JPH0469660B2 - - Google Patents
Info
- Publication number
- JPH0469660B2 JPH0469660B2 JP62333810A JP33381087A JPH0469660B2 JP H0469660 B2 JPH0469660 B2 JP H0469660B2 JP 62333810 A JP62333810 A JP 62333810A JP 33381087 A JP33381087 A JP 33381087A JP H0469660 B2 JPH0469660 B2 JP H0469660B2
- Authority
- JP
- Japan
- Prior art keywords
- varnish
- epoxy resin
- nonwoven fabric
- resin
- glass nonwoven
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33381087A JPH01174535A (ja) | 1987-12-28 | 1987-12-28 | 積層板の製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33381087A JPH01174535A (ja) | 1987-12-28 | 1987-12-28 | 積層板の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01174535A JPH01174535A (ja) | 1989-07-11 |
JPH0469660B2 true JPH0469660B2 (enrdf_load_stackoverflow) | 1992-11-06 |
Family
ID=18270204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33381087A Granted JPH01174535A (ja) | 1987-12-28 | 1987-12-28 | 積層板の製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01174535A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0379636A (ja) * | 1989-08-21 | 1991-04-04 | Kubota Corp | フェノール樹脂の繊維含浸方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5535411B2 (enrdf_load_stackoverflow) * | 1972-02-12 | 1980-09-13 |
-
1987
- 1987-12-28 JP JP33381087A patent/JPH01174535A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01174535A (ja) | 1989-07-11 |
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