JPH0468019A - Liquid resin sealing agent - Google Patents
Liquid resin sealing agentInfo
- Publication number
- JPH0468019A JPH0468019A JP2180302A JP18030290A JPH0468019A JP H0468019 A JPH0468019 A JP H0468019A JP 2180302 A JP2180302 A JP 2180302A JP 18030290 A JP18030290 A JP 18030290A JP H0468019 A JPH0468019 A JP H0468019A
- Authority
- JP
- Japan
- Prior art keywords
- agent
- resin
- acid anhydride
- liquid resin
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 10
- 229920005989 resin Polymers 0.000 title claims abstract description 10
- 239000011347 resin Substances 0.000 title claims abstract description 10
- 238000007789 sealing Methods 0.000 title abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims abstract description 5
- 239000003086 colorant Substances 0.000 claims abstract description 4
- 239000007822 coupling agent Substances 0.000 claims abstract description 4
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 4
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 2
- 239000003566 sealing material Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 abstract description 6
- 229920003986 novolac Polymers 0.000 abstract description 5
- 229920001568 phenolic resin Polymers 0.000 abstract description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 150000008064 anhydrides Chemical class 0.000 abstract description 2
- 125000003700 epoxy group Chemical group 0.000 abstract description 2
- 239000005350 fused silica glass Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000008393 encapsulating agent Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- -1 amine imide compounds Chemical class 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明はプラスチックビングリッドアレイヤチーブ、オ
ートメテッドボンデング等の半導体バ・ノケージの半導
体部分を封止する液状樹脂封止材に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a liquid resin encapsulant for sealing the semiconductor portion of a semiconductor panel cage such as a plastic bin grid array chip or an automated bonding device. .
［従来の技術］
従来、半導体パッケージに用いられる一液性の液状樹脂
封止材の硬化剤としてはジシアンジアミド、ジヒドラジ
ド、アミンイミド化合物等のアミン系硬化剤やヘキサハ
イドロ無水フタール酸、テトラハイドロ無水フタール酸
、ドデシニルサクシニック無水フタール酸等の酸無水物
が用いられている。しかし前者については極性が強くバ
イアス特性を低下させ、後者についてはプレッシャーク
ツカー試験での加水分解性が大きい欠点があった。この
為固型のノボラック型フェノール樹脂を硬化剤として用
いる試みがなされたが高粘度のため有機溶剤を併用せざ
るを得ない欠点があった。[Prior Art] Conventionally, as curing agents for one-component liquid resin encapsulants used in semiconductor packages, amine-based curing agents such as dicyandiamide, dihydrazide, and amine imide compounds, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride have been used. , dodecynylsuccinic phthalic anhydride, and other acid anhydrides are used. However, the former has a strong polarity that deteriorates the bias characteristics, and the latter has the drawback of being highly hydrolyzable in the pressure Kutsuka test. For this reason, attempts have been made to use a solid novolac type phenolic resin as a curing agent, but this had the drawback of having to use an organic solvent in combination due to its high viscosity.
従来の技術で述べたように、従来の硬化剤では各れも一
長一短があった。本発明は従来の技術における上述の問
題点に鑑みてなされたもので、その目的とするところは
無溶剤型で塗布性がよい一液性の耐湿信頼性に優れた液
状樹脂封止材を提供することにある。As described in the prior art section, each of the conventional curing agents has advantages and disadvantages. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a one-component liquid resin encapsulant that is solvent-free, has good coating properties, and has excellent moisture resistance and reliability. It's about doing.
本発明はエポキシ樹脂、３核体が８０重量％（以下単に
％と記す）以上で、軟化点が８５℃以下のノボラック型
フェノール樹脂、酸無水物系硬化剤、無機粉末充填剤に
必要に応じて促進剤、カップリング剤、着色剤等を添加
してなることを特徴とする液状樹脂封止材のため、ノボ
ランク型フェノール樹脂による粘度上昇がなくなったも
ので、以下本発明の詳細な説明する。The present invention is applicable to epoxy resins, novolak-type phenolic resins with a trinuclear content of 80% by weight or more (hereinafter simply referred to as %) and a softening point of 85°C or less, acid anhydride hardeners, and inorganic powder fillers. This is a liquid resin encapsulant characterized by the addition of an accelerator, a coupling agent, a coloring agent, etc., thereby eliminating the viscosity increase caused by the novolanc type phenolic resin.The present invention will be described in detail below. .
本発明に用いる液状エポキシ樹脂は１分子中に２個以上
のエポキシ基を有する硬化可能なエポキシ樹脂であるな
らばビスフェノールＡ型エポキシ樹脂、ノボラック型エ
ポキシ樹脂、ハロゲン化エポキシ樹脂、グリシジルエス
テル型エポキシ樹脂、高分子型エポキシ樹脂等の単独、
混合物変性物等容れでもよく特に限定するものではない
。ノボラック型フェノール樹脂は３核体が８０％以上で
、軟化点が８５℃以下であることが必要である。The liquid epoxy resin used in the present invention is a curable epoxy resin having two or more epoxy groups in one molecule, such as bisphenol A type epoxy resin, novolac type epoxy resin, halogenated epoxy resin, glycidyl ester type epoxy resin. , polymer-type epoxy resin, etc. alone,
It is not particularly limited, and may be used as a modified mixture or the like. The novolak type phenolic resin needs to have a trinuclear content of 80% or more and a softening point of 85° C. or less.
