JPH0217432Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] This invention relates to a socket for a semiconductor element into which a device to be measured is inserted, for example, when measuring the electrical characteristics of a manufactured semiconductor element. It is.

[Prior Art] For example, when measuring the electrical characteristics of semiconductor device products such as LDs and LEDs, the device to be measured is inserted and held in the socket via a socket. It is common for the device to be measured such that the foot pins of the device inserted into the socket are electrically connected to the measuring instrument through pins projecting from the socket.

By the way, this type of device under test (semiconductor) is
The shape of the foot pins varies widely depending on the manufacturer, and the pitch, number, wire diameter, length, etc. of the foot pins vary depending on the product type. Therefore, the specifications of the socket installed in the measuring instrument also vary. , it is inevitable that various specifications will be required depending on the type of device to be measured. However, the specifications of commercially available sockets are currently limited to specific shapes.

However, in the conventional socket structure, the foot pin is electrically connected to one place on the inner wall of the guide pipe into which the foot pin is inserted through contact with a pair of opposing clamping springs. was taken.

[Problems that the invention aims to solve] However, with this conventional socket structure, sockets with a wide variety of specifications must be prepared, and the clamping pressure spring of the guide pipe repeatedly presses against the foot pin. Because the guide pipe is rubbed by the
Continuity becomes uncertain after approximately 500 measurements.
This caused problems such as the need to replace the socket.

Therefore, it is an object of the present invention to provide a socket for a semiconductor device that allows the common use of the component parts of the socket as much as possible and also extends the usable life of the socket.

[Means for Solving the Problems] Next, the configuration of the present invention for achieving the above object will be described with reference to drawings corresponding to embodiments.

That is, the present invention comprises a hollow-shaped holder 1 with a receiving hole 1a opened in the upper surface, a small diameter part 3c and a large diameter part 3b made of an insulating material, and the large diameter part 3d is a part of the holder 1. A pin receiver 3 into which a pin 14 of a semiconductor element W attached to the holder 1 is inserted, with the small diameter portion 3c protruding into the inner space of the holder 1, is inserted into the receiving hole 1a.
a guide groove 3b provided along the peripheral wall of the small diameter portion 3c and guiding the pin 14 inserted into the pin receiver 3; 14, the large diameter portion 3d
A conductive contact spring piece 9 is attached to the bottom of the inner space of the holder 1 and protrudes from the upper surface thereof and is biased in the direction of the guide groove 3b of the pin receiver 3. The contact base 2 is slidably inserted into an insertion hole 1c formed through the peripheral wall of the holder 1 in the radial direction, and the head is capable of protruding from the outer wall of the holder 1, and the tip end is connected to the contact spring. It has a pressing pin 10 that can freely bias the piece 9 in the direction of the guide groove 3b, and a peripheral wall that is detachably attached to the outer periphery of the holder 1, and the inner wall surface of the peripheral wall is aligned with the pressing pin 10. The tip of the pressing pin 10 presses the head against the contact spring piece 9.
a cover cap 4 that presses in a direction that urges the semiconductor element W, the pin 14 of the semiconductor element W inserted into the pin receiver 3 being guided by the guide groove 3b;
Moreover, by being pressed by the guide groove 3b and the contact spring piece 9, the contact spring piece 9
A socket for a semiconductor device is characterized in that it has a structure that is electrically conductive with the socket.

[Operation] In order to use the socket of the present invention, first, the pin receiver 3 and the contact base 2 of a predetermined standard are attached to the holder 1.

Next, the pins 14 of the semiconductor element W are inserted into the guide holes 3a of the pin receiver 3 and attached, and the holder 1 is attached.
Cover cap 4 is attached to the cover cap 4.

Then, it is pushed against the inner wall of the cover cap 4,
The tip of the pressing pin 10 urges the contact spring piece 9,
Electrical connection between the pins 14 of the semiconductor element W and the contact spring pieces 9 is ensured.

