JPH11343179A - Brazing filler metal for ceramics-metal bonding - Google Patents
Brazing filler metal for ceramics-metal bondingInfo
- Publication number
- JPH11343179A JPH11343179A JP14729498A JP14729498A JPH11343179A JP H11343179 A JPH11343179 A JP H11343179A JP 14729498 A JP14729498 A JP 14729498A JP 14729498 A JP14729498 A JP 14729498A JP H11343179 A JPH11343179 A JP H11343179A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic
- brazing material
- alloy
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、酸化アルミニウム
質焼結体や窒化アルミニウム質焼結体等のセラミックス
に銅等の金属を接合するためのセラミックス−金属接合
用ろう材に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic-metal joining brazing material for joining a metal such as copper to a ceramic such as an aluminum oxide sintered body or an aluminum nitride sintered body.
【０００２】[0002]
【従来の技術】セラミックスと金属とを接合するセラミ
ックス−金属接合用ろう材として、Ａｇ−Ｃｕ合金とＴ
ｉやＺｒ、Ｈｆ等の活性金属とから成るろう材が知られ
ている。2. Description of the Related Art Ag-Cu alloy and T
A brazing material comprising an active metal such as i, Zr, and Hf is known.
【０００３】かかるＡｇ−Ｃｕ合金とＴｉやＺｒ、Ｈｆ
等の活性金属とから成るろう材によれば、Ａｇ−Ｃｕ合
金粉末とＴｉやＺｒ、Ｈｆ等の活性金属粉末とを含むろ
う材ペーストをセラミックスと金属との間に介在させ、
これを真空中または不活性雰囲気中で約800 ℃の温度に
加熱することにより、活性金属とセラミックスとの間で
反応層が形成されるとともにろう材と金属とが濡れるこ
とによってセラミックスと金属とが接合される。[0003] Such Ag-Cu alloy and Ti, Zr, Hf
According to the brazing material comprising an active metal such as, for example, a brazing material paste containing an Ag-Cu alloy powder and an active metal powder such as Ti, Zr, and Hf is interposed between the ceramic and the metal,
By heating this to a temperature of about 800 ° C in a vacuum or an inert atmosphere, a reaction layer is formed between the active metal and the ceramic, and the brazing material and the metal are wetted, so that the ceramic and the metal are separated. Joined.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、セラミ
ックスと金属とをろう材を介して接合した場合、酸化ア
ルミニウム質焼結体や窒化アルミニウム質焼結体等のセ
ラミックスと銅等の金属とでは、それぞれの熱膨張係数
が約４〜７×10-6／℃および約15〜20×10-6／℃と大き
く相違することから、両者間に大きな熱応力が発生す
る。However, when the ceramics and the metal are joined via a brazing material, the ceramics such as the aluminum oxide sintered body and the aluminum nitride sintered body and the metal such as copper are respectively different from each other. Has a large thermal stress between about 4 to 7 × 10 −6 / ° C. and about 15 to 20 × 10 −6 / ° C.
【０００５】ところが、上述のようなＡｇ−Ｃｕ合金と
ＴｉやＺｒ、Ｈｆ等の活性金属とから成るセラミックス
−金属接合用ろう材は、その応力吸収能力が十分ではな
い。[0005] However, the brazing filler metal for ceramics-metal joining comprising the Ag-Cu alloy as described above and an active metal such as Ti, Zr or Hf does not have sufficient stress absorbing ability.
【０００６】そして、このようなＡｇ−Ｃｕ合金とＴｉ
やＺｒ、Ｈｆ等の活性金属とから成るセラミックス−金
属接合用ろう材を介してセラミックスと金属とを接合す
ると、両者間に発生する大きな熱応力はろう材に吸収さ
れることなくセラミックスに内在してしまい、その結
果、このセラミックス−金属接合体に外力が印加される
と、この外力とセラミックスに内在する熱応力とが相乗
してセラミックスが容易に割れてしまうという欠点を有
していた。[0006] Such an Ag-Cu alloy and Ti
When a ceramic and a metal are joined via a ceramic-metal joining brazing material composed of an active metal such as Zr, Hr, or Hf, a large thermal stress generated between the two is inherent in the ceramic without being absorbed by the brazing material. As a result, when an external force is applied to the ceramic-metal bonded body, the external force and the thermal stress inherent in the ceramic are synergistically broken, so that the ceramic is easily broken.
