JP3896432B2 - Method for producing metal-ceramic composite substrate and brazing material used therefor - Google Patents
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【０００１】
【発明の属する技術分野】
本発明は、金属とセラミックスとを接合して複合基板と成す製造方法と、その接合に用いる接合特性に優れたろう材に関する。
【０００２】
【従来の技術】
従来より、金属としての銅板とセラミックス基板として窒化アルミニウム（ＡｌＮ）基板とを接合する方法として、特開昭６０−１６６１６５号公報記載の「窒化物系セラミックスと金属との接合方法」に開示する活性金属ろう接法や、銅板と窒化アルミニウム基板表面を改質させて直接接合するＤＢＣ法（例えば特開昭５６−１６３０９３号公報）等が知られている。
【０００３】
このうち活性金属ろう接法は、ＤＢＣ法に比較して接合強度が高く、得られた接合体はヒートサイクルに対して耐久性が高い等の特性を有することから、酸化物系セラミックス基板以外の例えば窒化物セラミックス基板と銅板との接合に多用されるようになった。
【０００４】
上記活性金属ろう接法に使用されるろう材としては、Ａｇ−Ｃｕ−活性金属（Ｔｉ、Ｚｒ、Ｈｆのいずれか１種）からなるろう材（特開昭６０−１６６１６５号公報）や、Ａｇ−Ｃｕ−水素化チタンからなる活性金属ペースト材（特開平３−１０１１５３号公報）が実用化されている。
【０００５】
【発明が解決しようとする課題】
上記ろう材を用いて窒化アルミニウム基板の上下面に銅板を接合して回路基板を形成することは実用化されているが、近年の回路用基板には、大電力化に対応できるよう、放熱性、電気絶縁性に加え、より高強度でかつ熱衝撃性に優れた基板が望まれていた。
【０００６】
したがって本発明の目的は従来のろう材よりもパワーモジュール基板としての諸特性値を向上させ得るろう材を提供するとともに、このろう材を用いて行う金属−セラミックス複合基板の製造方法を提供することにある。
【０００７】
【課題を解決するための手段】
本発明者らは上記目的を達成すべく鋭意研究した結果、従来公知の活性金属ろう材の組成に特定の酸化物を添加すると、耐ヒートサイクル特性が向上することを見いだし本発明に到達した。
【０００８】
すなわち、本発明は第１に、金属板とセラミックス基板とをろう材で接合して複合基板を製造する方法において、固体分が重量％で、Ｃｕ：５〜３０％，Ｔｉ：０.５〜４.５％，酸化チタン：０.２５〜０.９％，残部Ａｇからなるろう材をセラミックス基板上に塗布する第１工程、次いで該ろう材上に金属板を重ね、加熱接合して金属板−セラミックス基板接合体を得る第２工程、および得られた接合体の金属板上にエッチングレジストにより回路パターンを形成した後、エッチング処理により金属回路を形成する第３工程からなることを特徴とする金属−セラミックス複合基板の製造方法：第２に、金属板とセラミックス基板とをろう材で接合して複合基板を製造する方法において、固体分が重量％で、Ｃｕ粉：５〜３０％，Ｔｉ粉：０.５〜４.５％，酸化チタン粉：０.２５〜０.９％，残部Ａｇ粉からなる粉体１００重量部に対し、１０〜１４重量部のビヒクルを添加混練してペースト状のろう材をセラミックス基板上に塗布する第１工程、次いで該ろう材上に金属板を重ね、加熱接合して金属板−セラミックス基板接合体を得る第２工程、および得られた接合体の金属板上にエッチングレジストにより回路パターンを形成した後、エッチング処理により金属回路を形成する第３工程からなることを特徴とする金属−セラミックス複合基板の製造方法：第３に、金属板とセラミックス基板とを接合させるろう材であって、その組成が、重量％で、Ｃｕ：５〜３０％，Ｔｉ：０.５〜４.５％，酸化チタン：０.２５〜０.９％，残部Ａｇからなることを特徴とするろう材：第４に、金属板とセラミックス基板とを接合させるろう材であって、その組成が、重量％で、Ｃｕ粉：５〜３０％，Ｔｉ粉：０.５〜４.５％，酸化チタン粉：０.２５〜０.９％，残部Ａｇ粉からなる粉体１００重量部に対し、１０〜１４重量部のビヒクルを添加混練してペースト状としたことを特徴とするろう材を提供するものである。
【０００９】
【発明の実施の形態】
本発明において使用するろう材の組成は、接着力を確保するために、Ｃｕ、Ｔｉ、酸化チタンの残部をＡｇで構成する。またＣｕ分は５〜３０重量％の範囲であるが、これは５重量％未満および３０重量％を超えると耐熱衝撃力が低下するため好ましくないからである。
【００１０】
