JPH0388347A - Resin transfer body - Google Patents
Resin transfer bodyInfo
- Publication number
- JPH0388347A JPH0388347A JP22479789A JP22479789A JPH0388347A JP H0388347 A JPH0388347 A JP H0388347A JP 22479789 A JP22479789 A JP 22479789A JP 22479789 A JP22479789 A JP 22479789A JP H0388347 A JPH0388347 A JP H0388347A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- transfer body
- predetermined
- transferred
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 88
- 239000011347 resin Substances 0.000 title claims abstract description 88
- 239000011248 coating agent Substances 0.000 abstract description 13
- 238000000576 coating method Methods 0.000 abstract description 13
- 239000012790 adhesive layer Substances 0.000 abstract description 10
- 239000004840 adhesive resin Substances 0.000 abstract description 6
- 229920006223 adhesive resin Polymers 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 description 18
- 230000001070 adhesive effect Effects 0.000 description 18
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は樹脂転写体に係り、特にチップ型電子部品など
接着固定するための樹脂接着剤層の被着形成に適する樹
脂転写体に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a resin transfer body, and in particular to a resin suitable for forming a resin adhesive layer for adhesively fixing chip-type electronic components. Concerning transcripts.
（従来の技術）
たとえばＩＣチップを回路基板面に実装などする場合、
回路基板の所定面に樹脂接着剤を被着乃至塗着し、この
樹脂接着剤で前記ＩＣチップを接着、固定している。し
かして、前記回路基板の所定面に対する樹脂接着剤の被
着乃至塗着は、−般に第３図に斜視的に示すような構成
の樹脂転写体を用いて行われている。すなわち、樹脂接
着剤層の形成領域に対応した樹脂塗着面（所定面）１を
有する樹脂転写体２を先ず用意し、前記樹脂塗着面（所
定面）１に所要の樹脂接着剤を塗着した後、回路基板の
所定領域面に、前記塗着した樹脂接着剤面を対接させ樹
脂転写体２を押圧し、塗着した樹脂接着剤を回路基板の
所定領域面に転写する方式が採用されている。(Prior art) For example, when mounting an IC chip on the surface of a circuit board,
A resin adhesive is applied or applied to a predetermined surface of the circuit board, and the IC chip is bonded and fixed with this resin adhesive. The application of the resin adhesive to a predetermined surface of the circuit board is generally carried out using a resin transfer body having a structure as shown in perspective in FIG. 3. That is, a resin transfer body 2 having a resin coating surface (predetermined surface) 1 corresponding to the formation area of the resin adhesive layer is first prepared, and a desired resin adhesive is applied to the resin coating surface (predetermined surface) 1. After applying the adhesive, the applied resin adhesive surface is brought into contact with the surface of a predetermined area of the circuit board, and the resin transfer body 2 is pressed, thereby transferring the applied resin adhesive onto the surface of the predetermined area of the circuit board. It has been adopted.
（発明が解決しようとする課題）
しかし、−上記構成の樹脂転写体を用い、所要の樹脂接
着剤を回路基板の所定領域面に転写、塗着した場合、次
のような不都合が往々認められる。(Problems to be Solved by the Invention) However, - When a resin transfer body having the above configuration is used to transfer and apply the required resin adhesive to a predetermined area surface of a circuit board, the following inconveniences are often observed. .
