JPS61133989U - - Google Patents
Info
- Publication number
- JPS61133989U JPS61133989U JP1116085U JP1116085U JPS61133989U JP S61133989 U JPS61133989 U JP S61133989U JP 1116085 U JP1116085 U JP 1116085U JP 1116085 U JP1116085 U JP 1116085U JP S61133989 U JPS61133989 U JP S61133989U
- Authority
- JP
- Japan
- Prior art keywords
- guide groove
- pin
- spring piece
- contact spring
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は、本考案の一実施例を示す半導体素子
用ソケツトの立断面図、第２図は、同斜視図、第
３図は、第１図のピン受と接触ばね片組立との分
離斜視図、第４図ａは、使用状態における同ソケ
ツトの立断面図、第４図ｂは押圧ピン１０の他の
実施例を示す図である。
Ｗ……被測定素子、１……ホルダ、２……接点
台、３……ピン受、３ａ……ガイド孔、３ｂ……
ガイド溝、５……接点板、６……スタツド、７…
…筒形スペーサ、８……ボス、９……接触ばね片
、１０……付勢手段としての押圧ピン、１１……
スナツプリング、１４……足ピン。
FIG. 1 is an elevational sectional view of a socket for a semiconductor device showing an embodiment of the present invention, FIG. 2 is a perspective view thereof, and FIG. 3 is a separation of the pin receiver and contact spring piece assembly shown in FIG. 1. FIG. 4a is a perspective view of the socket in use, and FIG. 4b is a view showing another embodiment of the pressing pin 10. W...Device to be measured, 1...Holder, 2...Contact stand, 3...Pin holder, 3a...Guide hole, 3b...
Guide groove, 5... Contact plate, 6... Stud, 7...
...Cylindrical spacer, 8...Boss, 9...Contact spring piece, 10...Press pin as biasing means, 11...
Snut spring, 14...foot pin.
Claims (1)
大径部３ｄを備え、半導体素子Ｗのピン１４を差
込むピン受３と； 前記小径部３ｃの周壁に沿つて設けられ前記ピ
ン受３に差込まれたピン１４を案内するガイド溝
３ｂと； 該ガイド溝３ｂに連通し、該ピン受３に半導体
素子Ｗのピン１４を差込むために前記大径部３ｄ
に設けられたガイド孔３ａと；前記ガイド溝の方
向に付勢された導電性の接触ばね片９とを具備し
： 前記ピン受３に差込まれた前記半導体素子Ｗの
ピン１４が前記ガイド溝３ｂによつて案内され、
かつ、前記ガイド溝３ｂと前記接触ばね片９とに
より押圧されることによつて、前記接触ばね片９
と電気的に導通するようにされた半導体素子用ソ
ケツト。 (2) 前記接触ばね片を前記ガイド溝の方向に付
勢する手段１０を備えたことを特徴とする実用新
案登録請求の範囲第(1)項記載の半導体素子用ソ
ケツト。[Claims for Utility Model Registration] (1) A pin receiver 3 made of an insulating material and having a small diameter portion 3c and a large diameter portion 3d, into which the pin 14 of the semiconductor element W is inserted; a guide groove 3b provided along the guide groove 3b for guiding the pin 14 inserted into the pin receiver 3; Part 3d
a guide hole 3a provided in the guide groove; and a conductive contact spring piece 9 biased in the direction of the guide groove; the pin 14 of the semiconductor element W inserted into the pin receiver 3 guided by groove 3b;
Moreover, by being pressed by the guide groove 3b and the contact spring piece 9, the contact spring piece 9
A socket for a semiconductor device that is electrically connected to the socket. (2) The socket for a semiconductor device according to claim 1, which is characterized by comprising means 10 for biasing the contact spring piece in the direction of the guide groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985011160U JPH0217432Y2 (en) | 1985-01-31 | 1985-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985011160U JPH0217432Y2 (en) | 1985-01-31 | 1985-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61133989U true JPS61133989U (en) | 1986-08-21 |
| JPH0217432Y2 JPH0217432Y2 (en) | 1990-05-15 |
Family
ID=30493021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985011160U Expired JPH0217432Y2 (en) | 1985-01-31 | 1985-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217432Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009145101A (en) * | 2007-12-12 | 2009-07-02 | Arufakusu Kk | Semiconductor element inspection apparatus |
| JP2017016881A (en) * | 2015-06-30 | 2017-01-19 | 株式会社エンプラス | Socket for electronic component |
| JP2017016882A (en) * | 2015-06-30 | 2017-01-19 | 株式会社エンプラス | Socket for electronic component |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH059327U (en) * | 1991-07-22 | 1993-02-09 | 芳子 堀田 | Cleaning brush with water tank |
-
1985
- 1985-01-31 JP JP1985011160U patent/JPH0217432Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH059327U (en) * | 1991-07-22 | 1993-02-09 | 芳子 堀田 | Cleaning brush with water tank |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009145101A (en) * | 2007-12-12 | 2009-07-02 | Arufakusu Kk | Semiconductor element inspection apparatus |
| JP2017016881A (en) * | 2015-06-30 | 2017-01-19 | 株式会社エンプラス | Socket for electronic component |
| JP2017016882A (en) * | 2015-06-30 | 2017-01-19 | 株式会社エンプラス | Socket for electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217432Y2 (en) | 1990-05-15 |