JPH046801A - Film-shaped electronic parts - Google Patents
Film-shaped electronic partsInfo
- Publication number
- JPH046801A JPH046801A JP10663190A JP10663190A JPH046801A JP H046801 A JPH046801 A JP H046801A JP 10663190 A JP10663190 A JP 10663190A JP 10663190 A JP10663190 A JP 10663190A JP H046801 A JPH046801 A JP H046801A
- Authority
- JP
- Japan
- Prior art keywords
- film
- adhesive
- mounting
- electronic parts
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 27
- 230000001070 adhesive effect Effects 0.000 claims abstract description 27
- 239000000126 substance Substances 0.000 claims abstract description 5
- 229920001721 polyimide Polymers 0.000 claims abstract description 3
- 239000013464 silicone adhesive Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 229920006267 polyester film Polymers 0.000 abstract description 3
- 238000009751 slip forming Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（発明の技術分野）
本発明は、フィルム状電子部品の形成技術及び面実装技
術に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a technology for forming a film-like electronic component and a surface mounting technology.
（従来技術）
従来のフィルム状電子部品には接着剤がついていないた
め実装基板に固定する際、基板に仮止めの接着剤を塗布
して、接着していた。その後、回路的接続はフロー半田
方式、 リフロー半田方式等の方法により半田接続して
いた。(Prior Art) Conventional film-shaped electronic components do not have adhesives, so when fixing them to a mounting board, a temporary adhesive was applied to the board for bonding. After that, circuit connections were made by soldering using methods such as flow soldering and reflow soldering.
（この発明が解決しようとしている間１ｐ！、）従来の
フィルム状電子部品には粘着剤が塗布されていないため
第１図ａのように実装基板１．１′上に接着剤２を滴下
し、この接着剤２の上にフィルム状電子部品３，３，４
を乗せ接着剤２を硬化させる。更にフィルム状電子部品
３，３．４を半田５等を使って表面実装を行う、 従
来の方法では、接着剤の塗布工程が必ず必要で、これに
伴い。(1p. while this invention is trying to solve the problem!) Since conventional film-type electronic components are not coated with adhesive, adhesive 2 is dripped onto the mounting board 1.1' as shown in Figure 1a. , film-like electronic components 3, 3, 4 are placed on this adhesive 2.
and harden adhesive 2. Furthermore, in the conventional method of surface mounting film electronic components 3, 3.4 using solder 5, etc., an adhesive application step is always required.
接着剤の滴下量調整や、接着剤の交換、＊布、焼付は等
作業時間を要する。他に接着剤の管理が煩雑であるとい
う欠点もあった０本発明は上記の欠点を改良し、基板実
装が簡単に行えるフィルム状電子部品を提供するもので
ある。Adjusting the amount of adhesive dripped, replacing the adhesive, *clothing, baking, etc. requires time. Another drawback is that the management of adhesives is complicated.The present invention improves the above drawbacks and provides a film-shaped electronic component that can be easily mounted on a board.
（問題点を解決する手段）
本発明はフィルム状電子部品の実装面、又は、表裏両面
に粘着剤を塗布することより欠点を改良したものである
。(Means for Solving the Problems) The present invention improves the drawbacks by applying an adhesive to the mounting surface or both the front and back surfaces of a film-like electronic component.
（実施例）
本発明の実施例を図面に基づいて説明する。１１２１１
と１１３１１に実施例として基板装着面に粘着物質のつ
いたフィルム状電子部品のＷ遣方法と実装手順を示す、
まず第２１ａ ａのようにポリイミドフィルム４上にｍ
抗腰３及び電極３を連続的に形成しフィルム状抵抗器と
する０次にＩ！２１１ｂのようにフィルム状抵抗３，３
’、４の電極面をのぞいた部分にシリコン粘着剤６を印
刷方式で塗布する。(Example) An example of the present invention will be described based on the drawings. 11211
and 11311 show an example of the W method and mounting procedure for a film-like electronic component with an adhesive substance attached to the board mounting surface.
First, as in No. 21a a, m
Zero-order I! where resistance 3 and electrode 3 are continuously formed to form a film resistor! Film resistor 3,3 like 211b
A silicone adhesive 6 is applied by a printing method to the part except the electrode surface of ' and 4.
そして、ＩＩ２図Ｃのように粘着面にＩＩＩ ＩＩフィ
ルムとして剥離剤７を塗布したポリエステルフィルム７
を鮎つけフィルム状電子部品とした。実装時にｗ３図ａ
のように破線部分で連続した抵抗を個別の抵抗に切断・
分割し、先ず剥離フィルム７７を剥し実装面を粘着剤の
塗布しである面とし第３図すのように実装基板１．．１
に仮止めをする。そして、ｌ＋３図Ｃのように半田５を
用いて表面実装を行 う。Then, as shown in Figure II2C, a polyester film 7 is coated with a release agent 7 as a III II film on the adhesive surface.
was made into a film-like electronic component. w3 diagram a during implementation
Cut the continuous resistance into individual resistances at the dashed line as shown in
First, remove the release film 77 and set the mounting surface as the adhesive-coated surface as shown in Figure 3. ．． 1
Temporarily fasten. Then, surface mounting is performed using solder 5 as shown in Figure 1+3C.
