JPH046805A - Chip parts retaining tool - Google Patents

Abstract

PURPOSE:To obtain a retaining tool which can be used even for a slight dimensional fluctuation and can retain positively at a low cost by providing a silicone or a polyethylene sheet which is adhered to a board with a through hole which has a dimension closer to an outside dimension of chip parts or a rubber lining board and a surface of a side for inserting the chip parts of that board or the rubber lining board. CONSTITUTION:In a plate-shaped tool with a plurality of penetration holes for handling a plurality of chip parts 1 simultaneously, a silicone or a polyethylene sheet 4 is adhered to a plate-shaped board with a penetration hole which has a dimension closer to an outside dimension of the chip parts 1 or rubber lining boards 2 and 3 and a surface of a side for inserting the chip parts 1 of that substrate or the rubber lining board 2 and 3. For example, the board 2 with the rubber lining 3 with a diameter which is slightly smaller than a maximum value of dimension variation of the chip parts 1, namely a diameter which is 2-5% smaller than the dimension of the chip parts 1 in the direction of a diagonal distance of parts in the case square-type chip parts is used. Then, the polyethylene sheet 4 which is 100mum thick is laid on the upper surface, a hole is punched at a center of the through hole part by a pin, and then the chip parts 1 are inserted into a retaining tool.

Description

DETAILED DESCRIPTION OF THE INVENTION A2 OBJECTS OF THE INVENTION [Field of Industrial Application] The present invention relates to a holder for chip components used in the manufacture of external type pole attachments for chip components.

[Conventional technology]

An external perspective view and a sectional view of a conventional chip component holder are shown in FIGS. 3 and 4, respectively.

Conventionally, in order to perform operations such as electrode phase cutting on a large number of chip components, etc., the chip components are held in each through hole 5 of the substrate 2, which has a large number of through holes, as shown in Fig. 4. A holder 6 as shown in Fig. 3 is manufactured using a plate with a rubber lining 3 so that holes of appropriate size are formed in the holder 6, and a chip component is inserted into the holder 6, and the surface to be coated with the electrode plate is prepared. A method was used in which the electrode paste was dipped or applied after protruding from the holder and adjusted so that each surface was at the same height. If the diameter of the pores partially increases due to use, there is a drawback that chip parts may fall off during coating as shown in FIG. 2(a). Furthermore, even when the sizes of chip components are slightly different, it is necessary to prepare a dedicated holder 6.

[Problem to be solved by the invention]

The present invention solves the above-mentioned drawbacks, and makes it possible to easily adjust the holding force of the through-holes of a plate-like holder with through-holes, which is used for holding a large number of chip components at the same time and for tasks such as electrode phase adjustment, using only a rubber lining. It is an object of the present invention to provide a chip component holder that is inexpensive and can be used even with slight dimensional variations, and that can be held securely at a low cost, due to the overlapping structure of elastic sheets.

Structure of the Invention [Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides a method for solving the above-mentioned problems.
A thick silicone or polyethylene sheet is provided in close contact with each other and pasted if necessary, and if necessary, a portion of the sheet corresponding to each hole is torn in advance to make holes.

By inserting chips into the holder in this state to the height required for electrode coating of chip components, chips with large dimensional variations will not fall off, and multiple chip components can be used during work such as external electrode coating. It is a jig that can be handled. Similarly, chip parts with slightly different dimensions can be used for both by slightly changing the thickness of the sheet, and the external type terminal for chip parts provides a chip part holder that can be used in the manufacturing process. .

That is, the present invention provides a plate-shaped jig having a plurality of through-holes for handling a plurality of chip components at the same time, which includes a plate-shaped substrate or a rubber-lined substrate having through-holes with dimensions close to the outer dimensions of the chip components; This chip component holder is characterized in that a silicone or polyethylene sheet is provided in close contact with the chip component insertion side surface of the substrate or rubber lining substrate.

[Effect]

The elasticity of the silicon sheet or polyethylene sheet interposed between the through hole and the chip component is determined by pushing a part of the silicon sheet or polyethylene sheet stacked on a perforated substrate with dimensions close to the outside dimensions of the chip component into the through hole along with the chip component. to hold the chip parts.

〔Example〕

Embodiments of the present invention will be described using the drawings.

FIG. 1 is a cross-sectional view of a chip component holder according to an embodiment of the present invention near the through hole, showing a state in which a chip part is inserted;
Figure 1 (a) shows a case where there is a large difference between the outside dimensions of the chip component and the dimensions of the through hole of the holder, and Figure 1 (b) shows the difference between the outside dimensions of the chip component and the dimensions of the through hole of the holder. This shows the case where there is almost no through hole or the size of the through hole is small.