本発明において使用し得る活性金属の添加形態としては金属体であるＴｉを用いる。添加量としては０.５〜４.５重量％の範囲が好ましい。これは０.５重量％未満では生成される窒化物層が少なくなり接着強度がなく、一方、４.５重量％を超えると逆に接着強度は高くなるものの、接合後にクラックが発生しやすいという欠点があるからである。
【００１１】
酸化チタンの形態としてはＴｉＯやＴｉＯ2 を用いて０．２５〜０．９重量％の範囲で添加される。また、これらは非晶質であっても結晶質のものであっても構わない。
【００１２】
これらの範囲の酸化チタンを上記組成のろう材に添加することによって耐ヒートサイクル性、抗折強度、たわみ量、通炉耐量等の特性向上に寄与することを本発明者の実験によって確認することができた。この理由として、ＴｉＯ2 はろう材中に均一に分散されることにより応力の集中が緩和されるためと考えられる。
【００１３】
ろう材組成として上記範囲の合金をそのまま、あるいは有機溶剤と混合してペースト状にして用いるが、この場合、金属部材とセラミックス部材を単に接合する場合には合金材を板状や箔状にして使用できる他、セラミックス基板上に電子回路を形成する場合には、ペーストろう材を用いた方が好ましい。
【００１４】
上記ペースト状ろう材は、テレピネオール、トルエン、メチルセロソルブ、エチルセロソルブ等の有機溶剤５５〜７５容量部と、ＰＭＭＡ、メチルセルローズ、エチルセルローズ等の有機結合剤２５〜４５容量部とを混合して得たビヒクルを、上記混合粉末１００重量部当り１０〜１４重量部の割合に添加して混練したものを用いた。
【００１５】
この場合１０〜１４重量部の割合としたのは、１０％以下だとペーストの粘度が高いため印刷時にかすれやすく、逆に１４％を越えるとペーストの粘度が低いため印刷に印刷形状が流れやすいことによる。
【００１６】
以下、実施例をもって詳しく説明するが本発明の範囲はこれらに限定されるものではない。
【００１７】
【実施例１】
セラミックス基板として５３×２９mmのＡｌＮ基板に、固形分がＡｇ粉 ７０．０重量％、Ｃｕ粉 ２７．０重量％、Ｔｉ粉 ２．５重量％、ＴｉＯ2 粉 ０．５重量％からなる粉体１００重量部に対して、１２．４重量部となるビヒクルを添加混練してろう材ペーストを全面塗布した後、金属板としての厚みが０．３mmと０．２５mmの銅板を重ねて接合炉中において８３０℃で焼成し、接合体を得た。
【００１８】
得られた接合体の特性を調べるため、ヒートサイクル特性、抗折強度、たわみ量および通炉耐量について試験を行い、その結果を表１に示した。
【００１９】
【比較例１】
実施例１と同様なＡｌＮ基板に、従来公知の固形分がＡｇ ７０重量％、Ｃｕ２７．５重量％、Ｔｉ ２．５重量％の金属活性ペーストろう材を用いた他は実施例１と同一条件で接合体（基板）を得、同様にヒートサイクル特性などの試験を行い結果を表１に示した。
【００２０】
【表１】
表１の結果から本発明によるろう材を用いて接合した接合基板のヒートサイクル性は従来のろう材を用いた基板の２倍以上の耐性を示し、抗折強度やたわみ量についてもヒートサイクル５０回以降の数値が従来のものに比し極めて高くなっていることが確認された。
【００２２】
【実施例２】
実施例１に示す金属板としての銅板の厚みを０．３mmと０．１５mmの２枚に代えた他は実施例１と全く同一の条件で接合基板を得、実施例１と同様の特性を試験しその結果を表２に示した。
【００２３】
【比較例２】
実施例２に示したＡｌＮ基板に、比較例１に示した従来公知のＡｇ−Ｃｕ−Ｔｉの合金ろう材を用いた他は実施例２と同じ条件で接合体（基板）を得、同様にヒートサイクル特性などの試験を行い結果を表２に示した。
【００２４】
【表２】
表２の結果から、本発明に基づくろう材を用いた場合の特性はいずれも公知のＡｇ−Ｃｕ−Ｔｉ合金ろう材を用いた場合よりも向上していることが判明した。
【００２６】
【実施例３】
実施例１に示した条件と同じ条件で接合して得た接合基板の銅板表面に所定の電子回路パターンをエッチングレジストにより形成させた後、塩化第二鉄を主成分とするエッチング液で銅の不要部分を除去し、次いでエッチングレジスト膜を除去することによって銅回路を有する窒化アルミニウム基板を形成した。
【００２７】
【実施例４】
ろう材へのＴｉＯ2の添加量によるピール強度を調べるため、ろう材組成をＡｇ ７０重量部、Ｃｕ ２７.５重量部、Ｔｉ ２.５重量部と一定としたろう材にＴｉＯ2の添加量を０、０.２５、０.５、０.７５、０.９、１.０重量部に変えて金属−セラミックス接合基板を得て、得られたピール強度の値を図１に、ヒートサイクル５０回後の抗折強度の値を図２に示した。この場合、ＴｉＯ 2 の添加量を重量％に換算すると、０重量部、０ . ２５重量部、０ . ５重量部、０ . ７５重量部、０ . ９重量部および１ . ０重量部は、それぞれ０重量％、０ . ２５重量％、０ . ５０重量％、０ . ７４重量％、０ . ８９重量％および０ . ９９重量％である。
