JPH0466294A - Brazing method - Google Patents
Brazing methodInfo
- Publication number
- JPH0466294A JPH0466294A JP17863990A JP17863990A JPH0466294A JP H0466294 A JPH0466294 A JP H0466294A JP 17863990 A JP17863990 A JP 17863990A JP 17863990 A JP17863990 A JP 17863990A JP H0466294 A JPH0466294 A JP H0466294A
- Authority
- JP
- Japan
- Prior art keywords
- complex
- brazing method
- mixed solution
- complexes
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000005219 brazing Methods 0.000 title claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims abstract description 9
- 239000011259 mixed solution Substances 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 6
- 150000002902 organometallic compounds Chemical class 0.000 claims abstract description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 239000003960 organic solvent Substances 0.000 claims abstract description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 5
- 239000011574 phosphorus Substances 0.000 claims abstract description 5
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 5
- 239000010936 titanium Substances 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000007650 screen-printing Methods 0.000 claims abstract description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052793 cadmium Inorganic materials 0.000 claims abstract description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 3
- 239000011651 chromium Substances 0.000 claims abstract description 3
- 229910052737 gold Inorganic materials 0.000 claims abstract description 3
- 239000010931 gold Substances 0.000 claims abstract description 3
- 229910052738 indium Inorganic materials 0.000 claims abstract description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000011133 lead Substances 0.000 claims abstract description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims abstract description 3
- 238000010422 painting Methods 0.000 claims abstract description 3
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 3
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 3
- 238000005096 rolling process Methods 0.000 claims abstract description 3
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 3
- 239000010703 silicon Substances 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims abstract description 3
- 239000004332 silver Substances 0.000 claims abstract description 3
- 229910052718 tin Inorganic materials 0.000 claims abstract description 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 3
- 239000011701 zinc Substances 0.000 claims abstract description 3
- 238000004528 spin coating Methods 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- -1 cemented carbide Substances 0.000 claims description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical class CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 2
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 2
- 229910000531 Co alloy Inorganic materials 0.000 claims description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 2
- 229910001296 Malleable iron Inorganic materials 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 229910000754 Wrought iron Inorganic materials 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 150000004703 alkoxides Chemical class 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 229910052790 beryllium Inorganic materials 0.000 claims description 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000010962 carbon steel Substances 0.000 claims description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229910052744 lithium Inorganic materials 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical class PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims 1
- 239000000945 filler Substances 0.000 abstract description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract description 4
- 230000004907 flux Effects 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000010953 base metal Substances 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 3
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 3
- 229940088601 alpha-terpineol Drugs 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 2
- LAIUFBWHERIJIH-UHFFFAOYSA-N 3-Methylheptane Chemical compound CCCCC(C)CC LAIUFBWHERIJIH-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- NUMHJBONQMZPBW-UHFFFAOYSA-K bis(2-ethylhexanoyloxy)bismuthanyl 2-ethylhexanoate Chemical compound [Bi+3].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O NUMHJBONQMZPBW-UHFFFAOYSA-K 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000004699 copper complex Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- RQZVTOHLJOBKCW-UHFFFAOYSA-M silver;7,7-dimethyloctanoate Chemical compound [Ag+].CC(C)(C)CCCCCC([O-])=O RQZVTOHLJOBKCW-UHFFFAOYSA-M 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、金属やセラミックスのろう付法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for brazing metals and ceramics.
（従来技術とその問題点）
従来のろう付法は、ろう材を接合部の隙間にはさみ熱処
理により金属同士を接合させる方法が主であるが、この
方法では、ろう材の使用量が多く、また複雑な形状のろ
う材の加工が困難である。(Prior art and its problems) Conventional brazing methods mainly involve joining metals together through heat treatment by inserting a brazing filler metal into the gap between joints, but with this method, a large amount of brazing filler metal is used; Furthermore, it is difficult to process a brazing material having a complicated shape.