【０００７】本発明は上記事情に鑑みて案出されたもの
であり、その目的は、応力吸収能力が高く、セラミック
ス−金属接合体が容易に割れてしまうことがないＡｇ−
Ｃｕ合金とＴｉやＺｒ、Ｈｆ等の活性金属とから成るセ
ラミックス−金属接合用ろう材を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a high stress-absorbing ability and to prevent the ceramic-metal joined body from being easily broken.
An object of the present invention is to provide a ceramic-metal joining brazing material comprising a Cu alloy and an active metal such as Ti, Zr, and Hf.
【０００８】[0008]
【課題を解決するための手段】本発明のセラミックス−
金属接合用ろう材は、Ａｇが60〜80重量％、Ｃｕが20〜
40重量％からなる合金80〜98重量％と、ＴｉもしくはＴ
ｉの水素化物１〜10重量％と、比表面積が2000〜10000
ｃｍ2 ／ｇのＭｏ、Ｗ粒子１〜10重量％とからなること
を特徴とするものである。Means for Solving the Problems Ceramics of the present invention
The brazing material for metal bonding is 60 to 80% by weight of Ag and 20 to 80% of Cu.
80-98% by weight of an alloy consisting of 40% by weight and Ti or T
1 to 10% by weight of a hydride of i and a specific surface area of 2000 to 10000
It is characterized by being composed of 1 to 10% by weight of Mo and W particles of cm 2 / g.
【０００９】本発明のセラミックス−金属接合用ろう材
によれば、ろう材中に比表面積が2000〜10000 ｃｍ2 ／
ｇのＭｏ、Ｗ粒子が１〜10重量％含有されていることか
ら、ろう材の応力吸収能力が大きい。According to the brazing filler metal for ceramic-metal bonding of the present invention, the specific surface area in the brazing filler metal is from 2000 to 10000 cm 2 /
Since 1 to 10% by weight of Mo and W particles are contained, the brazing filler metal has a large stress absorbing ability.
【００１０】[0010]
【発明の実施の形態】以下に、本発明のセラミックス−
金属接合ろう材の実施の形態の一例について説明する。BEST MODE FOR CARRYING OUT THE INVENTION The ceramic of the present invention is described below.
An example of the embodiment of the metal bonding brazing material will be described.
【００１１】本発明のセラミックス−金属接合用ろう材
においては、Ａｇが60〜80重量％、Ｃｕが40〜20重量％
のＡｇ−Ｃｕ合金粉末を80〜98重量％含有している。[0011] In the ceramic-metal joining brazing material of the present invention, Ag is 60 to 80% by weight and Cu is 40 to 20% by weight.
Ag-Cu alloy powder of 80 to 98% by weight.
【００１２】Ａｇ−Ｃｕ合金は、ろう材の主成分であ
り、Ａｇ−Ｃｕ合金中のＡｇが60重量％未満となりＣｕ
が40重量％を超えると、ろう材と金属との濡れ性が低下
して金属とろう材とを強固に接合することができなくな
り、また、Ａｇ−Ｃｕ合金中のＡｇが80重量％を超えＣ
ｕが20重量％未満となると、Ａｇが金属表面に這い上が
って金属の表面を清浄な状態とすることができなくなっ
てしまう。従って、Ａｇ−Ｃｕ合金はＡｇが60〜80重量
％、Ｃｕが40〜20重量％のものに特定される。The Ag-Cu alloy is a main component of the brazing filler metal, and the content of Ag in the Ag-Cu alloy is less than 60% by weight.
Exceeds 40% by weight, the wettability between the brazing material and the metal is reduced, so that the metal and the brazing material cannot be firmly joined, and the Ag in the Ag-Cu alloy exceeds 80% by weight. C
If u is less than 20% by weight, Ag crawls on the metal surface and the metal surface cannot be cleaned. Therefore, the Ag-Cu alloy is specified to have 60 to 80% by weight of Ag and 40 to 20% by weight of Cu.