【００２８】
ピール強度が１０kg/cm 以上である０．９重量％以下の範囲が好ましいことがわかった。
【００２９】
また、同様に図２の結果からＴｉＯ2 量 ０．２５重量％ではヒートサイクル５０回後の抗折強度が、銅厚０．３／０．１５（mm）の（実線で示す）場合は２７kgf/mm2 であり、銅厚０．３／０．２５（mm）の（一点鎖線で示す）場合は２２kgf/mm2 であり、実用的には、０．２５重量％以上であれば好ましいことがわかった。これら図１および図２の結果から、酸化チタンの量は０．２５〜０．９重量％が適正であることが判明した。
【００３０】
《参考例》
ろう材へのＴｉの添加量によるピール強度を調べるため、ろう材組成をＡｇ粉７０重量部、Ｃｕ粉 ２７.５重量部と一定とした銀銅ろう材に、活性金属としてＴｉ粉を０.５、１.０、１.５、２.０、２.５、３.０、４.０重量部に変えて金属−セラミックス接合基板を得て、得られたピール強度の値を図３に示した。この結果からＴｉ粉の適正添加量は、０.５〜４.０重量％が好ましいことが判明した。
【００３１】
【実施例６】
Ａｇ ７０.０重量部、Ｃｕ ２７.５重量部からなる合金ろう材を粉砕した後、Ｔｉ粉 ２.５重量部、ＴｉＯ2粉 ０.５重量部とを混合したものを加熱溶解して４成分の合金ろう材箔を得た。このろう材の組成を重量％に換算すると、Ａｇ ６９ . ６５重量％、Ｃｕ ２７ . ３６重量％、Ｔｉ粉 ２ . ４９重量％、ＴｉＯ 2 粉 ０ . ５０重量％である。これを５３×２９ｍｍのＡｌＮ基板の両面に接触させた後、金属板としての厚みが０.３ｍｍと０.２５ｍｍの銅板を重ねて接合炉中において焼成し、接合体を得た。
【００３２】
得られた接合体の特性を調べるため、ヒートサイクル特性、抗折強度、たわみ量および通炉耐量について試験を行い、その結果を表３に示した。
【００３３】
【実施例７】
Ａｇ粉 ７０.０重量部、Ｃｕ粉 ２７.５重量部、Ｔｉ粉 ２.５重量部、ＴｉＯ2粉 ０.５重量部からなる粉体を混合した後、加熱溶解して４成分系合金ろう材箔を得た。このろう材の組成を重量％に換算すると、Ａｇ ６９ . ６５重量％、Ｃｕ ２７ . ３６重量％、Ｔｉ粉 ２ . ４９重量％、ＴｉＯ 2 粉 ０ . ５０重量％である。この合金ろう材箔を用いた他は、実施例６に示す手段と同一な方法でヒートサイクル特性や抗折強度等を調べ、その結果を表３に併せて示した。
【００３４】
表３の結果から、実施例１〜実施例４に示す本発明ペーストろう材に比べると抗折強度やたわみ量が若干劣るものの、従来のろう材よりは諸特性がはるかに優れていることが判明した。
【００３５】
【表３】
【発明の効果】
以上説明したように、本発明のろう材は従来公知のＡｇ−Ｃｕ−Ｔｉ系ろう材に酸化物（酸化チタン）を適量添加することによってＡｇ−Ｃｕ−Ｔｉ−ＴｉＯ2 系ろう材として得られるので、これを用いて金属−セラミックス複合基板を製造することにより、ヒートサイクル性など大電力化に対応可能な特性が向上した複合基板とすることができる。
【図面の簡単な説明】
【図１】Ａｇ−Ｃｕ−Ｔｉ系ろう材におけるＴｉＯ2 の添加量と金属−セラミックス複合基板のピール強度との関係を調べたグラフである。
【図２】Ａｇ−Ｃｕ−Ｔｉ系ろう材におけるＴｉＯ2 の添加量と金属−セラミックス複合基板のヒートサイクル５０回後の抗折強度との関係を調べたグラフである。
【図３】Ａｇ−Ｃｕ−Ｔｉ系ろう材におけるＴｉ量を変化させた場合のヒートサイクル特性を調べたグラフである。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manufacturing method in which a metal and ceramics are bonded to form a composite substrate, and a brazing material excellent in bonding characteristics used for the bonding.
[0002]
[Prior art]
