CN219658669U

CN219658669U - Film uncovering jig

Info

Publication number: CN219658669U
Application number: CN202320435801.5U
Authority: CN
Inventors: 王世燕; 闫世亮; 刘盛华; 张雷; 李彦霖
Original assignee: Shanghai Beixin Integrated Circuit Technology Co ltd
Current assignee: Shanghai Beixin Integrated Circuit Technology Co ltd
Priority date: 2023-03-09
Filing date: 2023-03-09
Publication date: 2023-09-08
Anticipated expiration: 2033-03-09

Abstract

The utility model discloses a film uncovering jig, which is used for a film uncovering process of a wafer and comprises the following steps: the first positioning module and the film uncovering module. The wafer is fixed on the first positioning module; the film uncovering module uncovers the film on the wafer. The utility model adopts a semi-automatic means, greatly improves the film uncovering efficiency and reduces the production cost.

Description

Film uncovering jig

Technical Field

The utility model relates to the technical field of chip packaging processes, in particular to a film uncovering jig.

Background

In the prior art, the film uncovering process of the wafer still adopts manual film uncovering by a bit, which has low efficiency and consumes a great deal of manual work, thereby leading to higher cost.

Disclosure of Invention

According to an embodiment of the present utility model, there is provided a film uncovering jig for a film uncovering process of a wafer, including: the first positioning module and the film uncovering module. The wafer is fixed on the first positioning module; the film uncovering module uncovers the film on the wafer.

Further, the first positioning module includes: the first positioning plate is provided with a first groove, and the wafer can be fixed in the first groove.

Further, a pair of second grooves are further formed in the first positioning plate, and the second grooves are respectively formed in two ends of the first groove and are communicated with the first groove.

Further, the depth of the first groove is less than the thickness of the wafer.

Further, the depth of the second groove is greater than the depth of the first groove.

Further, the film uncovering module comprises: a film uncovering plate and a film-sticking part; the film uncovering plate is connected with the mucosa component; the adhesive member may adhere to the film and release the film from the wafer.

Further, the film uncovering plate is provided with small holes, and the area of the small holes is not smaller than that of the wafer.

Further, the method further comprises the following steps: the second positioning module is used for fixing the first positioning module.

Further, the method further comprises the following steps: the jacking mechanism is connected with the film uncovering module and can jack up the film uncovering module.

According to the film uncovering jig provided by the embodiment of the utility model, a semi-automatic means is adopted, so that the film uncovering efficiency is greatly improved, and the production cost is reduced.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the technology claimed.

Drawings

FIG. 1 is an exploded view of a perspective view according to an embodiment of the present utility model;

FIG. 2 is a perspective view of an embodiment according to the present utility model;

fig. 3 is a front view of an embodiment according to the present utility model.

Description of the embodiments

The preferred embodiments of the present utility model will be described in detail below with reference to the attached drawings, which further illustrate the present utility model.

Firstly, a film uncovering jig according to an embodiment of the utility model will be described with reference to fig. 1 to 3, and is used in the technical field of chip packaging technology, and has a wide application range.

As shown in fig. 1 to 3, the film uncovering jig according to the embodiment of the utility model is used for a film uncovering process of a wafer 5, and comprises: a first positioning module and a film uncovering module 2. Wherein the wafer 5 is fixed on the first positioning module; the film stripping module 2 strips off the film on the wafer 5.

Specifically, as shown in fig. 1 to 2, in this embodiment, the first positioning module includes: on the first locating plate 1, a first groove 11 is formed in the first locating plate 1, and the wafer 5 can be fixed in the first groove 11 to prevent the wafer 5 from moving in the film uncovering process.

Further, as shown in fig. 1-2, in this embodiment, the first positioning plate 1 is further provided with a pair of second grooves 12, and the pair of second grooves 12 are respectively disposed at two ends of the first groove 11 and are communicated with the first groove 11, so that the wafer 5 is more convenient to be placed and lifted.