【００１３】また、本発明のセラミックス−金属接合用
ろう材に含有されるＡｇ−Ｃｕ合金は、ろう材全体に対
して80重量％未満であるとろう材中にボイドが増えて金
属との接合強度が低下してしまい、98重量％を超えると
セラミックスに対するろう材の濡れ性が低下してセラミ
ックスとろう材との接合強度が低下してしまう。従っ
て、本発明のセラミックス−金属接合用ろう材における
Ａｇ−Ｃｕ合金の含有量は、ろう材全体に対して80〜98
重量％の範囲に特定される。When the content of the Ag-Cu alloy contained in the brazing filler metal for ceramics-metal bonding of the present invention is less than 80% by weight with respect to the whole brazing filler metal, voids increase in the brazing filler metal and the bonding with the metal becomes difficult. If the strength exceeds 98% by weight, the wettability of the brazing material with respect to the ceramic decreases, and the bonding strength between the ceramic and the brazing material decreases. Therefore, the content of the Ag-Cu alloy in the ceramic-metal joining brazing material of the present invention is 80 to 98 with respect to the entire brazing material.
It is specified in the range of weight%.
【００１４】さらに、本発明のセラミックス−金属接合
用ろう材に含有されるＴｉまたはＴｉの水素化物は、セ
ラミックスとの間に反応層を形成してセラミックスとろ
う材とを強固に接合させる作用をなし、ろう材全体に対
する含有量が１％未満では、セラミックスとの間に十分
な量の反応層を形成してセラミックスとろう材とを強固
に接合させることができず、また、10重量％を超えると
セラミックスとろう材との接合界面近傍に硬いＴｉ−Ｃ
ｕ反応層が多量に形成され、セラミックスと金属との間
に発生する応力を十分に吸収することができなくなって
しまう。従って、本発明のセラミックス−金属接合用ろ
う材に含有されるＴｉまたはＴｉの水素化物は、ろう材
全体に対して１〜10重量％の範囲に限定される。Further, Ti or a hydride of Ti contained in the brazing filler metal for ceramic-metal bonding of the present invention has a function of forming a reaction layer between the ceramic and the brazing filler metal and firmly bonding the ceramic and the brazing filler metal. None, if the content relative to the entire brazing material is less than 1%, a sufficient amount of reaction layer can be formed between the ceramic and the brazing material to make it impossible to firmly join the ceramic and the brazing material. If it exceeds, hard Ti-C near the joint interface between ceramic and brazing material
A large amount of the u-reaction layer is formed, and it becomes impossible to sufficiently absorb the stress generated between the ceramic and the metal. Therefore, the content of Ti or hydride of Ti contained in the brazing material for ceramic-metal bonding of the present invention is limited to the range of 1 to 10% by weight based on the whole brazing material.
【００１５】さらにまた、本発明のセラミックス−金属
接合用ろう材に含有されるＭｏまたはＷ粉末は、ろう材
の応力吸収能力を高める作用をなし、その含有量がろう
材全体に対して１重量％未満であるとろう材の応力吸収
能力を十分に高めることができなくなり、また、10重量
％を超えるとろう材の濡れ性が低下するとともにろう材
中にボイドが多量に形成され、セラミックスと金属とを
強固に接合することができなくなる。従って、本発明の
セラミックス−金属接合用ろう材に含有されるＭｏまた
はＷ粉末の含有量は、ろう材全体に対して１〜10重量％
の範囲に特定される。Further, the Mo or W powder contained in the brazing filler metal for ceramics-metal bonding of the present invention has an effect of increasing the stress absorbing ability of the brazing filler metal, and its content is 1 wt. If the content is less than 10% by weight, the stress absorbing ability of the brazing material cannot be sufficiently increased. If the content exceeds 10% by weight, the wettability of the brazing material decreases, and a large amount of voids are formed in the brazing material. It becomes impossible to firmly join the metal. Therefore, the content of Mo or W powder contained in the brazing filler metal for ceramic-metal joining of the present invention is 1 to 10% by weight based on the whole brazing filler metal.
Specified in the range.
【００１６】また、本発明のセラミックス−金属接合用
ろう材に含有されるＭｏまたはＷ粉末は、その比表面積
が2000ｃｍ2 ／ｇ未満であるとろう材の応力吸収能力を
十分に高めることができず、また、10000 ｃｍ2 ／ｇを
超えるとＭｏまたはＷ粉末とＴｉとが反応することによ
りＴｉとセラミックスとの反応層の形成が阻害されてセ
ラミックスとろう材との接合力が低下してしまう。従っ
て、本発明のセラミックス−金属接合用ろう材に含有さ
れるＭｏまたはＷ粉末は、その比表面積が2000〜10000
ｃｍ2 ／ｇの範囲に特定される。When the specific surface area of the Mo or W powder contained in the brazing filler metal for ceramic-metal bonding of the present invention is less than 2000 cm 2 / g, the stress absorbing ability of the brazing filler metal can be sufficiently increased. If it exceeds 10,000 cm 2 / g, the reaction between Mo or W powder and Ti will inhibit the formation of a reaction layer between Ti and ceramics, and the bonding strength between ceramics and brazing material will be reduced. . Therefore, the Mo or W powder contained in the ceramic-metal joining brazing material of the present invention has a specific surface area of 2000 to 10,000.