すなわち、樹脂塗着面１に樹脂接着剤を塗着し、回路基
板の所定領域面に樹脂転写体２を押圧し、前記塗着した
樹脂接着剤を回路基板３の所定領域面に転写した場合、
−様に乃至−様な厚さの樹脂接着剤層を回路基板３面上
に被着形成し得ないことがしばしばある。つまり、第４
図に模式的に示すように、転写する樹脂接着剤は、それ
自体粘性および揺変性を有するため、前記樹脂塗着面１
に樹脂接着剤をＰ！１！着し、回路基板３の所定領域面
に樹脂転写体２を押圧した後、回路基板３面から離すと
き樹脂の糸引き４現象が起り、この糸引き４現象により
転写された樹脂接着剤層は、外形辺部５が比較的厚く中
央部が薄く（糸引き現象で樹脂転写体２にて持去られる
ため）とバラツキが生じる。したがって電子部品、たと
えばＩＣチップを所望通り接着、固定し得ない場合がし
ばしば起る。That is, when a resin adhesive is applied to the resin application surface 1, a resin transfer body 2 is pressed onto the surface of a predetermined area of the circuit board, and the applied resin adhesive is transferred onto the surface of the predetermined area of the circuit board 3. ,
It is often not possible to deposit a resin adhesive layer with a thickness of - to - on the surface of the circuit board 3. In other words, the fourth
As schematically shown in the figure, since the resin adhesive itself has viscosity and thixotropy,
P the resin adhesive! 1! After applying the resin transfer body 2 to the surface of a predetermined area of the circuit board 3, when the resin transfer body 2 is released from the surface of the circuit board 3, a stringing phenomenon 4 of the resin occurs, and due to this stringing phenomenon 4, the transferred resin adhesive layer , the outer side portion 5 is relatively thick and the center portion is thin (because it is removed by the resin transfer body 2 due to the stringing phenomenon), and variations occur. Therefore, it often happens that electronic components such as IC chips cannot be bonded or fixed as desired.
また、前記転写された樹脂接着剤層の厚さのバラツキ問
題は、樹脂転写体２の樹脂塗着面１の大きさ（転写され
る樹脂接着剤領域の大きさ）が大きくなるほど顕著にな
り、実用上山々しい問題となっている。Further, the problem of variations in the thickness of the transferred resin adhesive layer becomes more noticeable as the size of the resin application surface 1 of the resin transfer body 2 (the size of the resin adhesive area to be transferred) increases. This poses a number of practical problems.
本発明は上記事情に対処してなされたもので、常にかつ
容易に、所要の樹脂接着剤層を押圧、転写で形威し得る
樹脂転写体を提供することを目的とする。The present invention has been made in response to the above-mentioned circumstances, and an object of the present invention is to provide a resin transfer member that can always and easily form a desired resin adhesive layer by pressing and transferring.
［発明の構成］
（ａ題を解決するための手段）
本発明は、所定面に所要の樹脂を塗着し、この塗着した
樹脂を被転写面に押圧転写する樹脂転写体において、前
記樹脂を塗着する所定面（樹脂塗１１面）が形設した溝
部によって複数の領域に分割されていることを特徴とす
る。[Structure of the Invention] (Means for Solving Problem a) The present invention provides a resin transfer body in which a predetermined resin is applied to a predetermined surface and the applied resin is transferred by pressure to a transfer target surface. It is characterized in that the predetermined surface to be coated (the 11 resin-coated surfaces) is divided into a plurality of regions by formed grooves.
（作 用）
上記のように本発明に係る樹脂転写体においては、樹脂
を塗着する所定面（樹脂塗着面）が溝により分割化され
た構造となっているため、塗着した樹脂を被転写面に抑
圧転写した後、回路基板面から離すとき樹脂の糸引き現
象も全体的に分剤、低減され、転写された樹脂接着剤層
の厚さのバラツキも大幅に抑制される。(Function) As described above, the resin transfer body according to the present invention has a structure in which the predetermined surface on which the resin is applied (resin application surface) is divided by grooves, so that the applied resin can be separated. After suppressed transfer to the transfer surface, when the resin is separated from the circuit board surface, the stringing phenomenon of the resin is also reduced overall, and variations in the thickness of the transferred resin adhesive layer are also significantly suppressed.
