JPH0469066B2 - - Google Patents

Info

Publication number
JPH0469066B2
JPH0469066B2 JP60137533A JP13753385A JPH0469066B2 JP H0469066 B2 JPH0469066 B2 JP H0469066B2 JP 60137533 A JP60137533 A JP 60137533A JP 13753385 A JP13753385 A JP 13753385A JP H0469066 B2 JPH0469066 B2 JP H0469066B2
Authority
JP
Japan
Prior art keywords
molding
pressure
resin
stage
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60137533A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61295038A (ja
Inventor
Tatsu Sakaguchi
Kazunori Mitsuhashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP60137533A priority Critical patent/JPS61295038A/ja
Publication of JPS61295038A publication Critical patent/JPS61295038A/ja
Publication of JPH0469066B2 publication Critical patent/JPH0469066B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP60137533A 1985-06-24 1985-06-24 積層板の製造法 Granted JPS61295038A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60137533A JPS61295038A (ja) 1985-06-24 1985-06-24 積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60137533A JPS61295038A (ja) 1985-06-24 1985-06-24 積層板の製造法

Publications (2)

Publication Number Publication Date
JPS61295038A JPS61295038A (ja) 1986-12-25
JPH0469066B2 true JPH0469066B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-11-05

Family

ID=15200903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60137533A Granted JPS61295038A (ja) 1985-06-24 1985-06-24 積層板の製造法

Country Status (1)

Country Link
JP (1) JPS61295038A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757494B2 (ja) * 1987-05-27 1995-06-21 新神戸電機株式会社 積層板の製造法

Also Published As

Publication number Publication date
JPS61295038A (ja) 1986-12-25

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