JPH0470096B2 - - Google Patents
Info
- Publication number
- JPH0470096B2 JPH0470096B2 JP15192784A JP15192784A JPH0470096B2 JP H0470096 B2 JPH0470096 B2 JP H0470096B2 JP 15192784 A JP15192784 A JP 15192784A JP 15192784 A JP15192784 A JP 15192784A JP H0470096 B2 JPH0470096 B2 JP H0470096B2
- Authority
- JP
- Japan
- Prior art keywords
- punch
- lead frame
- width
- metal strip
- groove formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 13
- 238000004080 punching Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Punching Or Piercing (AREA)
- Forging (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15192784A JPS6130231A (ja) | 1984-07-20 | 1984-07-20 | 半導体装置用リ−ドフレ−ムのプレス加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15192784A JPS6130231A (ja) | 1984-07-20 | 1984-07-20 | 半導体装置用リ−ドフレ−ムのプレス加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6130231A JPS6130231A (ja) | 1986-02-12 |
| JPH0470096B2 true JPH0470096B2 (US08063081-20111122-C00102.png) | 1992-11-10 |
Family
ID=15529239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15192784A Granted JPS6130231A (ja) | 1984-07-20 | 1984-07-20 | 半導体装置用リ−ドフレ−ムのプレス加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6130231A (US08063081-20111122-C00102.png) |
-
1984
- 1984-07-20 JP JP15192784A patent/JPS6130231A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6130231A (ja) | 1986-02-12 |
