JPH0469529B2 - - Google Patents
Info
- Publication number
- JPH0469529B2 JPH0469529B2 JP4076587A JP4076587A JPH0469529B2 JP H0469529 B2 JPH0469529 B2 JP H0469529B2 JP 4076587 A JP4076587 A JP 4076587A JP 4076587 A JP4076587 A JP 4076587A JP H0469529 B2 JPH0469529 B2 JP H0469529B2
- Authority
- JP
- Japan
- Prior art keywords
- ingot
- cutting
- wafer
- suction
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 51
- 235000012431 wafers Nutrition 0.000 description 47
- 238000000034 method Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010067482 No adverse event Diseases 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62040765A JPS63207615A (ja) | 1987-02-24 | 1987-02-24 | インゴツト切断装置 |
| US07/156,748 US4903681A (en) | 1987-02-24 | 1988-02-18 | Method and apparatus for cutting a cylindrical material |
| DE88102589T DE3883804T2 (de) | 1987-02-24 | 1988-02-22 | Verfahren und Vorrichtung für das Schneiden eines zylindrischen Materials. |
| EP19880102589 EP0280245B1 (en) | 1987-02-24 | 1988-02-22 | Method and apparatus for cutting a cylindrical material |
| KR1019880001932A KR930005466B1 (ko) | 1987-02-24 | 1988-02-24 | 원통형재료의 절단방법 및 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62040765A JPS63207615A (ja) | 1987-02-24 | 1987-02-24 | インゴツト切断装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63207615A JPS63207615A (ja) | 1988-08-29 |
| JPH0469529B2 true JPH0469529B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-11-06 |
Family
ID=12589720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62040765A Granted JPS63207615A (ja) | 1987-02-24 | 1987-02-24 | インゴツト切断装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63207615A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200526384A (en) * | 2003-09-24 | 2005-08-16 | Mitsuboshi Diamond Ind Co Ltd | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
-
1987
- 1987-02-24 JP JP62040765A patent/JPS63207615A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63207615A (ja) | 1988-08-29 |