JPH0468098B2 - - Google Patents

Info

Publication number
JPH0468098B2
JPH0468098B2 JP60107533A JP10753385A JPH0468098B2 JP H0468098 B2 JPH0468098 B2 JP H0468098B2 JP 60107533 A JP60107533 A JP 60107533A JP 10753385 A JP10753385 A JP 10753385A JP H0468098 B2 JPH0468098 B2 JP H0468098B2
Authority
JP
Japan
Prior art keywords
electronic component
nozzle
transfer head
sub
rotation angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60107533A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61265233A (ja
Inventor
Wataru Hidese
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60107533A priority Critical patent/JPS61265233A/ja
Publication of JPS61265233A publication Critical patent/JPS61265233A/ja
Publication of JPH0468098B2 publication Critical patent/JPH0468098B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
JP60107533A 1985-05-20 1985-05-20 電子部品自動装着装置 Granted JPS61265233A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60107533A JPS61265233A (ja) 1985-05-20 1985-05-20 電子部品自動装着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60107533A JPS61265233A (ja) 1985-05-20 1985-05-20 電子部品自動装着装置

Publications (2)

Publication Number Publication Date
JPS61265233A JPS61265233A (ja) 1986-11-25
JPH0468098B2 true JPH0468098B2 (en:Method) 1992-10-30

Family

ID=14461600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60107533A Granted JPS61265233A (ja) 1985-05-20 1985-05-20 電子部品自動装着装置

Country Status (1)

Country Link
JP (1) JPS61265233A (en:Method)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103458A (ja) * 2005-09-30 2007-04-19 Juki Corp 表面実装部品装着機の装着ヘッド
JP4900214B2 (ja) * 2007-12-03 2012-03-21 パナソニック株式会社 部品実装装置

Also Published As

Publication number Publication date
JPS61265233A (ja) 1986-11-25

Similar Documents

Publication Publication Date Title
US8991681B2 (en) Die bonder and bonding method
JP3636127B2 (ja) 電子部品実装装置および電子部品実装方法
JP3996768B2 (ja) 部品実装方法及び部品実装装置
JP4713596B2 (ja) 電子部品の実装装置及び実装方法
US5507085A (en) Method and apparatus for automatically placing lids on component packages
TWI666720B (zh) 帶有多個用於傳送電子器件進行鍵合的旋轉傳送臂的鍵合裝置
US9966357B2 (en) Pick-and-place tool for packaging process
CN109287113A (zh) 全自动曲面贴装设备
KR102708943B1 (ko) 본딩 장치
JPH11102936A (ja) 部品供給装置及び方法
JP2007306040A (ja) 部品実装方法及び部品実装装置
JPH08130230A (ja) フリップチップの実装装置
US20020162217A1 (en) Apparatus for placing a semiconductor chip as a flipchip on a substrate
JP2008251771A (ja) 部品実装装置
JPH0691348B2 (ja) 電子部品自動装着装置
JPH0468098B2 (en:Method)
JP2010219306A (ja) 電子部品実装装置およびノズル駆動制御方法
JPH0815238B2 (ja) 電子部品自動装着装置
JP2638103B2 (ja) 電子部品実装方法
JP7298887B2 (ja) ボール搭載装置及びボール搭載方法
JPH0815237B2 (ja) 電子部品自動装着装置
JP2000174158A (ja) ボールマウント装置
JPH0897595A (ja) 電子部品実装装置
JP3301433B2 (ja) 電子部品実装装置
JPH0516973B2 (en:Method)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term