Conventionally, as a method of joining a copper plate as a metal and an aluminum nitride (AlN) substrate as a ceramic substrate, the activity disclosed in “Joint Method of Nitride Ceramics and Metal” described in JP-A-60-166165 A metal brazing method, a DBC method in which a copper plate and an aluminum nitride substrate surface are modified and joined directly (for example, Japanese Patent Laid-Open No. 56-163093) are known.
[0003]
Among these, the active metal brazing method has higher bonding strength than the DBC method, and the obtained bonded body has characteristics such as high durability against heat cycle. For example, it has been frequently used for joining a nitride ceramic substrate and a copper plate.
[0004]
Examples of the brazing material used in the active metal brazing method include a brazing material (Japanese Patent Laid-Open No. 60-166165) made of Ag—Cu—active metal (any one of Ti, Zr, and Hf), and Ag. An active metal paste material made of -Cu-titanium hydride (Japanese Patent Laid-Open No. 3-101153) has been put into practical use.
[0005]
[Problems to be solved by the invention]
Although it has been put to practical use to form a circuit board by bonding copper plates to the upper and lower surfaces of an aluminum nitride substrate using the above brazing material, the circuit board in recent years has a heat dissipation property to cope with the increase in power. In addition to electrical insulation, a substrate having higher strength and superior thermal shock has been desired.
[0006]
Accordingly, an object of the present invention is to provide a brazing material capable of improving various characteristic values as a power module substrate as compared with a conventional brazing material, and to provide a method for producing a metal-ceramic composite substrate using the brazing material. It is in.
[0007]
[Means for Solving the Problems]
As a result of intensive research aimed at achieving the above object, the present inventors have found that heat cycle resistance is improved when a specific oxide is added to the composition of a conventionally known active metal brazing material, and the present invention has been achieved.
