JPH0469813B2 - - Google Patents
Info
- Publication number
- JPH0469813B2 JPH0469813B2 JP61217183A JP21718386A JPH0469813B2 JP H0469813 B2 JPH0469813 B2 JP H0469813B2 JP 61217183 A JP61217183 A JP 61217183A JP 21718386 A JP21718386 A JP 21718386A JP H0469813 B2 JPH0469813 B2 JP H0469813B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- resin
- film layer
- thin film
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 67
- 239000011347 resin Substances 0.000 claims description 67
- 239000010409 thin film Substances 0.000 claims description 34
- 239000004065 semiconductor Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000010408 film Substances 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 29
- 238000005498 polishing Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 239000004744 fabric Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61217183A JPS6373625A (ja) | 1986-09-17 | 1986-09-17 | 半導体ウエ−ハマウンテイング用樹脂薄膜層の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61217183A JPS6373625A (ja) | 1986-09-17 | 1986-09-17 | 半導体ウエ−ハマウンテイング用樹脂薄膜層の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6373625A JPS6373625A (ja) | 1988-04-04 |
| JPH0469813B2 true JPH0469813B2 (enrdf_load_stackoverflow) | 1992-11-09 |
Family
ID=16700162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61217183A Granted JPS6373625A (ja) | 1986-09-17 | 1986-09-17 | 半導体ウエ−ハマウンテイング用樹脂薄膜層の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6373625A (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04148548A (ja) * | 1990-10-12 | 1992-05-21 | Matsushita Electric Ind Co Ltd | 半導体基板支持装置 |
| KR100475845B1 (ko) * | 1997-04-04 | 2005-06-17 | 도쿄 세이미츄 코퍼레이션 리미티드 | 연마장치 |
| KR100668161B1 (ko) * | 1998-10-30 | 2007-01-11 | 신에쯔 한도타이 가부시키가이샤 | 연마용 워크피스 홀더 및 그 제조방법, 워크피스의 연마방법 및 연마장치 |
| JP2003103455A (ja) * | 2001-09-28 | 2003-04-08 | Shin Etsu Handotai Co Ltd | ワーク保持盤並びにワークの研磨装置及び研磨方法 |
| JP2006305713A (ja) | 2005-03-28 | 2006-11-09 | Nikon Corp | 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法 |
| JP5311190B2 (ja) * | 2008-05-14 | 2013-10-09 | 株式会社ニコン | 吸着装置の製造方法および研磨装置 |
-
1986
- 1986-09-17 JP JP61217183A patent/JPS6373625A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6373625A (ja) | 1988-04-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |