発明の一実施例を示す測定用プローブの断面
図、第2図は本発明の他の実施例を示す測定用プローブ
の部分の断面図である。
1・・・測定子、2・・・螺旋状溝、3・・・ビン、3
a・・・ボール、4・・・スリーブ、5・・・端子部、
6・・・コイルスプリング。FIG. 1 is a sectional view of a measurement probe showing one embodiment of the present invention, and FIG. 2 is a sectional view of a portion of a measurement probe showing another embodiment of the invention. 1... Measuring head, 2... Spiral groove, 3... Bottle, 3
a... Ball, 4... Sleeve, 5... Terminal part,
6...Coil spring.
Claims (1)
もつ測定子と、この測定子の後端部を挿入する環状のス
リーブと、前記測定子の後端部を押すとともに前記スリ
ーブ内に挿入されるコイルスプリングとを有する測定用
プローブにおいて、前記スリーブの内壁にはめ込められ
た球形外形の部材を備え、この部材の前記スリーブの内
壁より露出する部分が前記測定子の外周囲に形成された
螺旋状溝にはめ込められていることを特徴とする測定用
プローブ。A probe having a spherical tip that contacts a measurement terminal of a semiconductor integrated circuit, an annular sleeve into which the rear end of the probe is inserted, and a sleeve which is inserted into the sleeve while pushing the rear end of the probe. A measurement probe having a coil spring having a spherical outer shape fitted into the inner wall of the sleeve, the part of which is exposed from the inner wall of the sleeve having a spiral shape formed around the outer periphery of the probe. A measurement probe characterized by being fitted into a groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18320690A JPH0471248A (en) | 1990-07-11 | 1990-07-11 | Measuring probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18320690A JPH0471248A (en) | 1990-07-11 | 1990-07-11 | Measuring probe |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0471248A true JPH0471248A (en) | 1992-03-05 |
Family
ID=16131637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18320690A Pending JPH0471248A (en) | 1990-07-11 | 1990-07-11 | Measuring probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0471248A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06324079A (en) * | 1992-10-29 | 1994-11-25 | Toudai Musen Kk | Contact probe |
JPH06324078A (en) * | 1992-05-25 | 1994-11-25 | Toudai Musen Kk | Contact probe |
JPH0763785A (en) * | 1993-08-27 | 1995-03-10 | Tokyo Tungsten Co Ltd | Probe pin having semispheric front end |
JPH08148931A (en) * | 1994-11-24 | 1996-06-07 | Tech Res & Dev Inst Of Japan Def Agency | Phased array antenna system |
JP2010143121A (en) * | 2008-12-19 | 2010-07-01 | Toyo Kogei Kogyo Co Ltd | Method of positioning overall surface hot stamp tube, device for the method and tube with overall surface hot stamp |
JP2011106973A (en) * | 2009-11-18 | 2011-06-02 | Hioki Ee Corp | Contact probe, probe device, measurement device, and inspection device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6034106B2 (en) * | 1973-06-29 | 1985-08-07 | ヘキスト アクチェンゲゼルシャフト | Manufacturing method of electrophotographic liquid developer |
JPS6398566A (en) * | 1986-10-15 | 1988-04-30 | Seiko Epson Corp | Contact probe |
-
1990
- 1990-07-11 JP JP18320690A patent/JPH0471248A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6034106B2 (en) * | 1973-06-29 | 1985-08-07 | ヘキスト アクチェンゲゼルシャフト | Manufacturing method of electrophotographic liquid developer |
JPS6398566A (en) * | 1986-10-15 | 1988-04-30 | Seiko Epson Corp | Contact probe |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06324078A (en) * | 1992-05-25 | 1994-11-25 | Toudai Musen Kk | Contact probe |
JPH06324079A (en) * | 1992-10-29 | 1994-11-25 | Toudai Musen Kk | Contact probe |
JPH0763785A (en) * | 1993-08-27 | 1995-03-10 | Tokyo Tungsten Co Ltd | Probe pin having semispheric front end |
JPH08148931A (en) * | 1994-11-24 | 1996-06-07 | Tech Res & Dev Inst Of Japan Def Agency | Phased array antenna system |
JP2010143121A (en) * | 2008-12-19 | 2010-07-01 | Toyo Kogei Kogyo Co Ltd | Method of positioning overall surface hot stamp tube, device for the method and tube with overall surface hot stamp |
JP2011106973A (en) * | 2009-11-18 | 2011-06-02 | Hioki Ee Corp | Contact probe, probe device, measurement device, and inspection device |
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