この点を改良して開発されているものにセラミックス同
士を接合させるのに厚膜ペーストろうかあるが、粉末と
有機樹脂、有機溶媒を混合分散させたもので、スクリー
ン印刷等で金属上に該厚膜ペーストろうを塗布し熱処理
して接合させるものであるが、粉末を用いているため膜
厚か１０μｍ以上となりバラツキが大きく、また、成分
組成に均一性を欠き、ピンホールが存在しやすくなるた
め密着強度か不十分となる欠点かあった。Thick film paste wax has been developed to improve this point and is used to bond ceramics together, but it is made by mixing and dispersing powder, organic resin, and organic solvent, and is applied to metals by screen printing, etc. This method involves applying a thick film paste solder and heat-treating it for bonding, but since powder is used, the film thickness is over 10 μm, resulting in large variations.Also, the component composition lacks uniformity, and pinholes are likely to exist. Therefore, there was a drawback that the adhesion strength was insufficient.
（発明の目的）
本発明は、上記従来の欠点を解決するために成されたも
ので、ろう材およびフラックスの節約をはかれ、複雑な
形状へ直接塗布して接合することのでき密着強度の強い
金属やセラミックスのろう付法を提供することを目的と
する。(Object of the Invention) The present invention has been made to solve the above-mentioned conventional drawbacks, and it is possible to save on brazing filler metal and flux, and it can be directly applied and bonded to complex shapes, and the adhesive strength is improved. The purpose is to provide a method for brazing strong metals and ceramics.
（問題点を解決するための手段）
本発明は、有機金属化合物および／または錯体と有機溶
媒、有機樹脂の混合溶液を金属やセラミックスのろう付
け部に塗布し、加熱して接合させることを特徴とするろ
う付法で、前記有機金属化合物または錯体として、金、
銀、白金、パラジウム、銅、亜鉛、ニッケル、カドミウ
ム、錫、インジウム、マンガン、リチウム、リン、ビス
マス、鉛、ケイ素、クロム、アンチモン、およびチタン
から選ばれた金属の有機酸締塩、アセチルアセトン錯塩
、アルキルホスフィン錯塩、フェニルホスフィン錯塩、
アミン錯塩、カルボニルクラスタ、πアリル錯塩、アル
コキシドのいずれかて、前記母材か銅、銅基合金、軟鋼
、炭素鋼、合金鋼、ステンレス鋼、可鍛鉄、錬鉄、超硬
合金、ニッケル基合金、コバルト基合金、タングステン
、モリブデン、チタン、ジルコニウム、ベリリウム、ニ
オブやセラミックスとしてアルミナ、ジルコニア、窒化
珪素、窒化アルミ等のいずれかであり、前記混合溶液の
塗布方法かスクリーン印刷、筆塗り、ティッピング、ス
ピンコーティング、スプレ、スタンピング、およびロー
リングのいずれかから選ばれた方法であるろう付法であ
る。(Means for Solving the Problems) The present invention is characterized in that a mixed solution of an organometallic compound and/or complex, an organic solvent, and an organic resin is applied to the brazed portion of metal or ceramics, and the mixture is heated and bonded. In the brazing method, the organometallic compound or complex is gold,
Organic acid salts, acetylacetone complex salts of metals selected from silver, platinum, palladium, copper, zinc, nickel, cadmium, tin, indium, manganese, lithium, phosphorus, bismuth, lead, silicon, chromium, antimony, and titanium; Alkylphosphine complex salt, phenylphosphine complex salt,
Amine complex salt, carbonyl cluster, π allyl complex salt, alkoxide, the base material is copper, copper-based alloy, mild steel, carbon steel, alloy steel, stainless steel, malleable iron, wrought iron, cemented carbide, nickel-based alloy, Cobalt-based alloys, tungsten, molybdenum, titanium, zirconium, beryllium, niobium, and ceramics such as alumina, zirconia, silicon nitride, aluminum nitride, etc., and the method of applying the mixed solution is screen printing, brush painting, tipping, spin. Brazing is a method selected from coating, spraying, stamping, and rolling.