この結果従来のように基板に接着剤を塗布する事なく、
いとも簡単に基板への実装が出来る。As a result, there is no need to apply adhesive to the board as in the past.
It can be mounted on a board very easily.
またｔ１４図のように該抵抗器を２個重ねて仮止めし実
装基板に半田ずけすることもできた。In addition, as shown in Figure t14, two resistors could be stacked and temporarily fixed and soldered to the mounting board.
（発明の効果）
従来の方法では基板への仮止め用に接着剤を塗布しなけ
ればならず接着剤に関する作業時間に多くの時間を要し
、接着剤の管理も煩雑であった。(Effects of the Invention) In the conventional method, an adhesive had to be applied for temporary fixing to a substrate, which required a lot of time to work with the adhesive, and the management of the adhesive was complicated.
しかし、本発明によれば仮止め効果は従来と同じで、
シリコン粘着剤の塗布工程を考えても従来では釧々に滴
下していたものが一度で大量に塗布できるため作業時間
が大巾にＭｌｌできしがも接着剤の管理の煩雑さがなく
なる。又該部品を重ねて使用する場合にも簡単に仮止め
ができ実装がきわめて容易になり工業的利用価値はきわ
めて高い。However, according to the present invention, the temporary fixing effect is the same as before,
Considering the process of applying silicone adhesive, it is possible to apply a large amount of silicone adhesive at one time, whereas in the past, it was dripped in small quantities, so the work time is greatly reduced and the complexity of managing adhesives is eliminated. Furthermore, even when the parts are used in stacks, they can be easily temporarily fixed, making mounting extremely easy, and the industrial value is extremely high.
第１Ｅ［は従来方式による表面実装の断面図である。
第２１！ＩＩは、本発明の実施例によるフィルム状電子
部品製造方法の断面図である。
第３図は、本発明の実施例により表面実装手順の断Ｗ図
である。
１１４＋１は１本発明の実施例によるフィルム状電子部
品を２ＩＩ重ねる実装方法の断面図である。
接着剤、 ３はフィルム状電子部品、 ３′はフィルム
状電子部品の電極、４はポリイミドフィルム、 ５は半
田、 ６シリコン粘着剤、７はポリエステルフィルム、
７は剥離剤である。
Ｃ
第２０1E is a sectional view of surface mounting according to a conventional method. 21st! II is a sectional view of a method for manufacturing a film-like electronic component according to an embodiment of the present invention. FIG. 3 is a cross-sectional diagram of a surface mounting procedure according to an embodiment of the present invention. 114+1 is a sectional view of a mounting method for stacking two film-like electronic components according to an embodiment of the present invention. Adhesive, 3 is a film electronic component, 3' is an electrode of the film electronic component, 4 is a polyimide film, 5 is solder, 6 is a silicone adhesive, 7 is a polyester film,
7 is a release agent. C 20th
Claims (5)
品に於て該有機性フイルム面・機能性物質面の片面、ま
たは両面に粘着剤を塗布したことを特徴とする電子部品
。(1) An electronic component comprising a functional substance formed on an organic film, characterized in that an adhesive is applied to one or both surfaces of the organic film and the functional substance.
能性素子が１個、又は２つ以上同一フイルム上に形成さ
れた電子部品。(2) An electronic component according to claim (1) in which one or more individual functional elements are formed on the same film.
た各々の機能性素子が電気的に接続されていることを特
徴とする電子部品。(3) An electronic component characterized in that each functional element formed in the electronic component according to claim (2) is electrically connected.
リイミドである電子部品。(4) The electronic component according to claim (1), wherein the organic film is polyimide.
塗布する粘着剤がシリコン粘着剤である電子部品。(5) The electronic component according to claim (1), wherein the adhesive coated on the organic film is a silicone adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10663190A JPH046801A (en) | 1990-04-24 | 1990-04-24 | Film-shaped electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10663190A JPH046801A (en) | 1990-04-24 | 1990-04-24 | Film-shaped electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH046801A true JPH046801A (en) | 1992-01-10 |
Family
ID=14438464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10663190A Pending JPH046801A (en) | 1990-04-24 | 1990-04-24 | Film-shaped electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046801A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0731903U (en) * | 1993-11-18 | 1995-06-16 | 興和化成株式会社 | Rail fastening structure for widening the gauge |
| JPH0731902U (en) * | 1993-11-18 | 1995-06-16 | 興和化成株式会社 | Rail fastening device for widening gauges |
-
1990
- 1990-04-24 JP JP10663190A patent/JPH046801A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0731903U (en) * | 1993-11-18 | 1995-06-16 | 興和化成株式会社 | Rail fastening structure for widening the gauge |
| JPH0731902U (en) * | 1993-11-18 | 1995-06-16 | 興和化成株式会社 | Rail fastening device for widening gauges |
| JP2531115Y2 (en) * | 1993-11-18 | 1997-04-02 | 興和化成株式会社 | Rail fastening device for rail widening |
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