[0008]
That is, according to the present invention, first, in a method of manufacturing a composite substrate by joining a metal plate and a ceramic substrate with a brazing material, the solid content is wt% , Cu: 5 to 30%, Ti : 0.5 to 0.5 4.5%, titanium oxide: 0.25 to 0.9% , the first step of applying a brazing material consisting of the balance Ag on the ceramic substrate, then a metal plate is stacked on the brazing material, and heated to join the metal A second step of obtaining a plate-ceramic substrate assembly, and a third step of forming a metal circuit by etching after forming a circuit pattern with an etching resist on a metal plate of the obtained joined body, Manufacturing method of metal-ceramic composite substrate: Second, in a method of manufacturing a composite substrate by joining a metal plate and a ceramic substrate with a brazing material, the solid content is wt% , Cu powder: 5-30%, Ti powder: 0 0.5 to 4.5%, titanium oxide powder: 0.25 to 0.9% , and 10 to 14 parts by weight of vehicle added to 100 parts by weight of powder consisting of the remaining Ag powder, and paste-like wax A first step of applying a material on a ceramic substrate, then a second step of superimposing a metal plate on the brazing material and heat-joining to obtain a metal plate-ceramic substrate assembly, and on the metal plate of the obtained joined body A metal-ceramic composite substrate manufacturing method comprising: a third step of forming a metal circuit by etching after forming a circuit pattern with an etching resist; and third, bonding a metal plate and a ceramic substrate It is a brazing filler metal whose composition is, by weight% , Cu: 5 to 30%, Ti : 0.5 to 4.5%, titanium oxide: 0.25 to 0.9% , and the balance Ag. Brazing material characterized by: Fourth , A brazing material for bonding the metal plate and the ceramics substrate, the composition is, in wt% Cu powder: 5 to 30% Ti powder: 0.5 to 4.5%, titanium oxide powder: 0. The present invention provides a brazing material characterized in that 10 to 14 parts by weight of a vehicle is added and kneaded to 100 parts by weight of a powder composed of 25 to 0.9% and the balance Ag powder .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
In the composition of the brazing material used in the present invention, the remainder of Cu, Ti, and titanium oxide is composed of Ag in order to ensure adhesion . Further, the Cu content is in the range of 5 to 30% by weight, but this is not preferable because the thermal shock resistance is reduced if it is less than 5% by weight or exceeds 30% by weight.
[0010]
As an addition form of the active metal that can be used in the present invention, Ti which is a metal body is used . The addition amount is preferably in the range of 0.5 to 4.5% by weight. If the amount is less than 0.5% by weight, the produced nitride layer is less and there is no adhesive strength. On the other hand, if it exceeds 4.5% by weight, the adhesive strength is increased, but cracks are likely to occur after joining. This is because there are drawbacks.
[0011]
As a form of titanium oxide, TiO or TiO 2 is added in a range of 0.25 to 0.9% by weight. These may be amorphous or crystalline.
[0012]
Confirm by experiments of the present inventor that the addition of titanium oxide in these ranges to the brazing material having the above composition contributes to improvement in properties such as heat cycle resistance, bending strength, deflection, and furnace resistance. I was able to. This is probably because TiO 2 is uniformly dispersed in the brazing material, thereby reducing the stress concentration.
[0013]
As the brazing material composition, the alloy in the above range is used as it is or mixed with an organic solvent to form a paste. In this case, when simply joining a metal member and a ceramic member, the alloy material is made into a plate or foil. In addition to being usable, when an electronic circuit is formed on a ceramic substrate, it is preferable to use a paste brazing material.
[0014]
The paste-like brazing material is obtained by mixing 55 to 75 parts by volume of an organic solvent such as terpineol, toluene, methyl cellosolve, ethyl cellosolve and 25 to 45 parts by volume of an organic binder such as PMMA, methyl cellulose, ethyl cellulose or the like. A vehicle was added and kneaded at a ratio of 10 to 14 parts by weight per 100 parts by weight of the mixed powder.
[0015]
In this case, the ratio of 10 to 14 parts by weight is that the viscosity of the paste is high when it is 10% or less, and it tends to fade during printing. Conversely, if it exceeds 14%, the viscosity of the paste is low and the printed shape tends to flow in printing. It depends.
[0016]
Hereinafter, although it demonstrates in detail with an Example, the scope of the present invention is not limited to these.
[0017]
[Example 1]
Powder consisting of an AlN substrate of 53 × 29 mm as a ceramic substrate, solid content of Ag powder 70.0% by weight, Cu powder 27.0% by weight, Ti powder 2.5% by weight, TiO 2 powder 0.5% by weight After adding 12.4 parts by weight of the vehicle to 100 parts by weight and kneading and coating the entire surface of the brazing material paste, the copper plates having thicknesses of 0.3 mm and 0.25 mm as metal plates are stacked in the joining furnace. And baked at 830 ° C. to obtain a joined body.
[0018]
In order to investigate the characteristics of the obtained joined body, tests were conducted with respect to heat cycle characteristics, bending strength, deflection amount and furnace resistance, and the results are shown in Table 1.