Further, as shown in fig. 1-2, in this embodiment, the depth of the first groove 11 is smaller than the thickness of the wafer 5, so that the wafer 5 protrudes to facilitate film uncovering.

Further, as shown in fig. 1-2, in this embodiment, the depth of the second groove 12 is greater than that of the first groove 11, so as to facilitate placement and lifting of the wafer 5.

Specifically, as shown in fig. 1 to 2, in this embodiment, the film stripping module 2 includes: a film-uncovering plate 21 and a film-sticking member (not shown in the figure); the film uncovering plate 21 is connected with the mucous membrane component; the adhesive means, preferably an adhesive tape, is adapted to adhere to the film and to adhere the film and release it from the wafer 5.

Further, as shown in fig. 1-2, in this embodiment, the film uncovering plate 21 is provided with a small hole 211, the round area of the small hole 211 is not smaller than that of the wafer 5, the small hole 211 is sleeved on the wafer 5, and the film uncovering is facilitated because the film uncovering part is attached to the small hole 211.

Further, as shown in fig. 1 to 2, in this embodiment, the method further includes: the second positioning module 3, the second positioning module 3 is used for fixing the first positioning module.

Specifically, as shown in fig. 1 to 3, in this embodiment, the method further includes: the jacking mechanism 4 is connected with the film uncovering module 2 and can jack up the film uncovering module 2; the lifting mechanism 4 is preferably a link mechanism, and after the film is completely stuck to the film, the lifting mechanism 4 lifts up the film uncovering module 2, and the film is separated from the wafer 5.

In use, a certain number of wafers 5 are manually placed in the first grooves 11 of each first positioning plate 1; placing the first positioning plate 1 with the wafer 5 on the second positioning module 3 and fixing the first positioning plate; then the adhesive film component is stuck on the small hole 211, the film uncovering plate is sleeved on the wafer 5, and the adhesive film component is pressed, so that the adhesive film component is tightly adhered with the film on the wafer 5; then, the jacking mechanism 4 is rotated to jack up the film uncovering plate 21, and the film is separated from the wafer 5; finally, a new first locating plate 1 and a new film uncovering module 2 are replaced, and the next film uncovering process is carried out.

In the above, the film uncovering jig according to the embodiment of the utility model is described with reference to fig. 1 to 3, and the semi-automatic means is adopted, so that the film uncovering efficiency is greatly improved, and the production cost is reduced.

It should be noted that in this specification the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.

While the present utility model has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the utility model. Many modifications and substitutions of the present utility model will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the utility model should be limited only by the attached claims.

Claims

1. A take off membrane tool for take off membrane technology of wafer, its characterized in that includes:

the wafer is fixed on the first positioning module;

the film uncovering module uncovers the film on the wafer;

the film uncovering module comprises: a film uncovering plate and a film-sticking part;

the film uncovering plate is connected with the mucosa component;

the adhesive member may adhere to the film and remove the film from the wafer.

2. The film uncovering jig according to claim 1, wherein the first positioning module comprises: the wafer positioning device comprises a first positioning plate, wherein a first groove is formed in the first positioning plate, and the wafer can be fixed in the first groove.

3. The film uncovering jig according to claim 2, wherein the first positioning plate is further provided with a pair of second grooves, and the second grooves are respectively arranged at two ends of the first groove and are communicated with the first groove.

4. The film uncovering jig according to claim 2, wherein the depth of the first groove is smaller than the thickness of the wafer.

5. The film uncovering jig according to claim 3, wherein the depth of the second groove is larger than the depth of the first groove.

6. The film uncovering jig according to claim 1, wherein the film uncovering plate is provided with a small hole, and the round area of the small hole is not smaller than the round area of the wafer.

7. The film uncovering jig according to claim 6, further comprising: the second positioning module is used for fixing the first positioning module.

8. The film uncovering jig according to any one of claims 1 to 7, further comprising: the jacking mechanism is connected with the film uncovering module and can jack up the film uncovering module.