In addition, since the pin receiver 3 and the contact base 2 having the contact spring piece 9 are each formed of separate members, it is easy to use common components, and when the cover cap 4 is removed, By attaching and detaching the semiconductor element W, the contact spring piece 9
Sliding wear is prevented.

[Example] Hereinafter, the configuration of the present invention will be specifically explained based on an example shown in FIGS. 1 to 4.

The socket of the embodiment has a main body which is a holder 1 with an opening at the center of the lower surface, and the lower opening of the main body is as follows.
In addition to being closed by the contact base 2, a pin receiver 3 and a contact spring piece assembly as main members are attached to the inner space of the main body by fitting or gluing.
Additionally, a cover cap 4 (shown in FIG. 4a) is attached to the main body.

As a specific form, first, the holder 1 has a receiving hole 1 in the center of its upper surface that communicates with the inner space of the main body.
a is open, steps are formed at the upper and lower ends of the receiving hole 1a, and an annular groove 1b is recessed on the circumference of the holder 1 at an intermediate height.
Insertion holes 1c are formed on four sides of the annular groove 1b at 90° pitches and extend through the ring groove 1b on a radial line.

In addition, arcuate cut steps are formed at three locations at 120° pitches on the flange 1d of the holder 1, and mounting holes 1e are formed in the lower step portions.

Next, the contact plate 5 is superimposed on the upper surface of the contact block 2, and a cylindrical spacer 7 is attached to the stud 6 screwed into two screw holes on the diameter of the contact block 2. After being fitted onto the outside, the upper end of the stud 6 is screwed onto the upper wall of the holder 1, thereby securing the contact block 2 to the bottom surface of the holder 1.

By the way, the pin receiver 3 glued to the lower half of the receiving hole 1a of the holder 1 is molded into a cylindrical plug shape from an insulating material such as Bakelite. 3 guide holes in 4 locations at ゜pitch
a is opened vertically through the guide hole 3a, and a guide groove 3b is recessed and formed in a position communicating with the guide hole 3a on the circumferential surface of the lower half portion having a small diameter.

On the other hand, the contact spring piece assembly fixed to the center of the contact plate 5 has a boss 8 formed of an insulating circular board;
It is formed by contact spring pieces 9 that are planted and stand up at four locations on the circumference of the boss 8 at 90° pitches, and the tip of each contact spring piece 9 is connected to each guide groove 3b of the pin receiver 3. The lower end of each spring piece 9 is connected to a circuit (not shown) formed on the contact plate 5, and is electrically connected to the measuring device via the second contact.

Finally, the press pins 10 are inserted into each insertion hole 1c of the holder 1, and the inner end of each pin 10 is
It faces each contact spring piece 9. Note that each pin 10 is prevented from coming off by a snap spring 11.

Furthermore, when measuring a semiconductor device, the device W to be measured is inserted into the socket and the cover cap 4 is placed over the socket. 4 leg pins 14
pass through each guide hole 3a, and then insert the foot pin 1
The lower half of the foot pin 14 is exposed to the interior of the holder 1 while being backed up into the guide groove 3b.
contacts the contact spring piece 9.

After this, the cover cap 4 is covered, and when the cover cap 4 is completely covered, the press pin 10 is pressed against the inner wall 4b of the cover cap 4, as shown in FIG. 4a.
The push pin 10
Press the contact spring piece 9 against the foot pin 14 with the inner end of the
The electrical contact can be made more reliable.

When the measurement of the element W is completed, the cover cap 4 is opened and the element W is removed from the socket. Moreover, FIG. 4b is a diagram showing another embodiment of the pressing pin 10, in which a coil spring is provided inside the pin.

Since the socket of the embodiment is used in this manner, when the device to be measured W is fitted into the socket, the leg pins 14 come into pressure contact with the contact spring pieces 9, thereby ensuring electrical continuity.