It is specified in the range of cm 2 / g.
【００１７】[0017]
【実施例】粒径が５μｍのＡｇ−Ｃｕ合金粉末と、粒径
が３μｍの水素化ＴｉまたはＴｉ粉末と、比表面積が20
00〜10000 ｃｍ2 ／ｇのＭｏまたはＷ粉末とを表１に示
す割合となるようにして秤量し、これに有機溶剤として
のαテルピネオールとバインダとしてのエチルセルロー
スを添加混合して、セラミックス−金属接合用ろう材の
試料ペーストを得た。EXAMPLE An Ag--Cu alloy powder having a particle size of 5 .mu.m, hydrogenated Ti or Ti powder having a particle size of 3 .mu.m, and a specific surface area of 20 .mu.m.
A Mo or W powder of 100 to 10,000 cm 2 / g was weighed so as to have a ratio shown in Table 1, and α-terpineol as an organic solvent and ethyl cellulose as a binder were added and mixed. A sample paste of the brazing filler metal was obtained.
【００１８】次に、図１に断面図で示すように、純度96
％で長さ50ｍｍ×幅10ｍｍ×厚さ0.635 ｍｍのアルミナ
セラミックス板１の上面に前記ろう材の試料ペースト２
を長さ45ｍｍ×幅８ｍｍ×厚さ30μｍのパターンで印刷
塗布するとともに、下面に同じ試料ペースト２を長さ22
ｍｍ×幅８ｍｍ×厚さ30μｍのパターンで２個、間に１
ｍｍの間隔をあけてスクリーン印刷法により印刷塗布し
た後、これらのろう材ペースト２上に、長さおよび幅が
これらのろう材ペースト２のパターンと同じ大きさで厚
さが0.25ｍｍの銅からなる金属板３を載置し、これを真
空雰囲気中820℃で30分間焼成して、アルミナセラミッ
クス板１の両面に銅からなる金属板３がろう材２を介し
て接合されたサンプルを３個ずつ得た。Next, as shown in the sectional view of FIG.
% On the upper surface of an alumina ceramic plate 1 having a length of 50 mm × a width of 10 mm × a thickness of 0.635 mm.
In a pattern of 45 mm length × 8 mm width × 30 μm thickness, and the same sample paste 2 having a length of 22 mm
2 pieces in a pattern of mm × width 8mm × thickness 30μm, 1 between
After printing and applying by a screen printing method at intervals of mm, on these brazing material pastes 2, copper having a length and a width equal to the pattern of these brazing material pastes 2 and a thickness of 0.25 mm was used. The metal plate 3 made of copper is baked at 820 ° C. for 30 minutes in a vacuum atmosphere, and three pieces of the metal plate 3 made of copper are bonded to both surfaces of the alumina ceramic plate 1 via the brazing material 2. I got each.
【００１９】そして、これらのサンプルについて、図１
中に矢印で示す３点において３点曲げ試験を行ない、サ
ンプルの抗折強度を求めた。その平均値を表１に示す。FIG. 1 shows these samples.
A three-point bending test was performed at three points indicated by arrows therein, and the bending strength of the sample was determined. Table 1 shows the average value.
【００２０】なお、表１中、＊印を付した試料は、本発
明と比較するための比較例であり、本発明の範囲外のも
のである。The samples marked with * in Table 1 are comparative examples for comparison with the present invention and are outside the scope of the present invention.
【００２１】[0021]
【表１】 [Table 1]
【００２２】[0022]
【発明の効果】表１から分かるように、本発明のセラミ
ックス−金属接合用ろう材によれば、本発明のセラミッ
クス−金属接合用ろう材によりセラミックスと金属とが
接合されたサンプルの抗折強度はいずれも35ｋｇｆ／ｍ
ｍ2 以上と強く、セラミックス−金属接合体に大きな抗
折強度を付与することができる。As can be seen from Table 1, according to the ceramic-metal joining brazing material of the present invention, the transverse rupture strength of a sample in which ceramic and metal are joined by the ceramic-metal joining brazing material of the present invention. Are all 35kgf / m
m 2 or more, and can provide a large bending strength to the ceramic-metal joined body.