（実施例）
以下本発明の詳細な説明する。第１図は本発明に係る樹
脂転写体の一構成例を斜視的に示したもので、樹脂接着
剤層の形成領域に対応した樹脂塗着面（所定面）１を有
する樹脂転写体本体２ａと、この樹脂転写体本体２ａの
前記樹脂塗着面（所定面）１に対し反対側に一体的に配
設された把持部２ｂとを具備しかつ、前記樹脂転写体本
体２ａの樹脂塗着面（所定面）１が溝部１ａの形設によ
り複数の領域ｔｂに分割された構成を成している。つま
り、本発明の樹脂転写体は、樹脂塗着面１に所定間隔で
たとえばＸ、Ｙ方向の溝１ａを形設し、それぞれ略−様
な面積をなすように複数の方形領域１ｂなどに分割化し
−たことをもって特徴付けられる。しかして、上記分割
される領域ｔｂの形状は、前記方形に限られずたとえば
六方形などのハニカム状もしくは円形なとであってもよ
い。(Example) The present invention will be described in detail below. FIG. 1 is a perspective view showing an example of the structure of a resin transfer body according to the present invention, and shows a resin transfer body main body 2a having a resin coating surface (predetermined surface) 1 corresponding to the formation area of the resin adhesive layer. and a grip portion 2b integrally disposed on the opposite side to the resin coating surface (predetermined surface) 1 of the resin transfer body main body 2a, and A surface (predetermined surface) 1 is divided into a plurality of regions tb by forming grooves 1a. In other words, the resin transfer body of the present invention has grooves 1a formed in the X and Y directions at predetermined intervals on the resin coating surface 1, and divided into a plurality of rectangular areas 1b each having an area of approximately -. It is characterized by the fact that it has changed. The shape of the divided regions tb is not limited to the square shape, but may be a honeycomb shape such as a hexagonal shape, or a circular shape.
次に上記構成の本発明に係る樹脂転写体２による、回路
基板３に対する樹脂接着剤の転写塗着の例を説明する。Next, an example of transfer application of a resin adhesive to the circuit board 3 using the resin transfer body 2 according to the present invention having the above-mentioned configuration will be described.
先ず、溝部１ａの形設により複数の領域１ｂに分割され
た前記樹脂転写体２の樹脂塗着面１に、ペースト状に調
製された樹脂接着剤を押印方法で塗着する。次いでこの
樹脂転写体２の前記樹脂接着剤を塗着した面を、回路基
板３の所定領域面に押圧して、塗着していた樹脂接着剤
を前記回路基板３の所定領域面に転写、塗着する。この
転写、塗着後、前記樹脂転写体２を回路基板３から引き
離したところ、第２図に模式的に示すように、はぼ−様
に樹脂接着剤が転写、塗着されていた。つまり、樹脂転
写体２の樹脂塗着１１ｊ２が適宜分割、細分化されてい
るため、糸引き４現象も小さく抑えられる一方、この糸
引き４現象および外形辺部５の盛り上りは分割領域ｔｂ
に対応する領域毎に一様に生じるので、全体的に膜厚乃
至塗着ムラなどの少ない接着樹脂領域の形成が容易に達
成される。このように、転写、塗着の均一性を容易に向
上し得ることは、たとえばＩＣチップなどの接着、固定
など容易に、また確実に達成し得ることになり、前記接
着樹脂の転写、塗着領域の大きさが大きいほど有、効な
ことを意味する。First, a resin adhesive prepared in the form of a paste is applied by a stamping method to the resin application surface 1 of the resin transfer body 2, which is divided into a plurality of regions 1b by forming the grooves 1a. Next, the surface of the resin transfer body 2 coated with the resin adhesive is pressed against the surface of a predetermined region of the circuit board 3 to transfer the applied resin adhesive onto the surface of the predetermined region of the circuit board 3. Paint. After the transfer and coating, when the resin transfer body 2 was separated from the circuit board 3, the resin adhesive had been transferred and coated in a pattern as shown schematically in FIG. In other words, since the resin coating 11j2 of the resin transfer body 2 is divided and subdivided as appropriate, the stringing 4 phenomenon can be suppressed to a small level, while the stringing 4 phenomenon and the swelling of the outer side 5 are caused by the divided area tb.