（作用）
本発明の方法によれば、各種金属上で各種金属化合物を
塗布、焼成により、拡散により強固に密着する利点を利
用したもので、また母材かセラミックスの場合、上記金
属化合物をいくつか組合わせることによって一部の金属
化合物か加熱焼成時に金属酸化物となり原子レベルでセ
ラミックスとやはり強固に結合する性質を利用したもの
である。(Function) According to the method of the present invention, by coating various metal compounds on various metals and firing them, the advantage of strong adhesion due to diffusion is utilized. This method takes advantage of the property of some metal compounds to become metal oxides when heated and fired, and to bond strongly with ceramics at the atomic level.
以下、本発明の実施例を記載するが、該実施例は本発明
を限定するものではない。Examples of the present invention will be described below, but the examples are not intended to limit the present invention.
（実施例１）
ネオデカン酸銀２０重量％、２−エチルヘキサン階調１
０重量％、２−エチルヘキサン酸ビスマス５重量％、イ
ソブチルメタクリレート１５重量％、ブチルカルピトー
ルアセテート２５重量％、α−ターピネオール１５重量
％、からなる組成の混合溶液をアルミナ基材（５０＋ｎ
ｍＸ５０画×厚み０．８ｍｍ）上にスクリーン印刷し、
塗布乾燥後、コバール（２０ｍｍＸ２０ｍｍｘ厚み２鵬
）を重ね、大気中で３５０°Ｃで１０分間焼成後、水素
雰囲気中７００°Ｃ１３０分間焼成してろう付けした。(Example 1) Silver neodecanoate 20% by weight, 2-ethylhexane gradation 1
A mixed solution having a composition of 0% by weight, 5% by weight of bismuth 2-ethylhexanoate, 15% by weight of isobutyl methacrylate, 25% by weight of butyl carpitol acetate, and 15% by weight of α-terpineol was added to an alumina base material (50+n
Screen print on (m x 50 strokes x thickness 0.8 mm),
After coating and drying, Kovar (20mm x 20mm x 2mm thickness) was layered and baked at 350°C for 10 minutes in the air, and then baked at 700°C for 130 minutes in a hydrogen atmosphere for brazing.
（実施例２）
ニドラドビス（トリフェニルホスフィン）銅錯体５０重
量％、ポリイソメタクリレート１０重量％、ブチルカル
ピトールアセテート２０重量％、α−ターピネオール２
０重量％、からなる組成の混合溶液をタングステン基材
（２０ｍｍＸ ２−２−０ｔｔ厚みＩＩＩｌｍ）上に筆
塗りで、塗布乾燥後、９６％アルミナ（２０ｍｍＸ２０
ｍｍＸ厚み１ｍｍ）を重ね、大気中で３５０°Ｃで加熱
分解後、水素雰囲気中７００°Ｃで焼成してろう付けし
た。(Example 2) Nidradobis(triphenylphosphine) copper complex 50% by weight, polyisomethacrylate 10% by weight, butylcarpitol acetate 20% by weight, α-terpineol 2
A mixed solution with a composition of 0% by weight was applied with a brush onto a tungsten base material (20mm x 2-2-0tt thickness IIIlm), and after drying, 96% alumina (20mm x 20%
(mm×thickness 1 mm) were stacked, and after thermal decomposition at 350°C in the air, they were fired and brazed at 700°C in a hydrogen atmosphere.
（比較例）
銀粉末５０重量％、銅粉末１８重量％、イソブチルメタ
クリレート１０重量％、ブチルカルピトールアセテート
２０重量％、α−ターピネオール１０重量％の組成から
なる混合分散物を三本ロールにて厚膜ペーストろうを調
製し、アルミナ基材（５０ｍｍＸ ５０ｍｍＸ厚み０．
８ｍｍ）上にスクリーン印刷し、塗布乾燥後、コバール
（２０ｍｍＸ２０皿×厚み２ａｕｎ）を重ね、窒素雰囲
気中で８００°Ｃて加熱処理してろう付けした。(Comparative example) A mixed dispersion consisting of 50% by weight of silver powder, 18% by weight of copper powder, 10% by weight of isobutyl methacrylate, 20% by weight of butylcarpitol acetate, and 10% by weight of α-terpineol was thickened with three rolls. A membrane paste solder was prepared, and an alumina base material (50 mm x 50 mm x thickness 0.