Furthermore, in the socket of the embodiment, even if the type of the device to be measured changes, as long as the pitch of the foot pins does not change, the socket can be fitted into the socket regardless of the thickness or length of the foot pins. In addition, if the press pin insertion holes of the holder are opened in a number of radial directions and used selectively, and various types of pin receivers and contact spring piece assemblies are prepared in advance and replaced selectively, It is easy to standardize socket components.

Further, in this embodiment, the guide hole and the guide groove are formed in a circular shape, but they may be formed in other shapes, such as a square shape, depending on the shape of the leg pins of the semiconductor element.

[Effects of the invention] As described above, according to the semiconductor element socket according to the present invention, pin 1 of the semiconductor element W to be measured
The pin receiver 3 into which the pin 14 is inserted, and the contact base 2 having the contact spring piece 9 that makes electrical contact with the pin 14 are each attached to the holder 1 as independent components according to function. This has the effect of making it possible and easy to standardize socket components corresponding to different shapes and types of sockets.

Also, a cover cap 4 attached to the holder 1
The contact spring piece 9 is pressed and biased by the tip of the pressing pin 10 which is pressed by the inner wall of the semiconductor element W.
Since the pin 14 is connected to the contact spring piece 9, even if the diameter of the pin 14 changes or the contact spring piece 9 becomes fatigued, a reliable electrical connection can be made and reliability is improved. do.

Furthermore, by attaching and detaching the semiconductor element W with the cover cap 4 removed, the contact spring pieces 9 are prevented from being rubbed and worn by the pins 14, thereby improving the versatility and durability of the socket. effective.

[Brief explanation of the drawing]

FIG. 1 is an elevational sectional view of a socket for a semiconductor device showing an embodiment of the present invention, FIG. 2 is a perspective view thereof, and FIG. 3 is a separation of the pin receiver and contact spring piece assembly shown in FIG. 1. FIG. 4a is a perspective view of the socket in use, and FIG. 4b is a view showing another embodiment of the pressing pin 10. W...Device to be measured, 1...Holder, 2...Contact stand, 3...Pin holder, 3a...Guide hole, 3b...
Guide groove, 5... Contact plate, 6... Stud, 7...
...Cylindrical spacer, 8...Boss, 9...Contact spring piece, 10...Press pin as biasing means, 11...
...Snat spring, 14...foot pin.

Claims (1)

[Claims for Utility Model Registration] A hollow-shaped holder 1 with a receiving hole 1a opened in the upper surface, and a small diameter part 3c and a large diameter part 3d made of an insulating material, the large diameter part 3d being a part of the holder. A pin receiver 3 into which a pin 14 of a semiconductor element W attached to the holder 1 is inserted into the receiving hole 1a of the holder 1 with the small diameter portion 3c protruding into the inner space of the holder 1.
a guide groove 3b provided along the peripheral wall of the small diameter portion 3c and guiding the pin 14 inserted into the pin receiver 3; 14, the large diameter portion 3d
A conductive contact spring piece 9 is attached to the bottom of the inner space of the holder 1 and protrudes from the upper surface thereof and is biased in the direction of the guide groove 3b of the pin receiver 3. The contact base 2 is slidably inserted into an insertion hole 1c formed through the peripheral wall of the holder 1 in the radial direction, and the head is capable of protruding from the outer wall of the holder 1, and the tip end is connected to the contact spring. It has a pressing pin 10 that can freely bias the piece 9 in the direction of the guide groove 3b, and a peripheral wall that is detachably attached to the outer periphery of the holder 1, and the inner wall surface of the peripheral wall is aligned with the pressing pin 10. The tip of the pressing pin 10 presses the head against the contact spring piece 9.
a cover cap 4 that presses in a direction that urges the semiconductor element W, the pin 14 of the semiconductor element W inserted into the pin receiver 3 being guided by the guide groove 3b;
Moreover, by being pressed by the guide groove 3b and the contact spring piece 9, the contact spring piece 9
A socket for a semiconductor device characterized by having a structure that is electrically conductive with the socket.