この範囲をはずれると高粘度化を招来し塗布性が低下す
る。ノボラック型フェノール樹脂の添加量は酸無水物系
硬化剤量の２倍以内であることが好ましい。酸無水物系
硬化剤としては無水メチルハイミック酸、テトラハイド
ロ無水フタール酸、ヘキサハイドロ無水フタール酸、ド
デシルサクシニック無水フタール酸等のように酸無水物
系硬化剤全般を用いることができる。無機粉末充填剤と
してはシリカ、タルク、炭酸カルシウム、クレー水酸化
アルミニウム等のように無機粉末充填剤全般を用いるこ
とができ全量の４０〜８０％ヲ用イることが好ましい。Outside this range, the viscosity increases and the coating properties deteriorate. The amount of novolac type phenol resin added is preferably within twice the amount of acid anhydride curing agent. As the acid anhydride curing agent, general acid anhydride curing agents can be used, such as methylhimic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, dodecylsuccinic phthalic anhydride, and the like. As the inorganic powder filler, any inorganic powder filler such as silica, talc, calcium carbonate, clay aluminum hydroxide, etc. can be used, and it is preferable to use 40 to 80% of the total amount.
必要に応じて添加される促進剤、カップリング剤、着色
剤等については通常エポキシ樹脂に用いられるものをそ
のまま用いることができ、特に限定するものではない。Regarding accelerators, coupling agents, colorants, etc., which are added as necessary, those normally used for epoxy resins can be used as they are, and are not particularly limited.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例と比較例１乃至３
第１表の配合表に従って材料を配合、混合後、脱泡処理
して液状樹脂封止材を得た。Examples and Comparative Examples 1 to 3 The materials were blended and mixed according to the formulation table in Table 1, and then subjected to defoaming treatment to obtain liquid resin encapsulants.
以下余白
第
表
部
第 ２ 表
実施例と比較例１乃至３の液状樹脂封止材を用いてプラ
スチックピングリッドアレイの半導体部分を封止、加熱
した後の性能試験の結果は第２表のようである。Table 2 shows the margins below Table 2 shows the performance test results after sealing and heating the semiconductor part of the plastic pin grid array using the liquid resin encapsulants of Examples and Comparative Examples 1 to 3. It is.
本発明は上述した如く構成されている。特許請求の範囲
に記載した構成を有する液状樹脂封止材においては無溶
剤型で塗布性がよく、耐湿信頼性を向上させる効果があ
る。The present invention is constructed as described above. The liquid resin encapsulant having the structure described in the claims is solvent-free, has good coating properties, and has the effect of improving moisture resistance reliability.
Claims (1)
軟化点が８５℃以下のノボラック型フェノール樹脂、酸
無水物系硬化剤、無機粉末充填剤に必要に応じて促進剤
、カップリング剤、着色剤等を添加してなることを特徴
とする液状樹脂封止材。(1) Liquid epoxy resin, trinuclear substance is 80% by weight or more,
A liquid resin characterized by being made by adding an accelerator, a coupling agent, a coloring agent, etc. as necessary to a novolac type phenolic resin having a softening point of 85°C or less, an acid anhydride curing agent, and an inorganic powder filler. Sealing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2180302A JPH0468019A (en) | 1990-07-06 | 1990-07-06 | Liquid resin sealing agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2180302A JPH0468019A (en) | 1990-07-06 | 1990-07-06 | Liquid resin sealing agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468019A true JPH0468019A (en) | 1992-03-03 |
Family
ID=16080832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2180302A Pending JPH0468019A (en) | 1990-07-06 | 1990-07-06 | Liquid resin sealing agent |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468019A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08100049A (en) * | 1994-09-30 | 1996-04-16 | Dainippon Ink & Chem Inc | Epoxy resin composition for semiconductor-sealing material |
| US7247683B2 (en) * | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
| US20120001350A1 (en) * | 2009-03-11 | 2012-01-05 | Masahiro Wada | Resin composition for encapsulating semiconductor and semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296020A (en) * | 1985-06-26 | 1986-12-26 | Toshiba Corp | Epoxy resin liquid composition for sealing electronic part |
| JPS6383035A (en) * | 1986-09-29 | 1988-04-13 | Mitsui Petrochem Ind Ltd | Production of trinuclear substituted phenol and composition containing glycidyl ether derivative of trinuclear substituted phenol |
| JPH01185318A (en) * | 1988-01-21 | 1989-07-24 | Toshiba Corp | Epoxy resin casting composition |
-
1990
- 1990-07-06 JP JP2180302A patent/JPH0468019A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296020A (en) * | 1985-06-26 | 1986-12-26 | Toshiba Corp | Epoxy resin liquid composition for sealing electronic part |
| JPS6383035A (en) * | 1986-09-29 | 1988-04-13 | Mitsui Petrochem Ind Ltd | Production of trinuclear substituted phenol and composition containing glycidyl ether derivative of trinuclear substituted phenol |
| JPH01185318A (en) * | 1988-01-21 | 1989-07-24 | Toshiba Corp | Epoxy resin casting composition |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08100049A (en) * | 1994-09-30 | 1996-04-16 | Dainippon Ink & Chem Inc | Epoxy resin composition for semiconductor-sealing material |
| US7247683B2 (en) * | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
| US20120001350A1 (en) * | 2009-03-11 | 2012-01-05 | Masahiro Wada | Resin composition for encapsulating semiconductor and semiconductor device |
| US8653205B2 (en) * | 2009-03-11 | 2014-02-18 | Sumitomo Bakelite Co., Ltd. | Resin composition for encapsulating semiconductor and semiconductor device |
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