JPH0468377U - - Google Patents

Info

Publication number
JPH0468377U
JPH0468377U JP11281190U JP11281190U JPH0468377U JP H0468377 U JPH0468377 U JP H0468377U JP 11281190 U JP11281190 U JP 11281190U JP 11281190 U JP11281190 U JP 11281190U JP H0468377 U JPH0468377 U JP H0468377U
Authority
JP
Japan
Prior art keywords
bonding
connector device
terminal part
connect
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11281190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11281190U priority Critical patent/JPH0468377U/ja
Publication of JPH0468377U publication Critical patent/JPH0468377U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例によるコネクタ装
置を示す斜視図、第２図は従来例を示す断面図で
ある。 図中、１，２は接続ピン、３，４は接続ピン・
リード端子部、５は絶縁ハウジング、６はワイヤ
ボンド接続端子部を示す。なお、図中、同一符号
は同一、または相当部分を示す。 FIG. 1 is a perspective view showing a connector device according to an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional example. In the figure, 1 and 2 are connection pins, 3 and 4 are connection pins.
5 shows a lead terminal part, 5 shows an insulating housing, and 6 shows a wire bond connection terminal part. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数接続ピンのリード端子部をワイヤボンデイ
ング等により、接続させるのに厚膜印刷法、又は
真空蒸着法、スパツタリング法などの薄膜により
形成したボンデイング接続端子部を有した事を特
徴とするコネクタ装置。 A connector device characterized by having a bonding connection terminal part formed by a thin film such as a thick film printing method, a vacuum evaporation method, or a sputtering method to connect the lead terminal parts of a plurality of connection pins by wire bonding or the like.
JP11281190U 1990-10-25 1990-10-25 Pending JPH0468377U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11281190U JPH0468377U (en) 1990-10-25 1990-10-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11281190U JPH0468377U (en) 1990-10-25 1990-10-25

Publications (1)

Publication Number Publication Date
JPH0468377U true JPH0468377U (en) 1992-06-17

Family

ID=31860332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11281190U Pending JPH0468377U (en) 1990-10-25 1990-10-25

Country Status (1)

Country Link
JP (1) JPH0468377U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0963658A (en) * 1995-08-29 1997-03-07 Yamatake Honeywell Co Ltd Connection structure of lead wire

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60140751A (en) * 1983-12-27 1985-07-25 Sumitomo Special Metals Co Ltd Bonding piece for thick-film hybrid integrated circuit
JPS6463286A (en) * 1987-04-17 1989-03-09 Hitachi Ltd Terminal member for electronic device and manufacture thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60140751A (en) * 1983-12-27 1985-07-25 Sumitomo Special Metals Co Ltd Bonding piece for thick-film hybrid integrated circuit
JPS6463286A (en) * 1987-04-17 1989-03-09 Hitachi Ltd Terminal member for electronic device and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0963658A (en) * 1995-08-29 1997-03-07 Yamatake Honeywell Co Ltd Connection structure of lead wire

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