[0019]
[Comparative Example 1]
The same conditions as in Example 1 except that a conventionally known solid content of 70% by weight of Ag, 27.5% by weight of Cu, and 2.5% by weight of Ti was used for the AlN substrate similar to that in Example 1. Then, a joined body (substrate) was obtained. Similarly, tests such as heat cycle characteristics were conducted, and the results are shown in Table 1.
[0020]
[Table 1]
From the results of Table 1, the heat cycle property of the bonded substrate bonded using the brazing material according to the present invention is more than twice that of the conventional substrate using the brazing material, and the bending strength and the amount of deflection are also heat cycle 50. It was confirmed that the numerical value after the operation was extremely higher than the conventional one.
[0022]
[Example 2]
A bonded substrate was obtained under exactly the same conditions as in Example 1 except that the thickness of the copper plate as the metal plate shown in Example 1 was changed to two of 0.3 mm and 0.15 mm, and the same characteristics as in Example 1 were obtained. The results are shown in Table 2.
[0023]
[Comparative Example 2]
A bonded body (substrate) was obtained under the same conditions as in Example 2 except that a conventionally known Ag—Cu—Ti alloy brazing material shown in Comparative Example 1 was used for the AlN substrate shown in Example 2. Tests such as heat cycle characteristics were conducted and the results are shown in Table 2.
[0024]
[Table 2]
From the results of Table 2, it was found that the characteristics when using the brazing material according to the present invention were improved as compared with the case where the known Ag—Cu—Ti alloy brazing material was used.
[0026]
[Example 3]
After a predetermined electronic circuit pattern is formed by etching resist on the copper plate surface of the bonded substrate obtained by bonding under the same conditions as shown in Example 1, the copper solution is etched with an etching solution mainly containing ferric chloride. An unnecessary portion was removed, and then the etching resist film was removed to form an aluminum nitride substrate having a copper circuit.
[0027]
[Example 4]
To investigate the peel strength due to the addition amount of TiO 2 to the brazing material, 70 parts by weight of Ag brazing material composition, Cu 27.5 parts by weight, the addition amount of TiO 2 in the wax was fixed with Ti 2.5 weight member Is changed to 0, 0.25, 0.5, 0.75, 0.9, and 1.0 parts by weight to obtain a metal / ceramic bonding substrate, and the peel strength values obtained are shown in FIG. The value of the bending strength after 50 times is shown in FIG. In this case, when converting the amount of TiO 2 in weight%, 0 part by weight, 0.25 parts by weight, 0.5 parts by weight, 0.75 parts by weight, 0.9 parts by weight and 1, respectively. 0 part by weight, each 0 wt%, 0. 25% by weight, 0. 50 wt.%, 0.74 wt%, 0. 89 wt% and 0. 99 wt%.
[0028]
It has been found that a range of 0.9% by weight or less where the peel strength is 10 kg / cm 3 or more is preferable.
[0029]
Similarly, from the results shown in FIG. 2, when the TiO 2 content is 0.25% by weight, the bending strength after 50 heat cycles is 27 kgf when the copper thickness is 0.3 / 0.15 (mm) (indicated by the solid line). / mm 2, when the copper thickness 0.3 / 0.25 (mm) (shown by a dashed line) is 22 kgf / mm 2, is practically preferred that if 0.25 wt% or more I understood. From the results shown in FIGS. 1 and 2, it was found that the appropriate amount of titanium oxide was 0.25 to 0.9% by weight.
[0030]
《Reference example》
In order to investigate the peel strength depending on the amount of Ti added to the brazing filler metal, the brazing filler metal composition was made constant at 70 parts by weight of Ag powder and 27.5 parts by weight of Cu powder, and Ti powder as an active metal was reduced to 0.5%. 5, 1.0, 1.5, 2.0, 2.5, 3.0, 4.0 parts by weight were obtained to obtain a metal-ceramic bonding substrate, and the obtained peel strength values are shown in FIG. Indicated. From this result, it was found that the appropriate addition amount of Ti powder is preferably 0.5 to 4.0% by weight.