Figure 2 is a cross-sectional view of the vicinity of the through hole when the chip is inserted into a conventional holder, and Figure 2 (a) shows that the outer dimensions of the chip component l are larger than the hole dimensions of the rubber lining 3 of the holder. Fig. 2(b) shows a state in which the electrode paste 7 falls off due to the adhesive force when it is only slightly small and the holding force is small.
The outer dimensions of the chip component 1 are the rubber lining 3 of the holder.
This shows a state in which the rubber lining 3 is damaged due to insertion of a chip component when the size of the hole is too large.

First, a case will be described in which chips with large dimensional variations are coated using a conventional manufacturing method. In the conventional method, even if a rubber lining with an appropriate diameter is placed at the center of the variation, the holding force is weak for small parts with a small dimensional difference from the diameter of the through hole, and as shown in Figure 2 (a), the electrode paste 7 If the viscosity of is negative, the chip component 1 will fall off. Furthermore, as shown in FIG. 2(b), when the chip component 1 has a large size, a load is applied to the rubber lining at the time of insertion, causing the rubber of the rubber lining to be damaged and peeled off.

On the other hand, when a rubber-lined perforated substrate is used as an example of the method according to the present invention, as shown in FIG. A substrate 2 which had been subjected to the following steps was used.

In the case of a rectangular chip component, the diameter of this rubber lining is 2 times larger than the dimension of chip component 1 in the direction of the diagonal distance of the component.
% to 5% smaller diameter was chosen. 1 on the top of this holder.
Layer polyethylene sheets 4 with a thickness of 00 μm and make a hole in the center of the through-hole part with a bottle so that the outer dimension is 10 m.
The chip component 1 of 5 ml x 6 bottles was inserted into the holder.

The chip parts received enough holding power to withstand coating due to the rubber lining and the thickness of the sheet, and electrode coating work could be performed without falling off. In addition, in the case of chip parts with slightly larger dimensions, the sheet was torn at the time of insertion, so the electrode coating work could be performed while maintaining sufficient holding power without peeling off the rubber lining.

Furthermore, when 3,000 chip parts with a diagonal dimension of approximately 6.7 cm were tested using the conventional method shown in Table 1 and the method of the present invention in the same manner as described above, there was no significant drop-off or damage to the rubber lining. I was able to improve it.

Table 1 C8 Effects of the Invention [Effects of the Invention] As shown in the examples above, the present invention makes it possible to reliably handle a large number of chip components at the same time, with fewer parts falling off, and even slight dimensional variations. It is also possible to provide a chip component holder with a simple structure and low cost.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a chip component holder according to an embodiment of the present invention near the through hole, showing a state in which a chip part is inserted;
Figure 1 (a) shows a case where there is a large difference between the outside dimensions of the chip component and the dimensions of the through hole of the holder, and Figure 1 (b) shows the difference between the outside dimensions of the chip component and the dimensions of the through hole of the holder. Indicates a case where there is almost no or a small amount. Figure 2 is a cross-sectional view of the vicinity of the through hole when the chip is inserted into a conventional holder, and Figure 2 (a) shows that the outer dimensions of the chip component are only slightly smaller than the dimensions of the rubber lining of the holder. Figure 2(b) shows a state in which the chip component falls off due to the adhesive force of the electrode paste 7 when the holding force is small, and Fig. 2(b) shows a state in which the chip component falls off due to the adhesive force of the electrode paste 7. This shows a condition where the rubber lining is damaged. FIG. 3 is an external perspective view of a conventional chip component holder. FIG. 4 is a sectional view of the vicinity of a through hole of a conventional holding plate. DESCRIPTION OF SYMBOLS 1... Chip component, 2... Substrate, 3... Rubber lining, 4... Sheet, 5... Through hole, 6... Holder, 7... Paste for electrode. Figure 7 Figure 2 Patent applicant Tokin Co., Ltd.

Claims (1)

[Claims] 1. In a plate-shaped jig having a plurality of through-holes for handling a plurality of chip components at the same time, a plate-shaped substrate or a rubber-lined substrate having a through-hole with dimensions close to the outer dimensions of the chip components, and the substrate or rubber-lined substrate A chip component holder characterized in that a silicon or polyethylene sheet is provided in close contact with the chip component insertion side surface of the chip component holder.