8 mm), and after coating and drying, Kovar (20 mm x 20 plates x 2 aun thick) was layered and brazed by heat treatment at 800°C in a nitrogen atmosphere.
以上の実施例１および２と比較例−でろう付けした材料
のろう付け強度を引っ張り強度により測定したところ、
実施例１は１０ｋｇ／ａｍ”以上で、実施例２は４〜８
ｋｇ／ｍｍ２で、比較例は３〜５ｋｇ／＝２であった。The brazing strength of the materials brazed in Examples 1 and 2 and Comparative Example above was measured by tensile strength.
Example 1 is 10 kg/am” or more, and Example 2 is 4 to 8
kg/mm2, and the comparative example was 3 to 5 kg/=2.
この結果から従来法で行うろう材を用いた方法と比較し
ても十分な強度が得られていた。From this result, sufficient strength was obtained compared to the conventional method using brazing filler metal.
なお、実施例１では、予めアルミナ上にメタライズして
おかなくてもセラミックスに密着でき、しかもコバール
との接合面内はピンホールもなく均一に接合されていた
。In addition, in Example 1, it was possible to adhere to the ceramics without metalizing the alumina in advance, and moreover, the bonding surface with Kovar was uniformly bonded without pinholes.
また、実施例２ては、リン銅ろうを用いた有機化合物中
に銅とリンを含有しているため、内部フラックスとして
リンか作用するのでフラックスを用いる必要がない。Further, in Example 2, since copper and phosphorus are contained in the organic compound using the phosphorus-copper solder, the phosphorus acts as an internal flux, so there is no need to use a flux.
（発明の効果）
以上説明したように、本発明の方法によれば、従来のろ
う材を用いる方法や厚膜ペーストを用いる方法では得ら
れない、極めて薄い接合膜により簡便な方法でしかも接
着強度も従来法に劣らないものであり、さらに、従来で
は複雑な形状のものを接合するには粉末を用いる等作業
効率が低いものであったが、本発明の方法によれば複雑
なものでも簡便な塗布方法で接着できるというもので、
技術の発展に寄与すること大なるものである。(Effects of the Invention) As explained above, according to the method of the present invention, it is possible to achieve bonding strength using a simple method using an extremely thin bonding film, which cannot be obtained with conventional methods using a brazing filler metal or a method using a thick film paste. Furthermore, conventional methods used powder to join objects with complex shapes and had low work efficiency, but the method of the present invention can easily join complex objects. It can be attached using a suitable application method.
It is a great contribution to the development of technology.
Claims (4)
混合溶液を母材のろう付け部に塗布し、加熱して接合さ
せることを特徴とするろう付法。(1) A brazing method characterized by applying a mixed solution of an organometallic compound and/or complex and an organic solvent to the brazed portion of a base material and heating and bonding.
、パラジウム、銅、亜鉛、ニッケル、カドミウム、錫、
インジウム、マンガン、リチウム、リン、ビスマス、鉛
、ケイ素、クロム、アンチモン、およびチタンから選ば
れた金属の有機酸錯塩、アセチルアセトン錯塩、アルキ
ルホスフィン錯塩、フェニルホスフィン錯塩、アミン錯
塩、カルボニルクラスタ、π−アリル錯塩、アルコキシ
ドのいずれかである請求項１に記載のろう付法。(2) The organometallic compound or complex is gold, silver, platinum, palladium, copper, zinc, nickel, cadmium, tin,
Organic acid complexes, acetylacetone complexes, alkylphosphine complexes, phenylphosphine complexes, amine complexes, carbonyl clusters, π-allyls of metals selected from indium, manganese, lithium, phosphorus, bismuth, lead, silicon, chromium, antimony, and titanium The brazing method according to claim 1, wherein the brazing method is a complex salt or an alkoxide.