[0031]
[Example 6]
After pulverizing an alloy brazing material composed of 70.0 parts by weight of Ag and 27.5 parts by weight of Cu, a mixture of 2.5 parts by weight of Ti powder and 0.5 parts by weight of TiO 2 powder was dissolved by heating. A component alloy brazing foil was obtained. In terms of the composition of the brazing material by weight%, Ag 69. 65 wt%, Cu 27. 36 wt%, Ti powder 2.49 wt%, a TiO 2 powder 0.50 wt%. This was brought into contact with both surfaces of a 53 × 29 mm AlN substrate, and copper plates having a thickness of 0.3 mm and 0.25 mm as metal plates were stacked and fired in a joining furnace to obtain a joined body.
[0032]
In order to investigate the characteristics of the obtained joined body, tests were conducted with respect to heat cycle characteristics, bending strength, deflection amount and furnace resistance, and the results are shown in Table 3.
[0033]
[Example 7]
A powder composed of 70.0 parts by weight of Ag powder, 27.5 parts by weight of Cu powder, 2.5 parts by weight of Ti powder, and 0.5 parts by weight of TiO 2 powder is mixed and then melted by heating to dissolve the quaternary alloy braze. A material foil was obtained. In terms of the composition of the brazing material by weight%, Ag 69. 65 wt%, Cu 27. 36 wt%, Ti powder 2.49 wt%, a TiO 2 powder 0.50 wt%. Except for using this brazing alloy foil, the heat cycle characteristics, the bending strength, and the like were examined by the same method as that shown in Example 6, and the results are also shown in Table 3.
[0034]
From the results shown in Table 3, although the bending strength and the amount of deflection are slightly inferior to those of the paste solder of the present invention shown in Examples 1 to 4 , the properties are far superior to those of conventional brazing materials. found.
[0035]
[Table 3]
【The invention's effect】
As described above, the brazing material of the present invention can be obtained as an Ag-Cu-Ti-TiO 2 brazing material by adding an appropriate amount of oxide (titanium oxide) to a conventionally known Ag-Cu-Ti brazing material. Therefore, by manufacturing a metal-ceramic composite substrate using this, it is possible to obtain a composite substrate with improved characteristics such as heat cycle characteristics that can cope with high power.
[Brief description of the drawings]
FIG. 1 is a graph showing the relationship between the amount of TiO 2 added to a Ag—Cu—Ti brazing filler metal and the peel strength of a metal / ceramic composite substrate.
FIG. 2 is a graph showing the relationship between the amount of TiO 2 added to an Ag—Cu—Ti brazing material and the bending strength after 50 heat cycles of a metal / ceramic composite substrate.
FIG. 3 is a graph showing the heat cycle characteristics when the amount of Ti in the Ag—Cu—Ti brazing material is changed.
Claims (4)
Ｃｕ：５〜３０％，
Ｔｉ：０.５〜４.５％，
酸化チタン：０.２５〜０.９％，
残部Ａｇ
からなるろう材をセラミックス基板上に塗布する第１工程、次いで該ろう材上に金属板を重ね、加熱接合して金属板−セラミックス基板接合体を得る第２工程、および得られた接合体の金属板上にエッチングレジストにより回路パターンを形成した後、エッチング処理により金属回路を形成する第３工程からなることを特徴とする金属−セラミックス複合基板の製造方法。In a method of manufacturing a composite substrate by joining a metal plate and a ceramic substrate with a brazing material, the solid content is wt% ,
Cu: 5 to 30%,
Ti : 0.5 to 4.5%,
Titanium oxide: 0.25 to 0.9% ,
Remaining Ag
A first step of applying a brazing material comprising a ceramic substrate onto the ceramic substrate, then a second step of superimposing a metal plate on the brazing material and heat-joining to obtain a metal plate-ceramic substrate assembly, and A method for producing a metal-ceramic composite substrate, comprising a third step of forming a circuit pattern by etching resist on a metal plate and then forming a metal circuit by etching treatment.