【００２３】以上により、本発明によれば、応力吸収能
力が高く、セラミックス−金属接合体が容易に割れてし
まうことがないセラミックス−金属接合用ろう材を提供
することができた。As described above, according to the present invention, it was possible to provide a ceramic-metal joining brazing material which has a high stress absorbing ability and does not easily break the ceramic-metal joint.
【図１】本発明のセラミックス−金属接合用ろう材を用
いてセラミックスと金属とを接合したサンプルを示す断
面図である。FIG. 1 is a cross-sectional view showing a sample in which ceramic and metal are joined using the ceramic-metal joining brazing material of the present invention.
１・・セラミックス ２・・ろう材 ３・・金属 1. Ceramics 2. Brazing material 3. Metal
Claims (1)
４０重量％からなる合金８０〜９８重量％と、Ｔｉもし
くはＴｉの水素化物１〜１０重量％と、比表面積が２０
００〜１００００ｃｍ2 ／ｇのＭｏまたはＷ粒子１〜１
０重量％とからなることを特徴とするセラミックス−金
属接合用ろう材。1. Ag is 60-80% by weight, Cu is 20-80% by weight.
80 to 98% by weight of an alloy comprising 40% by weight, 1 to 10% by weight of Ti or a hydride of Ti,
Mo or W particles of 1 to 10000 cm 2 / g
0% by weight of a brazing material for ceramic-metal bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14729498A JPH11343179A (en) | 1998-05-28 | 1998-05-28 | Brazing filler metal for ceramics-metal bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14729498A JPH11343179A (en) | 1998-05-28 | 1998-05-28 | Brazing filler metal for ceramics-metal bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11343179A true JPH11343179A (en) | 1999-12-14 |
Family
ID=15426965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14729498A Pending JPH11343179A (en) | 1998-05-28 | 1998-05-28 | Brazing filler metal for ceramics-metal bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11343179A (en) |
Cited By (5)
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| CN102448663A (en) * | 2009-05-27 | 2012-05-09 | 京瓷株式会社 | Solder material, heat dissipation base using same, and electronic device |
| JP2013086171A (en) * | 2011-10-21 | 2013-05-13 | Nhk Spring Co Ltd | Brazing filler metal for atmospheric joining, and joined body |
| US20160021752A1 (en) * | 2014-07-16 | 2016-01-21 | Seiko Epson Corporation | Package base, package, electronic device, electronic apparatus, and moving object |
| CN107112246A (en) * | 2014-12-26 | 2017-08-29 | 汉高股份有限及两合公司 | Sintered jointing material and the semiconductor device using the sintered jointing material |
| CN114853497A (en) * | 2022-04-29 | 2022-08-05 | 南京中江新材料科技有限公司 | Active metal brazing copper-clad ceramic substrate and preparation method thereof |
-
1998
- 1998-05-28 JP JP14729498A patent/JPH11343179A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102448663A (en) * | 2009-05-27 | 2012-05-09 | 京瓷株式会社 | Solder material, heat dissipation base using same, and electronic device |
| US9012783B2 (en) | 2009-05-27 | 2015-04-21 | Kyocera Corporation | Heat dissipation base and electronic device |
| JP2013086171A (en) * | 2011-10-21 | 2013-05-13 | Nhk Spring Co Ltd | Brazing filler metal for atmospheric joining, and joined body |
| US20160021752A1 (en) * | 2014-07-16 | 2016-01-21 | Seiko Epson Corporation | Package base, package, electronic device, electronic apparatus, and moving object |
| CN105322910A (en) * | 2014-07-16 | 2016-02-10 | 精工爱普生株式会社 | Package base, package, electronic device, electronic apparatus, and moving object |
| US9769934B2 (en) * | 2014-07-16 | 2017-09-19 | Seiko Epson Corporation | Package base, package, electronic device, electronic apparatus, and moving object |
| CN107112246A (en) * | 2014-12-26 | 2017-08-29 | 汉高股份有限及两合公司 | Sintered jointing material and the semiconductor device using the sintered jointing material |
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