、ステンレス鋼、可鍛鉄、錬鉄、超硬合金、ニッケル基
合金、コバルト基合金、タングステン、モリブデン、チ
タン、ジルコニウム、ベリリウム、ニオブや、セラミッ
クスとしてアルミナ、ジルコニア、窒化珪素、窒化アル
ミ等のいずれかである請求項１に記載のろう付法。(3) The base material is copper, copper-based alloy, mild steel, carbon steel, alloy steel, stainless steel, malleable iron, wrought iron, cemented carbide, nickel-based alloy, cobalt-based alloy, tungsten, molybdenum, titanium, zirconium, beryllium. 2. The brazing method according to claim 1, wherein the ceramic is any one of niobium, alumina, zirconia, silicon nitride, aluminum nitride, etc.
り、ティッピング、スピンコーティング、スプレ、スタ
ンピング、およびローリングのいずれかから選ばれた方
法である請求項１に記載のろう付法。(4) The brazing method according to claim 1, wherein the method for applying the mixed solution is selected from screen printing, brush painting, tipping, spin coating, spraying, stamping, and rolling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17863990A JPH0466294A (en) | 1990-07-06 | 1990-07-06 | Brazing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17863990A JPH0466294A (en) | 1990-07-06 | 1990-07-06 | Brazing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0466294A true JPH0466294A (en) | 1992-03-02 |
Family
ID=16051977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17863990A Pending JPH0466294A (en) | 1990-07-06 | 1990-07-06 | Brazing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0466294A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0857707A3 (en) * | 1997-02-06 | 1999-07-21 | Cerdec Aktiengesellschaft Keramische Farben | Composition for the production of gold-containing decorations and use thereof |
-
1990
- 1990-07-06 JP JP17863990A patent/JPH0466294A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0857707A3 (en) * | 1997-02-06 | 1999-07-21 | Cerdec Aktiengesellschaft Keramische Farben | Composition for the production of gold-containing decorations and use thereof |
| US6071332A (en) * | 1997-02-06 | 2000-06-06 | Cerdec Aktiengesellschaft Kermische Farben | Decorative preparations for producing gold-containing decorations and their use |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU96122818A (en) | METHOD FOR APPLYING METAL ADHESION LAYER (OPTIONS) AND METAL ADHESION LAYER (OPTIONS) | |
| JPS6134107A (en) | Corrosion resistant layer on base body of gas turbine blade and method for providing the same | |
| CN109789482A (en) | Grafting material and the joint method for using the grafting material | |
| JPS597763B2 (en) | Method for forming porous aluminum layer | |
| JPS60177102A (en) | Method for impregnating lead to ferrous sintered alloy | |
| CN104722752A (en) | Slurry and coating method | |
| US5156326A (en) | Brazing flux and method of using the same | |
| JPH02208274A (en) | Composition for metallizing ceramic surface, surface-metallizing method and surface-metallized product | |
| JPH0466294A (en) | Brazing method | |
| WO2005007596A1 (en) | Part for active silver brazing and active silver brazing product using the part | |
| JPH02175674A (en) | Joined body of ceramics and metallic body and method for joining thereof | |
| JPH04118171A (en) | Brazing method utilizing organic metal compound and complex | |
| JPS593077A (en) | Method of bonding ceramic member and metal | |
| GB1489168A (en) | Aluminium brazing method | |
| JP3771487B2 (en) | Brazing sheet excellent in moldability and method for producing the same | |
| JP3896432B2 (en) | Method for producing metal-ceramic composite substrate and brazing material used therefor | |
| JPH04270094A (en) | Brazing material | |
| JPS6090875A (en) | Ceramic and matal bonding method | |
| JPS59141393A (en) | Brazing filler material | |
| JP2012532022A (en) | Brazing method | |
| JPH01154898A (en) | Solder | |
| JPS61291942A (en) | Alloy for metallizing | |
| JPS58161978A (en) | Method of bonding ceramic member and metal member | |
| JP2000343211A (en) | Brazing method | |
| JP2000190069A (en) | Manufacture of plate type heat exchanger |