Ｃｕ粉：５〜３０％，
Ｔｉ粉：０.５〜４.５％，
酸化チタン粉：０.２５〜０.９％，
残部Ａｇ粉
からなる粉体１００重量部に対し、１０〜１４重量部のビヒクルを添加混練して得たペースト状のろう材をセラミックス基板上に塗布する第１工程、次いで該ろう材上に金属板を重ね、加熱接合して金属板−セラミックス基板接合体を得る第２工程、および得られた接合体の金属板上にエッチングレジストにより回路パターンを形成した後、エッチング処理により金属回路を形成する第３工程からなることを特徴とする金属−セラミックス複合基板の製造方法。In a method of manufacturing a composite substrate by joining a metal plate and a ceramic substrate with a brazing material, the solid content is wt% ,
Cu powder: 5-30%,
Ti powder: 0.5 to 4.5%,
Titanium oxide powder: 0.25 to 0.9 percent,
A first step of applying a brazing filler material obtained by adding and kneading 10 to 14 parts by weight of a vehicle to 100 parts by weight of the powder made of the remaining Ag powder , and then the brazing A metal plate is stacked on the material and heated to join to obtain a metal plate-ceramic substrate assembly, and a circuit pattern is formed on the metal plate of the obtained assembly using an etching resist, followed by etching treatment to form a metal. A method for producing a metal-ceramic composite substrate, comprising a third step of forming a circuit.
Ｃｕ：５〜３０％，
Ｔｉ：０.５〜４.５％，
酸化チタン：０.２５〜０.９％，
残部Ａｇ
からなることを特徴とするろう材。A brazing material for joining a metal plate and a ceramic substrate, the composition of which is by weight%,
Cu: 5 to 30%,
Ti : 0.5 to 4.5%,
Titanium oxide: 0.25 to 0.9% ,
Remaining Ag
A brazing material characterized by comprising:
Ｃｕ粉：５〜３０％，
Ｔｉ粉：０.５〜４.５％，
酸化チタン粉：０.２５〜０.９％，
残部Ａｇ粉
からなる粉体１００重量部に対し、１０〜１４重量部のビヒクルを添加混練してペースト状としたことを特徴とするろう材。A brazing material for joining a metal plate and a ceramic substrate, the composition of which is by weight%,
Cu powder: 5-30%,
Ti powder: 0.5 to 4.5%,
Titanium oxide powder: 0.25 to 0.9 percent,
A brazing material characterized in that 10 to 14 parts by weight of a vehicle is added and kneaded to 100 parts by weight of the powder made of the remaining Ag powder .
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30385496A JP3896432B2 (en) | 1995-11-08 | 1996-10-30 | Method for producing metal-ceramic composite substrate and brazing material used therefor |
| US08/850,183 US5955686A (en) | 1996-10-30 | 1997-05-02 | Brazing materials for producing metal-ceramics composite substrates |
| EP97107391A EP0839598B1 (en) | 1996-10-30 | 1997-05-05 | Processes for producing metal-ceramics composite substrates and brazing materials for use in such processes |
| DE69710021T DE69710021T2 (en) | 1996-10-30 | 1997-05-05 | Method of manufacturing a ceramic-metal composite substrate and brazing material for use in this method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7-314691 | 1995-11-08 | ||
| JP31469195 | 1995-11-08 | ||
| JP30385496A JP3896432B2 (en) | 1995-11-08 | 1996-10-30 | Method for producing metal-ceramic composite substrate and brazing material used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09188582A JPH09188582A (en) | 1997-07-22 |
| JP3896432B2 true JP3896432B2 (en) | 2007-03-22 |
Family
ID=26563662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30385496A Expired - Lifetime JP3896432B2 (en) | 1995-11-08 | 1996-10-30 | Method for producing metal-ceramic composite substrate and brazing material used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3896432B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3682552B2 (en) * | 1997-03-12 | 2005-08-10 | 同和鉱業株式会社 | Method for producing metal-ceramic composite substrate |
| CA2630526A1 (en) | 2004-11-30 | 2006-08-31 | The Regents Of The University Of California | Joining of dissimilar materials |
| RU2403136C2 (en) * | 2004-11-30 | 2010-11-10 | Члены Правления Университета Калифорнии | Soldered system with matched thermal expansion factors (tef) |
| KR101431174B1 (en) * | 2012-05-25 | 2014-08-18 | 주식회사 케이씨씨 | Solder Paste And metal bonded Ceramic Substrates |
| JP2021159926A (en) * | 2020-03-31 | 2021-10-11 | Ｄｏｗａメタルテック株式会社 | Brazing filler metal and method of manufacturing the same, and metal-ceramic bonding substrate |
-
1996
- 1996-10-30 JP JP30385496A patent/JP3896432B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09188582A (en) | 1997-07-22 |
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