Since the adhesive resin is formed uniformly in each area corresponding to the area, it is easy to form an adhesive resin area with less unevenness in film thickness or coating overall. In this way, it is possible to easily improve the uniformity of transfer and coating, for example, by adhering and fixing IC chips, etc. The larger the area, the more effective it is.
【発明の効果］
上記説明から分るように、本発明に係る樹脂転写体によ
れば、所定領域面に全体的に膜厚乃至塗着ムラなどのな
い接着樹脂領域を容易に転写、塗着し得る。つまり、所
定領域面全体に°、糸引き現象発生部および盛り上り部
（押圧により周面部に押し出されて形成される部分）が
分散した状態を成すため、全体としてほぼ均一な転写、
塗着層の形成が可能となる。Effects of the Invention As can be seen from the above description, according to the resin transfer body of the present invention, it is possible to easily transfer and apply an adhesive resin area on a predetermined area surface without any unevenness in film thickness or coating. It is possible. In other words, since the stringing phenomenon occurrence part and the raised part (the part formed by being pushed out to the peripheral surface part by pressure) are dispersed over the entire surface of the predetermined area, the transfer is almost uniform as a whole.
It becomes possible to form a coating layer.
第１図は本発明に係る樹脂転写体の構成例を示す斜視図
、第２図は本発明に係る樹脂転写体によって転写、塗着
した接着樹脂領域の状態を模式的に示す断面図、第３図
は従来の樹脂転写体の構成を示す斜視図、第４図は従来
の樹脂転写体によって転写、塗着し、た接着樹脂領域の
状態を模式的に示す断面図である。
１・・・・・・樹脂塗着面
ｌａ・・・・・・溝
ｌｂ・・・・・・分割領域
２・・・・・・樹脂転写体
２ａ・・・・・・樹脂転写体本体
２ｂ・・・・・・把持部
３・・・・・・回路基板FIG. 1 is a perspective view showing a configuration example of a resin transfer body according to the present invention, FIG. 2 is a sectional view schematically showing the state of an adhesive resin area transferred and applied by the resin transfer body according to the present invention, FIG. 3 is a perspective view showing the structure of a conventional resin transfer body, and FIG. 4 is a sectional view schematically showing the state of the adhesive resin area transferred and applied by the conventional resin transfer body. 1...Resin coating surface la...Groove lb...Divided area 2...Resin transfer body 2a...Resin transfer body main body 2b ...Gripping part 3...Circuit board
Claims (1)
転写面に押圧転写する樹脂転写体であって、前記樹脂を
塗着する所定面が形設した溝部によって複数の領域に分
割されていることを特徴とする樹脂転写体。A resin transfer body in which a required resin is applied to a predetermined surface and the applied resin is transferred by pressure to a transfer target surface, and the predetermined surface to which the resin is applied is divided into a plurality of regions by formed grooves. A resin transfer body characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22479789A JPH0388347A (en) | 1989-08-31 | 1989-08-31 | Resin transfer body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22479789A JPH0388347A (en) | 1989-08-31 | 1989-08-31 | Resin transfer body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388347A true JPH0388347A (en) | 1991-04-12 |
Family
ID=16819353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22479789A Pending JPH0388347A (en) | 1989-08-31 | 1989-08-31 | Resin transfer body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388347A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6770157B2 (en) * | 2000-11-20 | 2004-08-03 | Valeo | Method and apparatus for adhesive fastening of friction clutch liners on a support plate |
| US9443777B2 (en) | 2012-05-18 | 2016-09-13 | Kyocera Corporation | Semiconductor element housing package, semiconductor device, and mounting structure |
-
1989
- 1989-08-31 JP JP22479789A patent/JPH0388347A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6770157B2 (en) * | 2000-11-20 | 2004-08-03 | Valeo | Method and apparatus for adhesive fastening of friction clutch liners on a support plate |
| US9443777B2 (en) | 2012-05-18 | 2016-09-13 | Kyocera Corporation | Semiconductor element housing package, semiconductor device, and mounting structure |
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